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Erratum

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 March 1997

665

Abstract

This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/09540919610777717. When citing the article, please cite: P. Swanson, (1996), “Case Histories of Radiation Curing for Electronic Packaging”, Soldering & Surface Mount Technology, Vol. 8 Iss: 3, pp. 19 - 24.

Citation

(1997), "Erratum", Assembly Automation, Vol. 17 No. 1, pp. 23-33. https://doi.org/10.1108/01445159710163418

Publisher

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MCB UP Ltd

Copyright © 1997, Company

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