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The mechanisms for void formation are investigated for applications involving solder paste in surface mount technology. Generally, voids are caused by the outgassing of entrapped flux in the sandwiched solder during reflow. The voiding is dictated mainly by the solderability of metallisation, and increases with decreasing solderability of metallisation, decreasing flux activity, increasing metal load of powder, and increasing coverage area under the lead of the joint. Decrease in the solder powder particle size has only a slightly negative effect on voiding. The data indicate that voiding is also a function of the timing between the coalescing of solder powder and the elimination of immobile metallisation oxide. The sooner the paste coalescence occurs, the worse the voiding will be. Increase in voiding is usually accompanied by an increasing fraction of large voids, suggesting that factors causing voiding will have an even greater impact on the joint reliability than shown by the total‐ void‐volume analysis results. Preliminary data suggest that certain predry treatment and flux solvent with higher boiling point appear to cause increased voiding.

For extrusion based multi‐material layered manufacturing (LM) processes, a CAD system has been developed which generates high quality toolpath for part fabrication. This closed loop CAD system includes solid model design and slicing, single‐material toolpath generation, multi‐material toolpath generation and virtual simulation modules. The solid model is sliced equally. Intelligent features and adaptive roadwidth optimum toolpath generation algorithm computes void sizes and their location and generates void free toolpath. The virtual simulation visualizes and validates the toolpath generated for the part. When the computed toolpath quality is acceptable, it is sent to the in house hardware Fused Deposition of Multiple Ceramics (FDMC) machine for fabrication.

Voiding in BGA assembly using SN63 solder bumps is primarily introduced at board‐level assembly stage. On the pretinned PCBs, voiding of BGA joints increases with increasing solvent volatility, increasing metal content and increasing reflow temperature, and with decreasing powder size. This can be explained by a viscosity dictated flux‐exclusion‐rate model. In this model, a higher viscosity in the fluxing medium at reflow temperature could hinder the exclusion of flux from the interior of the molten solder, hence increase the chance of outgassing due to the increasing amount of entrapped flux, and consequently result in higher voiding in BGA assembly. Flux activity and reflow atmosphere appear to have a negligible effect on voiding when the solderability of the immobile metallisation is not a concern. An increase in void content is accompanied by an increase in the fraction of large voids. This suggests that, similar to voiding phenomena in the SMT process, factors causing voiding in BGA will have an even greater impact on joint reliability than shown by the total‐void‐volume analysis results.

To determine the electrical field E₁(t) in spherical and cylindrical gas voids existing in an insulator by considering surface conductivity of gas voids having an electrical permittivity of ε₁ and conductivity of γ₁ for DC and AC situations.

Analytical expressions satisfying Laplace equation for inside and outside of the cylindrical and spherical gas voids in an insulator located in an external electrical field having a definite time dependent character, have been derived by considering the surface conductivity of the gas void. The coefficients included by these analytical expressions have been determined by utilizing the continuity equation of the current on the surface of the voids.

It has been demonstrated that the electrical field remains uniform in spherical and cylindrical gas voids when the surface conductivity of gas void has been considered. It has been determined that the contact charging process of different shaped particles has an exponential characteristic, and some expressions have been derived to determine the time constants of this process for practical purposes.

The results have been applied to the problems about contact charging of semi‐spherical and semi‐cylindrical insulated particles located at a charged surface and problems about the calculation of onset discharging voltage of ionization process in dielectric including gas voids.

For spherical and cylindrical gas voids, the onset discharging voltage corresponding to the ionization process occurring in gas voids has increased by increasing the surface conductivity of the void. For the limit value of the surface conductivity, the voids in the insulator behaves like metal particles distributed into the insulator, for this reason, at the outside of the void, especially in the regions where the voids are close to the electrodes and each other, the electrical field will be non‐uniform and will increase. This situation will cause the ignition of the partial discharge and destroy to the insulator.

The main advantages of vapour phase soldering are a non-oxygen environment, the elimination of overheating and the possibility of the vacuum application, which can guarantee undeniably higher quality of solder joints, especially as regards void formation. These features are less affected by the alloy composition. The paper aims to discuss these issues.

The quality of solder joints made in two VPS options (with and without vacuum) was investigated in terms of voids formation. Solder alloys of 37%Pb63%Sn (PbSn) and 96%Sn3.5%Ag0.5%Cu (SAC 305) were applied to an etched Cu layer on a glass-epoxy substrate using the screen-printing method. 1206 SMD resistors were placed on the solder pads with a Quadra pick-and place machine. For the inspection of joint structure and void identification, 3D X-ray images of samples were taken using a computed tomography system with a 180 kV/15 W nanofocus. For comparison, traditional cross-sections of the samples were performed using a metallographic polisher. The cross-section analysis was done in a scanning electron microscope (SEM). To confirm the relevance of these data, a statistical analysis was carried out.

The paper shows that alloy composition has less impact on the quality of joints as regards void formation. The tendency for a different arrangement of voids in a junction depending on the distance SMD element and the thickness of the solder layer was investigated using X-ray computed tomography.

