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The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

The purpose of this paper is to explore the use of binder jetting to fabricate high-purity copper parts. The ability to fabricate geometrically complex copper shapes would have implications on the design and manufacture of components for thermal management systems and structural electronics.

To explore the feasibility of processing copper via binder jetting, the authors followed an established material development process that encompasses powder selection and tuning process parameters in printing and thermal cycles. Specifically, the authors varied powder size and sintering cycles to explore their effects on densification.

Three differently sized copper powders were successfully printed, followed by sintering in a reducing atmosphere. It was found that a 15-μm-diameter powder with a sintering cycle featuring a 1,080°C maximum temperature provides the most dense (85 per cent) and pure (97 per cent) final copper parts of the parameters tested.

Due to powder-based additive manufacturing techniques’ inherent limitations in powder packing and particle size diameter, there are difficulties in creating fully dense copper parts. To improve thermal, electrical and mechanical properties, future work will focus on improving densification.

The paper demonstrates the first use of binder jetting to fabricate copper artifacts. The resulting copper parts are denser than what is typically found in binder jetting of metal powders (without infiltration); significant opportunity remains to further optimize the manufacturing process by introducing novel techniques to tailor the material properties for thermal/electrical applications.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

The purpose of this paper is to solve solidification of liquid copper saturated in porous structure fabricated by sintered steel particles using a temperature‐transforming model (TTM).

The convection in the liquid region is modeled using Navier‐Stokes equation with Darcy's term and Forchheimer's extension. The effect of natural convection is considered using the Boussinesq approximation. For the solid region, the velocity is set to zero by the Ramped Switch‐Off Method (RSOM). The model was validated by comparing the results with existing experimental and numerical results with gallium as phase change material and packed glass beads as porous structure. Solidification of liquid copper saturated in sintered copper particles is then simulated and the effects of various parameters on solidification process were studied.

The results indicate that the stronger convection effects are shown for the cases with high Raleigh number or high Darcy's number. However, when either Raleigh number or Darcy's number is reduced to below a certain order of magnitude, the solidification becomes conduction‐controlled.

This work is the first application of the TTM to solve solidification in porous media, which can find its application in post‐processing of laser sintered parts.

The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.

In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.

When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.

The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.

The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.

The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.

The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.

The purpose of this study is to investigate the effect of the sintering temperature on the microstructural, mechanical and physical properties of Cu-SiC composites.

The powder metallurgy route was used to fabricate the samples. Cold compaction of powders was conducted at 250 MPa which was followed by sintering at 850°C–950°C at the interval of 50 °C in the open atmospheric furnace. SiC was used as a reinforcement and the volumetric fraction of the SiC was varied as 10%, 15% and 20%. The processed samples were metallurgically characterized by the scanning electron microscope (SEM). Mechanical characterization was done using tensile and Vickers’ micro-hardness testing to check the hardness and strength of the samples. Archimedes principle and Four-point collinear probe method were used to measure the density and electrical resistivity of the samples.

SEM micrograph reveals the uniform dispersion of the SiC particles in the Cu matrix element. The results revealed that the Hardness and tensile strength were improved due to the addition of SiC and were maximum for the samples sintered at 950 °C. The addition of SiC has also increased the electrical resistivity of the Cu-SiC composite and was lowest for Cu 100% while the relative density has shown the reverse trend. Further, it was found that the maximum hardness of 91.67 Hv and ultimate tensile strength of 312.93 MPa were found for Cu-20% SiC composite and the lowest electrical resistivity of 2.017 µ- Ω-cm was found for pure Cu sample sintered at 950 °C, and this temperature was concluded as the optimum sintering temperature.

The powder metallurgy route for the fabrication of the composites is a challenging task as the trapping of oxygen cannot be controlled during the compaction process as well as during the sintering process. So, a more intensive study is required to overcome these kinds of limitations.

As of the author’s best knowledge, no work has been reported on the effect of sintering temperature on the properties of the Cu-SiC composites which has huge potential in the industries.

Phosphating mild steel causes the surface to be etched into a network of microscopic channels 0.0004 to 0.0008 in. deep, the phosphate crystals being located on the intervening high spots. With this type of surface, running‐in is both rapid and safe and low friction conditions are soon established. The phosphate crystals do not act as a solid lubricant in the same sense as graphite or M0S2; initial friction is higher and final friction is much lower. Friction of MoS2, for example decreases with rubbing by a factor of 4, from 0.2 to 0.05, whereas the friction of phosphated steel decreased by a factor of 60, from 0.3 to 0.005. In addition, the final friction of the run‐in phosphated surface depended on temperature and pressure in a manner characteristic of ‘thin film’ fluid lubrication, not ‘boundary’ or ‘solid’ lubrication.