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This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This paper comprehensively addresses the influence of chopped strand mat glass fiber-reinforced polymer (GFRP) patch configurations such as geometry, dimensions, position and the number of layers of patches, whether a single or double patch is used and how well debonding the area under the patch improves the strength of the cracked aluminum plates with different crack lengths.

Single-edge cracked aluminum specimens of 150 mm in length and 50 mm in width were tested using the tensile test. The cracked aluminum specimens were then repaired using GFRP patches with various configurations. A three-dimensional (3D) finite element method (FEM) was adopted to simulate the repaired cracked aluminum plates using composite patches to obtain the stress intensity factor (SIF). The numerical modeling and validation of ABAQUS software and the contour integral method for SIF calculations provide a valuable tool for further investigation and design optimization.

The width of the GFRP patches affected the efficiency of the rehabilitated cracked aluminum plate. Increasing patch width WP from 5 mm to 15 mm increases the peak load by 9.7 and 17.5%, respectively, if compared with the specimen without the patch. The efficiency of the GFRP patch in reducing the SIF increased as the number of layers increased, i.e. the maximum load was enhanced by 5%.

This study assessed repairing metallic structures using the chopped strand mat GFRP. Furthermore, it demonstrated the superiority of rectangular patches over semicircular ones, along with the benefit of using double patches for out-of-plane bending prevention and it emphasizes the detrimental effect of defects in the bonding area between the patch and the cracked component. This underlines the importance of proper surface preparation and bonding techniques for successful repair.

This study provides an analysis of patch repair for cracked aircraft structures. Delamination is a type of damage that affects the patch's behavior. The purpose of this study is to assess the influence of delamination on repair performance.

An analytical and numerical study using the finite element method was conducted for a cracked plate repaired with a patch containing a pre-existing delamination defect. The method for defining the contact pair surfaces and modeling the delamination interaction within the patch interface is specified using the virtual crack closure technique (VCCT) approach.

The efficiency of the repair is measured in terms of the J-integral. The effects of delamination initiation, mechanical loading, crack length and patch stacking sequences are presented. It is noted that in mode I, delamination propagation is only significant at node A. The numerical results are in good agreement with those of the analytical solution found in the literature. It is observed that the patch's behavior is strongly dependent on loading, crack size and stacking sequences in terms of reducing the structure's lifespan, especially in the presence of delamination.

The numerical modeling presented by the VCCT approach is highly valuable for studying delamination evolution. The influence of loading, crack size and stacking sequences on repair performance is discussed in this work.