Search results

High residual stress caused by the high temperature gradient brings undesired effects such as shrinkage and cracking in selective laser melting (SLM). The purpose of this study is to predict the residual stress distribution and the effect of process parameters on the residual stress of selective laser melted (SLMed) Inconel 718 thin-walled part.

A three-dimensional (3D) indirect sequentially coupled thermal–mechanical finite element model was developed to predict the residual stress distribution of SLMed Inconel 718 thin-walled part. The material properties dependent on temperature were taken into account in both thermal and mechanical analyses, and the thermal elastic–plastic behavior of the material was also considered.

The residual stress changes from compressive stress to tensile stress along the deposition direction, and the residual stress increases with the deposition height. The maximum stress occurs at both ends of the interface between the part and substrate, while the second largest stress occurs near the top center of the part. The residual stress increases with the laser power, with the maximum equivalent stress increasing by 21.79 per cent as the laser power increases from 250 to 450 W. The residual stress decreases with an increase in scan speed with a reduction in the maximum equivalent stress of 13.67 per cent, as the scan speed increases from 500 to 1,000 mm/s. The residual stress decreases with an increase in layer thickness, and the maximum equivalent stress reduces by 33.12 per cent as the layer thickness increases from 20 to 60µm.

The residual stress distribution and effect of process parameters on the residual stress of SLMed Inconel 718 thin-walled part are investigated in detail. This study provides a better understanding of the residual stress in SLM and constructive guidance for process parameters optimization.

To fabricate high performance parts, this paper aims to systematically study the pores characteristics and their formation mechanisms in selective laser melting (SLM) AlSi10Mg.

Cubes of 10 × 10 × 5 mm were manufactured in different laser power, scan speed and scan space. Optical microscope (OM) and scanning electron microscopes (SEM) were used to observe morphology of pores.

Round or irregular pores were found in SLMed AlSi10Mg parts. All the round pores have smooth inner walls and locate in the melt pool. The formation mechanisms of the round pores are contributed to the evaporation of elements in the melt pool, H₂O, high laser energy input and hollow powder. Irregular pores have rough inner walls. Big scan space, unevenness of the upper surface, large layer thickness, spatter and oxide are the main reasons of generating irregular pores which outside the melt pool. Instability of keyhole leads to the irregular pores locate in the bottom of keyhole mode melt pool.

Relationship between pores and melt pool were studied systematically for the first time. Researches of pores characteristics and their formation mechanisms in SLMed AlSi10Mg would be a valuable reference for researchers to obtain an important insight into and control the defect in SLMed Al alloy.

The purpose of this paper is to investigate the track evolution and surface characteristics of selective laser melting Ti₆Al₄V.

In the present paper, Ti₆Al₄V single-track, multi-track and bulk sample were formed at different scanning speed by selective laser melting (SLM). Then, the surface morphology, three-dimension profile and surface roughness were evaluated. The width of the single and multi-track was measured and compared.

The results showed that the heat accumulation played a great role on the evolution of tracks and surface characteristics from single-track to multi-track and to bulk. The surface morphology of the subsequent tracks became more regular when the single-track was irregular at the same high scanning speed. The width of last track Wn was always larger than that of the first track W1. The Ra of the top of the bulk increased with the increase of the scanning speed, this trend was as same as the Ra of the single-track, but the trend of Ra of the side was opposite.

The effect of heat accumulation on the track evolution and surface characteristics is obtained. The results can help to derive a smooth surface with a regular and continuous track in SLM.

Selective laser melting (SLM) is a promising additive manufacturing technology in the field of complex parts’ fabrication. High temperature gradient and residual stress are vital problems for the development of SLM technology. The purpose of this paper is to investigate the influence of substrate characteristics on the residual stress of SLMed Inconel 718 (IN718).

The SLMed IN718 samples were fabricated on the substrates with different characteristics, including pre-compression stress, materials and pre-heating. The residual stress at the center of the top surface was measured and compared through Vickers micro-indentation.

