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This study aims to investigate the fatigue crack propagation behavior of SiC particle-reinforced 2124 Al alloy composites under constant amplitude axial loading at a stress ratio of R = 0.1. For this purpose, it is performed experiments and comparatively analyze the results by producing 5, 10, 15 Vol.% SiCp-reinforced composites and unreinforced 2124 Al alloy billets with powder metallurgy (PM) production technique.

With the PM production technique, SiCp-reinforced composite and unreinforced 2124 Al alloy billets were produced at 5%, 10%, 15% volume ratios. After the produced billets were extruded and 5 mm thick plates were formed, tensile and fatigue crack propagation compact tensile (CT) samples were prepared. Optical microscope examinations were carried out to determine the microstructural properties of billet and samples. To determine the SiC particle–matrix interactions due to the composite microstructure, unlike the Al alloy, which affects the crack initiation life and crack propagation rate, detailed scanning electron microscopy (SEM) studies have been carried out.

Optical microscope examinations for the determination of the microstructural properties of billet and samples showed that although SiC particles were rarely clustered in the Al alloy matrix, they were generally homogeneously dispersed. Fatigue crack propagation rates were determined experimentally. While the highest crack initiation resistance was achieved at 5% SiC volume ratio, the slowest crack propagation rate in the stable crack propagation region was found in the unreinforced 2124 Al alloy. At volume ratios greater than 5%, the number of crack initiation cycles decreases and the propagation rate increases.

As a requirement of damage tolerance design, the fatigue crack propagation rate and fatigue behavior of materials to be used in high-tech vehicles such as aircraft structural parts should be well characterized. Therefore, safer use of these materials in critical structural parts becomes widespread. In this study, besides measuring fatigue crack propagation rates, the mechanisms causing crack acceleration or deceleration were determined by applying detailed SEM examinations.

This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor.

The thermal reflow process of the capacitor assembly and the crack propagation from the initial micro voids presented in the boundary, and later manifested into delamination, were numerically simulated. Besides, the cross section of the capacitor assembly was inspected for delamination cracks and voids using a scanning electronic microscope.

Interfacial delamination in the boundary of copper/copper-epoxy layers was caused by the thermal mismatch and growth of micro voids during the thermal reflow process. The maximum deformation on the capacitor during reflow was 2.370 µm. It was found that a larger void would induce higher vicinity stress, mode I stress intensity factor, and crack elongation rate. Moreover, the crack extension increased with the exerted deformation until 0.3 µm, before saturating at the peak crack extension of around 0.078 µm.

The root cause of interfacial delamination issues in capacitors due to thermal reflow has been identified, and viable solutions proposed. These can eliminate the additional manufacturing cost and lead time incurred in identifying and tackling the issues; as well as benefit end-users, by promoting the electronic device reliability and performance.

To the best of the authors’ knowledge, the mechanism of delamination occurrence in a capacitor during has not been reported to date. The parametric variation analysis of the void size and deformation on the crack growth has never been conducted.

A risk-based method is proposed to identify the dominant influencing factors of secondary lining cracking in an operating mountain tunnel with weak surrounding rock.

Based on the inspection data from a mountain tunnel in Southwest China, a lognormal proportional hazard model is established to describe the statistical distribution of secondary lining cracks. Then, the model parameters are obtained by using the Bayesian regression method, and the importance of influencing factors can be sorted based on the absolute values of the parameters.

The results show that the order of importance of the influencing factors of secondary lining cracks is as follows: location of the crack on the tunnel profile, rock mass grade of the surrounding rock, time to completion of the secondary lining, and void behind the secondary lining. Accordingly, the location of the crack on the tunnel profile and rock mass grade of the surrounding rock are the two most important influencing factors of secondary lining cracks in the investigated mountain tunnel, and appropriate maintenance measures should be focused on these two aspects.

This study provides a general and effective reference for identifying the dominant influencing factors of secondary lining cracks to guide the targeted maintenance in mountain tunnels.

Theoretical investigations have been performed on slowly propagating cracks in T‐junctions and cross bars using computer procedures developed to analyse the amount and direction of crack growth using automatic mesh modification and the finite element stress analysis program, BERSAFE. The procedures may be used in a linear or non‐linear material. The crack growth for the linear elastic case is calculated to be in the direction of the maximum energy release rate. For the non‐linear case, the direction is taken to be that of Jwi. These procedures have been applied to fatigue crack growth calculations in this paper.

Zirconia ceramics exhibit high strength and fracture toughness. The purpose of this paper is to research a possibility of crack healing in zirconia ceramics.

ZrO₂/SiC composite ceramics are sintered and subjected to three‐point bending. A surface crack of 100 μm in diameter is formed on each specimen. The cracks are healed and the specimens are tested under bending.

The paper finds that ZrO₂/SiC composite ceramic material had a high crack‐healing ability at a considerably low temperature. For example, a crack of 100 μm in diameter is healed even at 600°C.

The paper provides a low temperature healing and a new mechanism of crack healing.

The paper shows the healing temperature and the minimum time required to heal showed a good proportional relation on the Arrhenius plot at temperatures of 600‐800°C. Moreover, the crack healing is caused by SiO₂ cristobalite produced during the healing.

