Modeling of multi‐layer circuit boards by using a model of bi‐phase and elasto‐plastic plies

Abstract

Purpose

The paper aims to present a modeling method for multi‐layer, multi‐material printed circuit boards (PCBs) in both micro‐structure and board levels.

Design/methodology/approach

The method incorporates a multilayer finite element model that is established in two parts: the first part is an elasto‐plastic damaging model, which is presented to model metallic plies in the multi‐layer PCBs, while the second is a bi‐phase model for glass‐fiber/epoxy‐resin composite ply with fiber/matrix structure.

Findings

Numerous composite parts and complex material properties of multi‐layer PCBs complicate the reliability of the simulation. Therefore, the board level simulation and the micro‐structure modeling cannot be performed at the same time. A multi‐layer FEM code can solve this problem: with the use of bi‐phase and elasto‐plastic plies in this code, the micro‐structure and board‐level modeling for multi‐layer PCBs can be incorporated.

Research limitations/implications

With the implementation of a virtual boundary method, the current multi‐layer model can be combined with the unit‐cell modeling method to perform detailed analysis at the micro‐structure level.

Originality/value

This paper presents a method for multi‐layer PCB modeling at both the micro‐structure and board levels. It provides a way to individually design the fabric types and the properties of glass fibers, epoxy resin, and copper foil in PCBs, to meet specific reliability requirements. With the proposed modeling, the static and shock responses of optimized PCBs can be analyzed with less computation.

Citation

Low, K.H. and Wang, Y. (2007), "Modeling of multi‐layer circuit boards by using a model of bi‐phase and elasto‐plastic plies", Circuit World, Vol. 33 No. 3, pp. 9-20. https://doi.org/10.1108/03056120710776979