The results indicate that the residual stress reduces when the substrate contains pre-compression stress before the SLM process starts. Both substrate thermal expansion coefficient and thermal conductivity affect the residual stress. In addition to reducing the difference of thermal expansion coefficient between the substrate and the deposited material, the substrate with low thermal conductivity can also decrease the residual stress. Substrate pre-heating at 150°C reduces nearly 42.6 per cent residual stress because of the reduction of the temperature gradient.

The influence of substrate characteristics on the residual stress has been studied. The investigation results can help to control the residual stress generated in SLM processing.

This paper aims to systematically investigate the effect of the heat treatment process parameters on the microstructure and mechanical properties of the selective laser melting (SLM) AlSi10Mg alloy.

The samples with very low porosity were fabricated with optimized processing parameters on a self-developed SLM system. The heat treatment of using the temperature of 170°C∼400°C and the holding time of 0.5∼12 h was studied, and the evolution of the microstructure and mechanical properties of AlSi10Mg alloy under direct aging and annealing was investigated and obtained.

After annealing above 300°C for 1 h, the dendrite Si in the sample occurs spheroidization, and the molten pool contour becomes blurred or even disappeared completely, but low-temperature heat treatment does not change the morphology and size of grains significantly. Except for holding at 200°C for 1 h, all other heat treatment processes cause the tensile and yield strengths of SLM AlSi10Mg alloys to decrease and the elongation to increase. When the annealing temperature is higher than 200°C, the higher the temperature and the longer the holding time, the more obvious this effect is.

The correlation between the mechanical properties and microstructure of SLM AlSi10Mg alloy under different conditions was obtained. According to the characteristics of SLM forming, the direct aging and annealing process are mainly studied, which provided new information for the heat treatment of SLM AlSi10Mg alloy and promoted the engineering application of SLM AlSi10Mg alloy.

It is a crucial issue to eliminate cracks for selective laser melting (SLM) 7xxx series aluminum alloy. This paper aims to study the effect of silicon content on the cracking behavior and the mechanism of eliminating crack of SLMed Al7050 alloy.

Six different silicon contents were added to the Al7050 powder. The crack density and crack count measuring from optical micrographs were utilized to judge the cracking susceptibility. The low melting phases analyzing from Jmatpro and the microstructure observing by EPMA and SEM were used to discuss the mechanism of eliminating the crack.

The cracking susceptibility of SLMed Al7050 alloy decreases with the increase of adding silicon content. When adding silicon, two new low-melting phases appeared: Mg2Si and Al5Cu2Mg8Si6. These low-melting phases offer much liquid feeding along the grain boundary and decrease the cracking susceptibility. Moreover, the grains are obviously refined after adding silicon. The fine grain can increase the total surface area of the grain boundary, which can reinforce the matrix and decrease the cracking susceptibility. High silicon content results in more low-melting phases and fine grains, which decreases the cracking susceptibility.

The investigation results can help to obtain crack-free SLMed Al7050 parts and deep knowledge on eliminating cracking mechanism of high-strength aluminum alloy fabricated by SLM.

High temperature gradient induces high residual stress, producing an important effect on the part manufacturing during laser powder bed fusion (LPBF). The purpose of this study is to investigate the effect of the molten pool mode on the thermal stress of Ti-6Al-4V alloy during different deposition processes.

A coupled thermal-mechanical finite element model was built. The developed model was validated by comparing the numerical results with the experimental data in the maximum molten pool temperature, the molten pool dimension and the residual stress described in the previous work.

For the single-track process, the keyhole mode caused an increase in both the maximum stress and the high-stress area compared with the conduction mode. For the multitrack process, a lower tensile stress around the scanning track and a higher compressive stress below the scanning track were found in the keyhole mode. For the multilayer process, the stress along the scanning direction at the middle of the part changed from tensile stress to compressive stress with the increase in the deposition layer number. As the powder layer number increased, the stress along the scanning direction near the top surface of the part decreased while the stress along the deposition direction obviously increased, indicating that the stress along the deposition direction became the dominant stress. The keyhole mode can reduce the residual stress near the top of the part, and the conduction mode was more likely to produce a low residual stress near the bottom of the part.