Since the most of structures and structural components suffers from cyclic loadings, the study on the fatigue failure due to the crack growth has a great importance. The purpose of this paper is to present a three-dimensional fatigue crack growth simulation of embedded cracks using s-version finite element method (SFEM). Using the numerical results, the validity of the fitness-for-service (FFS) code evaluation method is verified.

In this paper, three-dimensional fatigue crack propagation analysis of embedded cracks is performed using the SFEM. SFEM is a numerical analysis method in which the shape of the structure is represented by a global mesh, and cracks are modeled by local meshes independently. The independent global and local meshes are superimposed to obtain the displacement solution of the problem simultaneously.

The fatigue crack growth of arbitrary shape of cracks is slow compared to that of the simplified circular crack and the crack approximated based on the FFS code of the Japan Society of Mechanical Engineers (JSME). The results tell us that the FFS code of JSME can provide a conservative evaluation of the fatigue crack growth and the residual life time.

This paper presents a three-dimensional fatigue crack growth simulation of embedded cracks using SFEM. Using this method, it is possible to apply mixed mode loads to complex shaped cracks that are closer to realistic conditions.

The prediction of fatigue crack growth behaviour is an important part of damage tolerance analyses. Recently, the author’s work has focused on evaluating the FASTRAN retardation model. This model is implemented in the AFGROW code, which allows different retardation models to be compared. The primary advantage of the model is that all input parameters, including those for an initial plane-strain state and its transition to a plane-stress-state, are objectively measured using standard middle-crack-tension M(T) specimens. The purpose of this paper is to evaluate the ability of the FASTRAN model to predict correct retardation effects due to high loading peaks that occur during variable amplitude loading in sequences representative of an aircraft service.

This paper addresses pre-setting of the fracture toughness K _R (based on J-integral J _Q according to ASTM1820) in the FASTRAN retardation model. A set of experiments were performed using specimens made from a 7475-T7351 aluminium alloy plate. Loading sequences with peaks ordered in ascending-descending blocks were used. The effect of truncating and clipping selected load levels on crack propagation behaviour was evaluated using both experimental data and numerical analyses. The findings were supported by the results of a fractographic analysis.

Fatigue crack propagation data defined using M(T) specimens made from Al 7475-T7351 alloy indicate the difficulty of evaluating the following two events simultaneously: fatigue crack increments after application of loads with maximum amplitudes that exceeded J _Q and subcritical crack increments caused by loads at high stress intensity factors. An effect of overloading peaks with a maximum that exceeds J _Q should be assessed using a special analysis beyond the scope of the FASTRAN retardation model.

Measurements of fatigue crack growth on specimens made from 7475 T7351 aluminium alloy were carried out. The results indicated that simultaneously evaluating fatigue crack increments after application of the load amplitude above J _Q and subcritical increments caused by the loads at high stress intensity factors is difficult. Experiments demonstrated that if the fatigue crack reaches a specific length, the maximal amplitude load induces considerable crack growth retardation.

The purpose of this paper is to evaluate theoretically and numerically the stress and stress intensity factor (SIF) at the time of propagation of the crack in bi-material. The problem is formulated using two thin materials which are bound by a cracked adhesive at the tip and having a micro-crack in one of these two materials.

The plane stresses and the SIF will be determined as a function of two parameters (Poisson’s ratio and Shear modulus). The numerical analysis is carried out on a flat element, having a main crack in one of these ends, and a micro-crack varies in the vicinity of this main crack. The problem is analyzed by the finite element method and processed by computational software (ABAQUS).

The numerical and theoretical analysis allowed the author to determine and compare the values of plane stresses and SIF in each area of the material.

The theoretical analysis of SIF is based mainly on a mathematical calculation of equations of plane stresses; these equations are determined by development of complex analytical functions of bi-materials given by other researchers. Using the numerical method, several models are modeled by changing the micro-crack position relative to the main crack to determine the plane stresses and SIF for each position.

Crack sensor based on RFID tag has become a research hotspot in the field of metal structural health monitoring for its significant benefit of passive wireless transmission. While in practice, crack location will impact the performance of crack depth-sensing tag. The purpose of this paper is to provide a method for reducing disturbance of crack location on crack depth-sensing tag.

The effect analysis of crack location on crack depth-sensing tag is presented first to find disturbance reason and disturbance law. On the basis of that, a miniaturized tag is proposed to improve the current distribution and reduce the disturbance introduced by crack location.

The degree of crack location disturbance is closely related to the current distribution in the coverage area of tag. Because sensing tag performs better when crack locates in the high current density area, miniaturization of sensing tag is exploited to expand the high current density area and make the area more symmetrical. The simulated and experimental results demonstrate that tag miniaturization can enhance the performance of crack depth-sensing tag.

This paper provides a method to enhance the performance of crack depth-sensing tag.

This paper deals with crack propagation under programme‐fatigue loading; the programme being derived from a gust spectrum. The validity of the Palmgren‐Miner rule for crack propagation has been studied and its usefulness for design purposes is discussed.