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As the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.

The present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.

Typical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.

In addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

There is increasing customer demand for materials with low dissipation factors for reduced loss along the traces and low dielectric constants for higher signal propagation speeds. High performance epoxies such as Nelco's N4000‐13, Isola's FR408 and General Electric's GETEK (similar to Matsushita's MEGTRON) have become essential for boards operating in the higher frequency range. For applications at the highest frequencies material choices are very limited. These materials, tailored for high frequency use, have disadvantages – either with their thermomechanical properties or with their processability. Recently, a number of new “high frequency” or “low loss” materials have been introduced by different suppliers. In an overall relatively small but growing market, these materials have to demonstrate their advantages – from an electrical, thermomechanical, processing, fabrication quality and/or cost standpoint when compared to the established materials. This paper compares the thermomechanical performance and fabrication quality of new “high frequency”/“low loss” base materials.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

The purpose of this paper is to discuss nickel gold plating of PCB traces and its adverse effects on signal integrity, and to explore the other key drivers in optimising yields and controlling PCB processes that impinge on signal integrity.

The paper is a response to requests from PCB fabricators to explain why the losses on impedance controlled traces on PCBs were sometimes higher than expected.

While nickel is acceptable on short lengths of pad to accommodate gold plating, plating the whole trace length is generally not good practice from a digital signal integrity perspective. In addition, with the fastest serial transmission rates in the 10 to 20 GHz region and long serial words in some situations designers may need to consider both the associated high and low frequency performance.

With the development of ultra high speed digital bus architectures, PCB fabricators will appreciate the need to add an understanding of the drivers of insertion loss (base material loss tangent data, foil roughness and copper cross sectional areas) to their existing experience of architectures with minimal losses.

This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu) electrolyte solutions to improve plating efficiencies through enhanced ion transportation.

The impact of MS-assisted agitation on topographical properties of the electroplated surfaces was studied through a design of experiments by measuring surface roughness, which is characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high-resolution scanning electron microscopy.

An increase in Ra from 400 to 760 nm after plating was recorded for an increase in acoustic power from 45 to 450 W. Roughening increased because of micro-bubble cavitation energy and was supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low currents, leading to large Cu grain frosting and reduction in the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, were also observed to reduce the uniformity of the deposit.

The formation of unstable transient cavitation and variation of the topology of the Cu surface are unwanted phenomena. Further plating studies using MS agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented.

This study can help identify manufacturing settings required for high-quality MS-assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique.

This study quantifies the topographical changes to a PCB surface in response to MS agitation and evidence for deposited Cu artefacts due to acoustic effects.

The purpose of this paper is to develop a novel technique for the pre-design of a printed circuit board (PCB) of a DC-DC power converters where the placement of electric components can cancel the electromagnetic emissions through subtractive coupling and in this sense to minimize the stray magnetic and electric fields at a specific location. For this work the location of interest is a current transducer used for control purposes positioned in the center of a DC-DC Cuk converter board as a constrain.

The methodology of design is based on the development of an interface software platform through MatLab script coding which interconnects the solution of a numerical analysis software and an optimization technique. The numerical analysis software is based on finite element calculations where quasi-static field analysis are performed to calculate the radiated electric and magnetic fields. The optimization technique is conducted by genetic algorithms (GAs).

The results for the proposed procedure for PCB design show a significant reduction in radiated electromagnetic (EM) field at the susceptible device in the PCB. Even when the optimization procedure is applied only for the sensor center, the field reduction is extended for a wide region around the sensor. The proposed technique not only reduces the fundamental field component but also all the harmonic contents for the electromagnetic field. It is demonstrated that it is possible to cancel the emissions by means of varying the location and orientation of the passive elements avoiding the utilization of electromagnetic interference filters and complex modulations.

The novelty of the design procedure falls in the fitness function programming where an interface software platform is built through MatLab scripting to connect a 3D-FE analysis and the GA. The finite element analysis address the radiated EM calculation while the GA focus in the minimization of it. This computational platform has the flexibility to be easily adapted for the PCB design of any power electronic converter where the radiated EM compliance is required as well as extended to perform emissions minimization outside or/and inside the PCB.

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs).

Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S₂₁) in high-speed PCB.

The study showed that the insertion loss (S₂₁) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist.

This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.

The purpose of this paper is to present an update and the latest results from work on high aspect ratio “multiple wire” microvias in porous flexible Kapton foils for printed circuit boards (PCBs).

Kapton foils are made porous by ion track technology and dry resist patterning. In combination with thin film deposition and electroplating the technology is used to define circuits and sensors with microvias made of many individual high aspect ratio wires. The processes are within the reach of many production environments and are suitable for flexible PCB fabrication.

The use of these novel processes enables new types of microvias and multiple wire structures in the foils for millimeter wave circuitry of substrate integrated waveguides and shielding, as well as for sensors with high thermal resistance.

Today, through foil electroplating is fairly slow and more work should be made with copper electroplating. Ion track technology works well on polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI) but should also be studied for novel polymer foils such as liquid crystal polymers (LCPs).

The paper details how ion track and PCB technology can be combined to enable a new type of through the foil via interconnect that consists of a multitude of wires. With these porous substrates, double‐sided circuits with high aspect ratio microvias and other multiple wire structures can be created using only lithography, thin film deposition, and electroplating. A new type of electrothermal sensorfoil is presented with several advantages over its competing micro electro mechanical systems (MEMS) based Si sensors.

Modern electronics is characterised by the increasing level of integration in printed circuit board (PCB) technology and the reduced insulation spacing between adjacent conductors. Surface insulation resistance (SIR) measurement has often been used alone to determine the cleanliness of PCB assembly; however, when proper SIR measurement is used in conjunction with surface leakage current (SLC) measurement, the result can reveal the dynamic nature of surface electrochemical migration (SECM) processes at the microscopic level, and the effect of such processes on product quality and reliability. This paper presents a newly developed measurement methodology, which measures SLC per square unit area at a sampling rate that is orders of magnitude higher than that of conventional SIR measurement methods. It is aimed to capture the transient surge of SLC which is detrimental to the functionality of product.