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The paper seeks to propose and analyze a new electrostatic ramjet space engine.

The upper atmosphere (85‐1,000 km) is extremely dense in ions (millions per cubic cm). The interplanetary medium contains positive protons from the solar wind. A charged ball collects the ions (protons) from the surrounding area and a special electric engine accelerates the ions to achieve thrust or decelerates the ions to achieve drag. The thrust may have a magnitude of several Newtons. If the ions are decelerated, the engine produces a drag and generates electrical energy. The theory of the new engine is developed.

It is shown that the proposed engine driven by a solar battery (or other energy source) cannot only support satellites in their orbit for a very long time but can also work as a launcher of space apparatus. The latter capability includes launch to high orbit, to the Moon, to far space, or to the Earth's atmosphere (as a return thruster for space apparatus or as a killer of space debris). The proposed ramjet is very useful in interplanetary trips to far planets because it can simultaneously produce thrust or drag and large electric energy using the solar wind.

Two scenarios, launch into the upper Earth atmosphere and an interplanetary trip, are simulated and the results illustrate the excellent possibilities of the new concept.

The author's aim is to offer a revolutionary method – the non‐rocket transfer of energy and thrust into Space with distances of millions of kilometers.

The author develops the theory and makes the computations.

The method is more efficient than transmission of energy by high‐frequency waves.

The method may be used for space launch and for acceleration of spaceships and probes to very high speeds, up to relativistic speed by current technology.

The research presented contains prospective projects which illustrate the possibilities of the suggested method.

Copper electrodeposition acts as a crucial step in the manufacture of high-density interconnect board. The stability of plating solution and the uniformity of copper electrodeposit are the hotspot and difficulty for the research of electrodeposition. Because a large number of factors are included in electrodeposition, experimentally determining all parameters and electrodeposition conditions becomes unmanageable. Therefore, a multiphysics coupling technology was introduced to investigate microvia filling process, and the mechanism of copper electrodeposition was analyzed. The results provide a strong theoretical basis and technical guidance for the actual electroplating experiments. The purpose of this paper is to provide an excellent tool for quickly and cheaply studying the process behavior of copper electrodeposition without actually needing to execute time-consuming and costly experiments.

The interactions among additives used in acidic copper plating solution for microvia filling and the effect on the copper deposition potential were characterized through galvanostatic measurement (GM). The adsorption behavior and surface coverage of additives with various concentrations under different rotating speeds of working electrode were investigated using cyclic voltammetry (CV) measurements. Further, a microvia filling model was constructed using multiphysics coupling technology based on the finite element method.

GM tests showed that accelerator, inhibitor and leveler affected the potential of copper electrodeposition, and bis(3-sulfopropyl) disulfide (SPS), ethylene oxide-propylene oxide (EO/PO) co-polymer, and self-made leveler were the effective additives in acidic copper plating solution. CV tests showed that EO/PO–Cu⁺-Cl⁻ complex was adsorbed on the electrode surface by intermolecular forces, thus inhibiting copper electrodeposition. Numerical simulation indicated that the process of microvia filling included initial growth period, the outbreak period and the stable growth period, and modeling result was compared with the measured data, and a good agreement was observed.

The research is still in progress with the development of high-performance computers.

A multiphysics coupling platform is an excellent tool for quickly and cheaply studying the electrodeposited process behaviors under a variety of operating conditions.

The numerical simulation method has laid the foundation for mechanism of copper electrodeposition.

By using multiphysics coupling technology, the authors built a bridge between theoretical and experimental study for microvia filling. This method can help explain the mechanism of copper electrodeposition.

This fourth article in a series of six focuses on mega‐material technologies. Offering the ability to deconstruct and reconstruct matter at atomic and sub‐atomic levels to achieve desired properties, mega‐materials are set to radically transform the physical sciences, realising an alchemist’s wildest dreams. Advanced understanding of the bio‐chemistry of life’s instructional genetic codes will be followed by parallel developments in physics and chemistry involving mastery over quantum mechanics, to enable the construction of “designer” materials. Harnessing nanotechnologies will introduce new and novel types of artefact that were previously the stuff of science fiction. Fully understanding and adroitly manipulating sub‐atomic matter will take time, but these technologies are expected to move to a dominant position in the economy between 2200 and 2300.

