Recycling of Printed Wiring Boards with Mounted Electronic Components

Abstract

Recycling technology for printed wiring boards (PWBs) with mounted electronic components was studied for the purpose of disassembling the boards, recovering useful materials, and reusing these materials. An automatic removal method was developed for the electronic components on the basis of a combination of heating to above the solder melting temperature and applying impacting the shearing forces. Most of the electronic components were recovered undamaged and the solder was able to be recovered as particles. The solder remaining on the board was recovered by abrading the board surface and by using a heating‐impacting process. After these processes, the resin board (a cured epoxy resin board reinforced with glass fibre)was pulverised and separated into a copper‐rich powder (copper: 82 Wt%) and a glass fibre and resin mixture powder (glass fibre‐resin powder) by gravimetric and electrostatic methods. The recovered electronic components, solder and copper‐rich powder were used as valuable metal resources for refining. Moreover, the recovered glass fibre‐resin powder was found to be a useful filler for plastic products such as epoxy resin and ABS (acrylonitrile/butadiene/styrene copolymer) resin.

Citation

Iji, M. and Yokoyama, S. (1997), "Recycling of Printed Wiring Boards with Mounted Electronic Components", Circuit World, Vol. 23 No. 3, pp. 10-15. https://doi.org/10.1108/03056129710370196