Methods for dissipating heat from RF circuit boards

Markus Wille (RUWEL GmbH, Wetter, Germany)

Circuit World

ISSN: 0305-6120

Publication date: 8 February 2008

Abstract

Purpose

The purpose of this paper is to present methods for dissipating heat from RF circuit boards.

Design/methodology/approach

The paper describes various models developed by RUWEL in this respect.

Findings

The integration of heat removal systems in the structure of printed circuit boards is a proven and reliable technique, and ideally suitable for RF circuit boards.

Originality/value

In addition to using conductive adhesive films to bond RF circuit boards to heat sinks, new methods have been developed to integrate local heat removal systems in the form of Cu coins. These techniques give the circuit designer flexibility in terms of board design and choice of materials. The models presented are already being used for various RF components in base stations for cellular telephone networks and WiMax services.

Keywords

Citation

Wille, M. (2008), "Methods for dissipating heat from RF circuit boards", Circuit World, Vol. 34 No. 1, pp. 32-34. https://doi.org/10.1108/03056120810848770

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited

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