The results provide a systematic understanding of thermal stress during the LPBF process.

For the laser powder bed fusion (L-PBF) technology, the side surface quality is essentially important for industrial applicated parts, such as the inner flow parts. Contour is generally adopted at the parts’ outline to enhance the side surface quality. However, the side surface roughness (Ra) is still larger than 10 microns even with contour in previous studies. The purpose of this paper is to study the influence of contour process parameters, laser power and scanning velocity on the side surface quality of the AlSi10Mg sample.

Using L-PBF technology to manufacture AlSi10Mg samples under different contour process parameters, use a laser confocal microscope to capture the surface information of the samples, and obtain the surface roughness Ra and the maximum surface height Rz of each sample after analysis and processing.

The results show that the side surface roughness decreases with the increase of the laser power at the fixed scanning velocity of 1,000 mm/s, the side surface roughness Ra stays within the error range as the contour velocity increases. It is found that the Ra increases with the scanning velocity increasing and the greater the laser power with the greater Ra increases when the laser power of contour process parameters is 300 W, 350 W and 400 W. The Rz maintain growth with the contour scanning velocity increasing at constant laser power. The continuous uniform contour covers the pores in the molten pool of the sample edge and thus increase the density of the sample. Two mechanisms named “Active adhesion” and “Passive adhesion” cause sticky powder.

Formation of a uniform and even contour track is key to obtain the good side surface quality. The side surface quality is determined by the uniformity and stability of the contour track when the layer thickness is fixed. These research results can provide helpful guidance to improve the surface quality of L-PBF manufactured parts.

The purpose of this paper is to report the influence of the peak laser power on laser micro sintering 4-μm nickel powder using Q-switched 1064-nm Nd:YAG laser.

Experimental study has been performed. Nickel powder with grain size of 4 μm has been utilized. A Q-switching duration of 20-25 μs and rate of 20-40 kHz have been used.

The peak power intensity is so high that the metal particles and molten pool are blown away, leading to laser micro sintering not being successfully proceeded. The scanning line obtained by continuous-wave (CW) laser looks like a rod owing to balling effect. Using a suitable peak power intensity, a good-shaped sintering line can be obtained because the plasma can protect the molten metal from oxidation, and improve the wettability of the system. In addition, the plasma flattening effect may also contribute to the form of the good-shaped sintering line in pulsed laser sintering regime.

The role of plasma induced by pulsed laser with high peak power intensity has been found during pulsed laser sintering under an ambient environment.

This paper aimed to investigate the plasma characteristics of selective laser micro sintering Cu‐based metal powder using spectra method.

Temporal and time integrating plasma induced during selective laser micro sintering Cu‐based metal powder with a Q‐switched pulsed YAG laser have been detected and analyzed. Boltzmann plot and Stark broadening of the spectra line are utilized to analyze the electron temperature and density, respectively. The influences of the Q‐switching rate and duration on the plasma temperature and electron density have been investigated.

The results show that the plasma temperature decreases from 9,600 to 9,000 K with the increase of the Q‐switching rate from 5 to 35 kHz if Q‐switching duration of laser is kept at a constant value. The plots of temporal temperature and electron density show that the electron density varies in a faster speed than plasma temperature and the entire expansion process takes about 700 ns‐1 μs in this experiment. Evolutional images of the plasma plume using Q‐switching rate of 5 kHz and 5 μs have been registered by the ICCD with a 10 ns exposure time, which shows that the plasma plume takes about 100 ns to get to the maximum size and 600 ns to disperse.

The plasma spectra of selective laser micro sintering Cu‐based metal powder have been diagnosed experimentally. The plasma characteristics of selective laser micro sintering Cu‐based metal powder have been analyzed.