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This paper seeks to provide an insight into the design and development of the thermal test model (TTM) of X‐Sat, a 120 kg class micro‐satellite, being developed at the Centre. This model was specifically constructed for carrying out a thermal balance test (TBT) in a 4 m diameter vertical thermal vacuum chamber.

The construction of the thermal model followed a structural mock‐up model which was modified thermally to suit the purpose. Specific and careful consideration was given to the geometry and, more importantly, thermal characteristics such as thermal mass, surface properties, etc. to mimic the actual satellite configuration as closely as possible. Test plans were devised to qualify the fabricated components to meet the out‐gassing and other thermal requirements for the model. Design and qualification of supporting frame and linkages for TBT are also covered.

It is possible to simulate the thermal characteristics of a micro‐satellite in orbit under a different mission scenario through proper scaling and using alternative material options while developing TTM.

The paper discusses in detail the simplified cost‐effective approach of constructing TTM and also outlines the various issues to be considered for a TBT. It provides valuable information needed for micro‐satellite designers.

This paper's purpose is to review the design of a flip chip thermal test vehicle.

Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn‐in simulation are outlined and the design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. The design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also explained.

Describes the design considerations and processes of the package substrate and printed‐circuit board with special emphasis on the physical routing of the thermal test chip structures. These design processes are supported with thermal data from various finite‐element analyses carried out to evaluate the capability and limitations of thermal test vehicle design.

The validation and calibration procedures of a thermal test vehicle are presented in this paper.

The purpose of this paper is to present the quantification of the thermal conductivities and thermal resistances of 12 insulating fabrics extracted from commercial clothing products under static, simulated sweating, and simulated wind chill conditions.

Triplicate coded (blind test) samples of each fabric were tested in a modified ASTM 1518‐85 test apparatus enclosed in a cold box capable of temperatures as low as −85°C to determine thermal conductivity and thermal resistance. Sweat and wind chill were also simulated and evaluated.

One fabric, Vaetrex0, was clearly found to be superior under all conditions to the other 11 fabrics tested. The performance of many of the other fabrics varied when exposed to simulated sweat.

An objective evaluation of fabrics that can assist manufacturers in fabric selection for cold weather clothing manufacture.

The paper provides an extension of the ASTM 1518‐85 method to cold conditions and a unique blind comparison test of commercial clothing fabrics under these extreme conditions.

The purpose of this paper is to measure the thermal and moisture resistance of the knitted upper fabrics with the foot model, which provided basis for designing and producing sports shoes with thermal-moisture comfort.

In this paper, different yarn materials and fabric stitches were selected as the changing factors. The three kinds of yarn materials and the three kinds of fabric stitches were combined to design and weave eight pieces of knitted upper fabrics. Human sweating was simulated by the thermal-moisture comfort foot model, and then tested the thermal and moisture resistance of eight pieces of fabrics in different parts of the foot. Finally, the relationship between yarn material, fabric stitch, and the thermal and moisture resistance in different parts of the foot was analyzed by data.

The composition of the yarn material and fabric stitch has certain effect on the thermal-moisture comfort in different sections of the foot. When the yarn material of the four parts of the lateral arch, medial arch, ankle and heel is composed of 31.1tex moisture wicking polyester/33.3tex spandex coated yarn, the yarn material of the instep and toes is composed of 31.1tex ordinary polyester/33.3tex spandex coated yarn, and all parts of fabric stitch choose single-sided loop transfer stitch, the knitted sports shoes have the best thermal-moisture comfort.

The study used the thermal-moisture comfort foot model to simulate the human body metabolism and sweating system. Through the quantitative analyze of the thermal and moisture resistance of knitted upper fabrics to provide basis for the producers to design and product knitted sports shoes with good thermal-moisture comfort.

This study aims to investigate the heat transfer mechanism of the uniforms used by people working in hot, humid and windy environments. Furthermore, the effectiveness of an opening structure added to the armpit of the uniforms in improving thermal comfort was comparatively examined.

A set of uniforms was tested with the opening at the armpit alternatively zipped or unzipped. Thermal manikin and human tests were performed in a climatic chamber simulating the specific environmental conditions, including wind speeds at four levels (0.15, 0.5, 2, 4 m/s) and relative humidities at two levels (50 and 85%). Static and dynamic thermal insulations of clothing (I_T) were examined by the thermal manikin tests. The human bodies' thermal responses, including heart rates (HR), eardrum temperatures (T_e), skin temperatures (T_sk) and subjective perceptions, were given by the human tests.

Special mechanisms of heat transfer in the specific uniforms used in tropical monsoon climates were revealed. Reductions on I_T were caused by the movement of the human body and the environmental wind, and the empirical equations would underestimate this reduction. The opening at the armpit was able to prompt more heat transfer under dynamic condition, with reducing the I_T by 11.8%, lowering the mean T_sk by 0.92°C, and significantly improving the subjective perceptions (p < 0.05). The heat exhaustion was alleviated with lowering the T_e by 0.32°C.

This study managed to improve the thermal performance of uniforms for workers under unforgiving conditions. The evaluation and design methods introduced by this study provided practical guidance for similar products with strict dress codes and cost control requirements based on the findings from thorough product tests and analysis.