This paper aims at advancing a pragmatist perspective on entrepreneurial opportunities as an alternative to the traditional and predominant constructivist and objectivist perspectives. To this end, this paper advances a pragmatist definition of an opportunity and draws from empirical evidence to propose a pragmatist model of opportunity conception and exploitation.

A review of the entrepreneurial opportunity and pragmatism literatures yields a definition of an opportunity as a dynamic and unfolding experience which an entrepreneur conceives as a general market need to exploit it for financial or social gain. Drawing from this definition, and with the aim of developing a pragmatist model of an opportunity, a case study approach is applied to three radically innovative services conceived and developed by three high-performance computing (HPC) centers.

In each of the three cases, an entrepreneurial HPC center conceived a new, general market need (opportunity) and then acted to exploit it. Through its action, the HPC center learned something that enabled it to address barriers, develop an improvement or otherwise reconceive the opportunity. In turn, the HPC center learned more about and advanced the opportunity, and then acted again. After launching a new service based on the opportunity, the opportunity continued to evolve in response to the HPC center’s efforts and to market forces.

The pragmatist perspective and model of an opportunity can serve as a foundation for future pragmatist research into entrepreneurship and innovation. To this end, future studies could extend the model by examining in greater detail the acting-learning-reconceiving cycle, by exploring how an opportunity evolves and is reconceived after market launch and/or by investigating opportunity conception and exploitation within other types of markets.

From a pragmatist perspective, an opportunity is not some discrete object to be discovered. It is emergent and dynamic, and to the extent that it is “created”, it is never complete or finalized. It is experienced by the entrepreneur, and it continues to evolve, even after it has been launched as a new good or service.

The paper proposes novel value by advancing a pragmatist perspective on entrepreneurial opportunities. Such a perspective is an alternative to the constructivist and objectivist perspectives that have framed research into opportunities. The paper also proposes novel value by drawing from case study findings to propose a pragmatist model of opportunity conception and exploitation.

Urethane Acrylate Oligomer with 100% solids was synthesised and characterised in order to study the application in electron beam curing with varying ratio of Trimethylol propane triacrylate (TMPTA). The purpose of this paper is to study effect of TMPTA addition on the crosslink density and different coating properties.

Polyester polyol was synthesised by reacting single diacid, adipic acid (AA), with Pentaerythritol (PENTA) and 1,6‐hexanediol (HD). Further, Urethane acrylate resin was synthesised by using Isophorone diisocyanate (IPDI), hydroxy ethyl acrylate (HEA) and Polyester polyol. The polyester polyol and urethane acrylate oligomer were characterised by 1H NMR, 13C NMR, FTIR and GPC. Further, TMPTA was added as a crosslinker to the urethane acrylate oligomer and cured by electron beam radiation. The cured UA films having varying concentration of TMPTA were employed to evaluate thermal property, contact angle analysis, mechanical and chemical properties.

The obtained results showed improvement in their chemical properties, mechanical properties, thermal properties and water contact angle at 20% of TMPTA iconcentration. The TMPTA also reduced the dose required for the curing.

The resin can be synthesised from different isocyanates as TDI, MDI and HMDI, etc. The study can also be done with different multi or mono functional monomers such as methacrylate, hexanediol diacrylate, ethylene glycol diacrylate, etc.

The paper provides the better solution to reduce the cost of the electron beam radiation required for the curing.

The method presented in the paper could be very useful for controlling environmental pollution; as the conventional method of curing releases volatile organic compounds (VOC).

In this paper, urethane acrylate and TMTPA cured with electron beam are shown to offer good coating properties. A high‐solid urethane acrylate coating would find numerous industrial applications in surface coatings.

The purpose of this paper is to present a clear picture of the key factors of blind via and through hole filling in electroplating, e.g. shape of via or hole, electroplating solution, process, as well as the developments of mechanisms and models.

First, the paper details the development trends and challenges of via filling. Then the research status of mechanisms, electroplating solutions, including base solution and additives, numerical model and mass transfer is described. Finally, through hole filling is briefly reviewed.

