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Automation in action at the latest PackExpo show

Richard Bloss (Associate Editor, Assembly Automation)

Assembly Automation

ISSN: 0144-5154

Article publication date: 26 July 2013




This paper aims to provide a review of the most recent PackExpo show in Chicago with emphasis on the new automation innovations and applications on display.


In‐depth interviews are carried out with exhibitors of automated packaging machinery at the show.


Automation continues to address an ever‐increasing number of packaging tasks.

Practical implications

Customers may be surprised at the extent to which automation innovations are available and the new applications that are being addressed.


This paper is a review of some of the latest packaging automation innovations and applications that one might have seen if they had been on the exhibition floor at the most recent Chicago PackExpo show.



Bloss, R. (2013), "Automation in action at the latest PackExpo show", Assembly Automation, Vol. 33 No. 3, pp. 207-213.



Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited

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