Thermal characterisation of surface mount devices (SMDs) has become a growing concern as these components have increased in use—a situation aggravated by the lack of accepted industry standards for making thermal measurements. This paper attempts to provide better understanding of thermal resistance terminology, and to summarise some of the existing problems with current standards and common practices. A defined methodology for obtaining SMD thermal characteristics is proposed, involving measurement by vendors and confirmation by users, and suitable for use in meeting application‐oriented requirements. The importance of providing a clear and complete set of test condition information is also emphasised.

The purpose of this paper is to deal with performance verification of thermal insulation fillings that are used for outer clothes into cold environments. Thermal properties of filling materials (down and three sophisticated fillings) were tested under condition approaching real weather conditions in Middle Europe.

In the paper, modern method of thermal resistance Rct measurement, by Sweating Guarded-Hotplate system, was compared with method of Technical University of Liberec (TUL method). The TUL method shows good results and it is applicable even at ambient temperatures below zero, which fully corresponds to real application of the insulation filling.

Evaluation of fibre battings were carried out even at temperatures below the freezing point, which is important for simulation of actual application of these filling structures. The highest thermal resistance of goose down confirm that natural materials have their irreplaceable position, especially in application into clothes for extreme conditions.

There does not include effect of the humidity change on thermal insulation properties. It will be subject of further research of authors.

The investigation of thermal insulation properties were carried out under conditions approaching real application of tested materials, namely, at low ambient temperature.

The purpose of this work is to undertake a comparison of accelerated test regimes for assessing the reliability of solder joints, in particular those made using lead‐free solders.

Identical samples of 1206, 0805 and 0603 resistors were subjected to six different cycling regimes to investigate the effect of thermal excursions, ramp rates and temperature dwells.

The most damage to joints was found to be caused by thermal cycling between −55 and 125°C, with a 10°C/min ramp rate and 5 min dwells. Large thermal excursions were shown to give faster results without compromising the failure mode.

Similar degrees of damage in the lead‐free solder joints were experienced from thermal shock regimes with ramp rates in excess of 50°C/min. However, these regimes, although faster to undertake, appeared to cause different crack propagation modes than observed with the thermal cycling regimes. However, these differences may be small and thermal shock testing may still be used to differentiate between, or enable ranking of, the effects of changes to materials or processes on the reliability of the solder joints. Hence, it is envisaged that if a wide range of conditions are to be tested a first sift can be completed using thermal shock, with the final work using typical thermal cycling conditions.

The difference between the SAC (95.5Sn3.8Ag0.7Cu) and SnAg (96.5Sn3.5Ag) solder alloy results across all types of cycles showed very little difference in the rates of joint degradation.

This paper compares relative reliability (remaining shear strength) of three chip components soldered with two lead‐free alloys based on various thermal cycling conditions.

The purpose of this paper is to study the effect of conformal coating on the thermal cycling reliability of anisotropically conductive adhesive film (ACF) joined flip chip components on FR‐4 and polyimide (PI) substrates.

Test chips were joined using flip chip technology and an anisotropically conductive adhesive. The conformal coating used was parylene C and it was applied using the vapour deposition polymerisation method. The reliability of ACF joined flip chip components on FR‐4 and PI substrates was evaluated using −40/+85°C thermal cycling testing. Test lots with and without parylene C coating were studied. Additionally, one test lot with initial moisture inside the coating layer and a PI substrate was subjected to the test. The reliability results were analyzed using Weibull analysis and failure analysis was performed to study the failure mechanisms using cross sectioning and optical and scanning electron microscopy.

The results show a clear difference between the FR‐4 and PI substrate materials. PI substrate material proved to be reliable enough to withstand the thermal cycling testing. Two different occurrences of the first failures are seen and analyzed with FR‐4 substrates. The conformal coating layer did not seem to impair the reliability. Parylene C coating proved to be a reliable choice to protect, and even improve, the thermal cycling reliability of flip chip devices.

Usually, conformal coatings are studied in humidity tests. However, it is also vital to know whether the conformal coatings affect the reliability in thermal cycling and there is a lack of reliability studies in this area. This paper gives reliability data for conformal coating users about the influence of thermal cycling.

Thermal insulation is important to achieve energy efficiency in a buildings’ lifespan while maintaining comfort. Traditionally, the majority of insulation in buildings is man-made petroleum based products with limited or no-end life usage. However, from an environmental and economic sustainability perspective, they are not sustainable as natural resources are finite and in danger of run-out. Furthermore, they are also highly influenced by the increasing price and the ongoing scarcity of fossil fuel oils. The paper aims to discuss these issues.

This paper introduces soap based insulation from recycled materials as a sustainable alternative to petroleum counterparts. The methodology is lab based experimentation and iterative tests. The phased based research process for the incremental development of the soap based thermal insulation is explained.

Findings reveal that soap based insulation can be one possible way forward in the quest for natural and sustainable thermal insulation from recycled products to preserve and conserve the sustainable environment.

Thus, the paper provides a unique environmentally friendly approach as an alternative to those existing petroleum counterparts for thermal insulation in buildings.