To achieve excellent via filling performance, the characteristics of the via or hole, the ratio of acid/copper, selection of additives and factors of mass transfer are comprehensively considered in terms of optimization of the electroplating process. It is beneficial to design vias with appropriate aspect ratios, to strengthen the adsorption of the accelerator in the via bottom, to inhibit the increase of surface copper thickness and to form butterfly-shaped copper in the centre of through holes. Optimized process parameters should be taken into consideration in superfilling.

The paper reviews different sets of additives, mechanisms and superfilling models for state-of-the-art via filling and the developments of filling for through holes.

The main role of the Harwell laboratory is to develop technology for the UK nuclear power industry, and this work is funded by the Parliamentary vote of the UKAEA. The very wide range of knowledge and skills necessary to fulfil this requirement has resulted in an R&D expertise which is a major national asset. For the last ten or more years Harwell has directed its expertise to the widest possible range of UK industry and has evolved into one of the largest contract R&D organisations in the world. Work done under contract for both government and industry now exceeds nuclear work, with commercial earnings amounting to some £30 million a year and accounting for 60 per cent of all Harwell's expenditure.

This study aims to explore the knowledge spillover mechanism in big science projects (BSP) from an institutional perspective by elaborating on the dynamic relationship between institutional dualism and legitimacy.

The study conducts an exploratory research and adopts the grounded theory methodology in the context of BSP. Data draw mainly upon nine semi-structured interviews.

The knowledge spillovers in BSP are driven by institutions, which work through mechanisms of legitimacy perception. Formal and informal institutions influence organizational and individual behavior through legitimacy pressure and support. Formal institutions impose legitimacy pressure on organizations and individuals, forcing them to cooperate closely to solve problems; informal institutions enable them to adopt innovative strategies and positive attitudes through legitimacy support; all these promote knowledge spillovers in research and development (R&D) activities, engineering practice and regional interaction. Knowledge spillovers enable stakeholders to realize their R&D advancement, manufacturing promotion and management sophistication. Further, regional knowledge diffusion and culture transmission promote regional innovation and social capital accumulation.

The study develops a theoretical model that shows how knowledge spillover mechanisms happen in BSP from an institutional perspective (the trigger, the channels/process and the impacts). More specifically, this explanation is provided by explaining how formal and informal institutions influence organizational and individual behavior through legitimacy perceptions.

First, policymakers should recognize and value the guiding, supporting and coordinating role of formal institutions and enrich capital forms to release the legitimacy pressure of stakeholders. Second, management of BSP needs to be capable of coordinating stakeholder relationships and interactions, while management should focus their attention on fostering good organizational routines and shared group value. Third, the local culture and customs should be taken into consideration since it can be an enabling or constraining of BSP. Finally, industries can take advantage of the opportunity to coordinate their R&D efforts to gain competitiveness.

First, the authors introduce the institutional perspective to analyze the construction process of BSP, which helps to better understand the interactions of stakeholders under the influence of institutions, the dynamic process and impacts of knowledge spillovers. Second, the authors are committed to contributing to the development of knowledge spillover theories by adopting an institutional perspective. The authors furthermore explore and propose the presence of a dynamic mechanism between institutional dualism and knowledge spillovers. In consequence, the authors introduce the concept of legitimacy perceptions, which is a bridge to understanding the interaction between them. Third, by explicitly discussing the actual meaning of our framework, the authors explore the unique potential of institutional arrangement in promoting the knowledge management of complex cross-border cooperation, while seeking to promote its management and administrative practices.

The accurate interpolation of magnetization tables is of paramount importance in the design of high‐precision magnets used for particle accelerators or for magnetic resonance imaging of the human body. Cubic spline interpolation is normally used in combination with the fast converging Newton‐Raphson scheme in the two‐dimensional finite element modelling of such magnets. We compare cubic spline interpolation with experiment, using the magnetization tables as a source of carefully measured experimental data. We show that, in all examined cases, cubic spline interpolation introduces errors large enough to invalidate a design. We also propose a simple solution to the problem, thus combining the best of all worlds: the speed and convergence properties of Newton‐Raphson, the accuracy of a good interpolation scheme, and the convenient mathematical properties of cubic splines. We examine both two‐dimensional and three‐dimensional cases.