Adhesives in electronic and electrical assembly

Abstract

Purpose

The purpose of this paper is to report on various adhesives and their uses in the electronics industry.

Design/methodology/approach

A description of the different types of adhesives and their strengths and weaknesses is followed by illustrations of their applications in electronic and electrical assembly. Equipment and procedures for cleaning and surface preparation are presented, and the paper finishes with an examination of techniques for rework and repair.

Findings

Polymers form the body of an adhesive, but other elements may be included to control electrical and heat conduction, light absorption and cross‐bonding behaviour. This makes them highly controllable and adaptable to specialised requirements. Photo‐curable adhesives with cure times of under 1 s are available for fast‐throughput assembly. Polymer underfills are increasingly important for shock‐proofing handheld electronics. Adhesives and cleaning agents are becoming environmentally safer.

Originality/value

The paper reveals the versatility of polymer adhesives and names suppliers.

Citation

Connolly, C. (2008), "Adhesives in electronic and electrical assembly", Assembly Automation, Vol. 28 No. 4, pp. 289-294. https://doi.org/10.1108/01445150810904431