An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards

Abstract

The ChemicalVia process, patented by CERN, provides a new method of making microvias in high‐density multilayer printed circuit boards of different types, such as sequential build‐up (SBU), high density interconnected (HDI), or laminated multi‐chip modules (MCM‐L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes.

Citation

da Silva, V., de Oliveira, R., Watts, D. and van der Bij, E. (2004), "An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards", Circuit World, Vol. 30 No. 4, pp. 27-33. https://doi.org/10.1108/03056120410539885