Automated dispensing in surface mount assembly

Philip Stokes (Dage Precision Industries Ltd, Buckingham, UK)

Assembly Automation

ISSN: 0144-5154

Publication date: 1 December 1996

Abstract

Explains how automated dispensers are used to deposit surface mount device adhesives, and solder paste and other “fluids”. Looks at the features and capabilities of today’s equipment and dispenses advice on using it effectively.

Keywords

Citation

Stokes, P. (1996), "Automated dispensing in surface mount assembly", Assembly Automation, Vol. 16 No. 4, pp. 30-33. https://doi.org/10.1108/01445159610151025

Download as .RIS

Publisher

:

MCB UP Ltd

Copyright © 1996, MCB UP Limited

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