The use of 3D computed tomography for void investigation gives full information about the internal structure of the joint and allows for precise void identification. Vacuum application during the soldering allows significant voids elimination.

The rapid progress of ball grid array (BGA) component technology has served to alleviate many problems associated with the placement and soldering of high lead count, fine pitch surface mount technology (SMT) packages. An unfortunate result of this process, however, is the occurrence of voids in the interconnecting eutectic solder balls of these packages. Large voids can affect the mechanical and thermal properties of the interconnect, which can reduce a component’s mean time‐to‐failure and may also affect the transmission of high frequency electrical signals through the solder ball. For this reason, several experiments were conducted to investigate the manner and mechanisms in which voids are introduced into eutectic BGA solder ball joints. The following process parameters were found to be the primary parameters responsible for the voiding phenomenon: condition of the component’s alloy and substrate, oxygen concentration in the reflow atmosphere, solder paste properties and the reflow profile. Through modification and optimization of process parameters in the manufacturing environment, BGA solder joint voiding was greatly reduced.

Lead‐free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead‐containing solders. The reliability of lead‐free solders has been studied a lot recently, but knowledge of it is still incomplete and many issues related to them are under heavy debate. This paper presents results from a study of the formation of voids with regard to the number of reflow cycles in three different kinds of solder joints: first the ones prepared with lead‐free solder paste and lead‐free plastic ball grid array (PBGA) components, next the ones prepared with lead‐free solder paste and tin‐lead‐silver PBGA components, and last the ones prepared with tin‐lead solder paste and tin‐lead‐silver PBGA components.

To explore the economical and reasonable semi-rigid permeable base layer ratio, solve the problems caused by rainwater washing over the pavement base layer on the slope, improve its drainage function, improve the water stability and service life of the roadbed pavement and promote the application of semi-rigid permeable base layer materials in the construction of asphalt pavement in cold regions.

In this study, three semi-rigid base course materials were designed, the mechanical strength and drainage properties were tested and the effect and correlation of air voids on their performance indexes were analyzed.

It was found that increasing the cement content increased the strength but reduced the air voids and water permeability coefficient. The permeability performance of the sandless material was superior to the dense; the performance of the two sandless materials was basically the same when the cement content was 7%. Overall, the skeleton void (sand-containing) type gradation between the sandless and dense types is more suitable as permeable semi-rigid base material; its gradation is relatively continuous, with cement content? 4.5%, strength? 1.5 MPa, water permeability coefficient? 0.8 cm/s and voids of 18–20%.

The study of permeable semi-rigid base material with large air voids could help to solve the problems of water damage and freeze-thaw damage of the base layer of asphalt pavements in cold regions and ensure the comfort and durability of asphalt pavements while having good economic and social benefits.

This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.

A set of top-down scanning acoustic microscope images of BGA underfill is collected and void labelled. The labelled images are trained with a convolutional neural network model, and the performance is evaluated. The model is tested with new images, and the void area with its region is analysed with its dispensing parameter.

All findings were well-validated with reference to the past experimental results regarding dispensing parameters and their quantitative regional formation. As the BGA is non-uniform, 85% of the test samples have void(s) formed in the emptier region. Furthermore, the highest rating factor, valve dispensing pressure with a Gini index of 0.219 and U-type dispensing pattern set of parameters generally form a lower void percentage within the underfilling, although its consistency is difficult to maintain.

This study enabled manufacturers to forecast the void regional formation from its filling parameters and array pattern. The filling pressure, dispensing pattern and BGA relations could provide qualitative insights to understand the void formation region in a flip-chip, enabling the prompt to formulate countermeasures to optimise voiding in a specific area in the underfill.

The void regional formation in a flip-chip underfilling process can be explained quantitatively with indicative parameters such as valve pressure, dispensing pattern and BGA arrangement.

Orange peel formation remains to be understood clearly because it is difficult to directly observe a laser-sintered process in a partcake. Therefore, this study aims to provide insight into the orange peel formation mechanism through the nondestructive observation of laser-sintered specimens and their surrounding powders.

This study observed polyamide 12 powder in the vicinity of a laser-sintered specimen via X-ray computed tomography (CT) scanning. The specimen for nondestructive observation was 3D modeled in a hollow box using 3D CAD software. The boxes built using a laser-sintering system contained unsintered surrounding powder and sintered specimens. The box contents were preserved even after the boxes were removed from the partcake. After X-ray CT scanning, the authors broke the boxes and evaluated the unevenness formed on the specimen surface (i.e. the orange peel evaluation).

Voids (not those in sintered parts) generated in the powder in the vicinity of the specimen triggered the orange peel formation. Voids were less likely to form in the build with a 178.5° powder bed than in the build with a 173.5° powder bed. Similarly, the increment in laser energy density effectively suppressed void formation, although there was a tradeoff with overmelting. Thin-walled parts avoided void growth and made the orange peel less noticeable.

To the best of the authors’ knowledge, this study is the first to observe and understand the relationship between voids generated in the powder in the vicinity of sintered parts and orange peel formation.