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This paper introduces thermal‐stress analysis methods which follow electrical engineering procedures. The spring constant or c‐value is found to be related to the electrical impedance, combining dimensions and material characteristics in a performance parameter which simplifies calculations. Voltage is used to represent thermal deformation, and thermal forces are modelled as currents. Relationships equivalent to Ohm's Law are applied to calculate thermal stresses in leads or traces of surface‐mount assemblies. The thermal performance of laminates, e.g., thermal expansion coefficients of interconnect boards with a restraining core, and the thermal stresses in the bonded layers, are derived from the analysis of an electrical network which represents the composite structure. The method provides visual concepts which facilitate a first‐order solution of engineering problems related to thermal stress.

Thermal stress of the rotor in a squirrel cage induction motor is generated due to the temperature rise, and the structure of the rotor will be destroyed if the stress acted on the rotor exceeds its limits, so the thermal stress is also one of the main causes led to broken bar fault. The purpose of this paper is to report the thermal stress coupled analysis for the induction motor with healthy and faulty rotor, and to find the variation tendency of the temperature and thermal stress due to broken bars, and the part most likely to break in the rotor as a result of the thermal stress load are identified.

The steady temperature and thermal stress of the rotor in the case of the healthy and faulty conditions are calculated by finite element method, and the 3D model of the motor used in the experiments is established and the experimental results are presented for both healthy and faulty machines.

The influence of the broken bars fault on the motor thermal profile and thermal stress can be found, and it explains why the breaking point always appears in the joint of the bars and end rings.

The paper presents the 3D thermal stress coupled model and performance characteristics of induction motor with broken bars. The reasonable constraint is established according to the contact of components each other, and more reasonable fracture location is selected. The results obtained by the simulation model are in a good agreement with practical situation, because the effect of skewed rotor were taken into consideration in the process of simulation.

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper contains references to papers, conference proceedings and theses/dissertations on the subject that were published between 1977‐1998. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, ferrites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

The purpose of this paper is to propose the Laplace Adomian Decomposition Method (LADM) for studying the nonlinear temperature and thermal stress analysis of annular fins with time-dependent boundary condition.

The nonlinear behavior of temperature and thermal stress distribution in an annular fin with rectangular profile subjected to time-dependent periodic temperature variations at the root is studied by the LADM. The radiation effect is considered. The convective heat transfer coefficient is considered as a temperature function.

The proposed solution method is helpful in overcoming the computational bottleneck commonly encountered in industry and in academia. The results show that the circumferential stress at the root of the fin will be important in the fatigue analysis.

This study presents an effective solution method to analyze the nonlinear behavior of temperature and thermal stress distribution in an annular fin with rectangular profile subjected to time-dependent periodic temperature variations at the root by using LADM.

The purpose of this paper is to analyze and figure out the temperature field and thermal stress field with the calculation model of thermal insulation material and composite material.

The paper adopted the three-dimensional finite element algorithm.

The simulated results showed great shearing strength between the chipset and the printed circuit board. The position of chip exerts great influence on the distribution of temperature field and thermal stress field of circuit board. The reasonable distribution of chip will effectively reduce the temperature extremum and stress extremum of circuit board.

The paper analyzes and presents a discussion of the problems relating to the density of electronic packaging. The analysis process and the method of the paper provide essential help in resolving electronic device heat problems.

Analysis of the thermal effects during the packaging process or in the actual operating environment is necessary to develop small monolithic integrated sensing chips with heterogeneous integration. The use of multiple layers and various materials in monolithic integrated sensing chips addresses the coefficient of thermal expansion (CTE) mismatch issue. The purpose of this study is to focus on the residual stress analysis of the shielding electrode, which is a metal film that prevents pull-in of proof-mass during anodic bonding in microelectromechanical system (MEMS) chips with pressure sensors embedded in an accelerometer.

The finite element model of the chip was built by the commercial software ANSYS, and the residual stress was evaluated during the die attachment process for the shielding electrode. Various shielding electrode materials and a proposed design with a keep-out zone to reduce the residual stress are discussed, with a focus on the relationship between the geometric parameters of the chip and the residual stress for copper shielding electrodes of different thicknesses.

The results of the finite element analysis showed that the use of polysilicon as a shielding electrode in the proposed design generated the lowest residual stress because of its low CTE. The maximum stresses in both of in-plane and out-of-plane directions in the finite element model were reduced by keep-out zone design for the proposed design of the copper shielding electrode, and had 11 times reduction in out-of-plane direction especially, according to the nonlinear analysis as the stress concentration point in the shielding electrode moved. Moreover, the design with a thinner shielding electrode, thinner glass substrate and higher CTE of the glass substrate also lowered the maximum von Mises stress. On the other hand, the stress level during the operating temperature, without considering residual stress, overestimated up to five times in the proposed design.

In this study, valuable suggestions are proposed for the design of chips with pressure sensors embedded in accelerometers.

The following paper discusses the transient thermal stresses set up in a cellular wing structure when the aircraft is subjected to a change of speed or of altitude. It is found rftac for nings with little or no insulation (fie maximum stress in the wing is usually between 70 per cent and 85 per cent of the value given by Young's modulus for webs × coefficient of expansion for the skin × external temperature change: it is therefore concluded that of the metallic materials, the combination of Hfcht alloy webs with a steel skin is admirable in its effect in reducing the thermal stresses. The analysis used is exact within the limits of its assumptions and comparisons are made with an earlier solution of the same problem by Hoff, who used an approximate method.

This paper gives a review of the finite element techniques (FE) applied in the area of material processing. The latest trends in metal forming, non‐metal forming, powder metallurgy and composite material processing are briefly discussed. The range of applications of finite elements on these subjects is extremely wide and cannot be presented in a single paper; therefore the aim of the paper is to give FE researchers/users only an encyclopaedic view of the different possibilities that exist today in the various fields mentioned above. An appendix included at the end of the paper presents a bibliography on finite element applications in material processing for 1994‐1996, where 1,370 references are listed. This bibliography is an updating of the paper written by Brannberg and Mackerle which has been published in Engineering Computations, Vol. 11 No. 5, 1994, pp. 413‐55.

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.

The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.

Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.

Conventional wear models cannot satisfy the requirements of electrical contact wear simulation. Therefore, this study aims to establish a novel wear simulation model that considered the influence of thermal-stress-wear interaction to achieve high accuracy under various current conditions, especially high current.

The proposed electrical contact wear model was established by combining oxidation theory and the modified Archard wear model. The wear subroutine was written in FORTRAN, and adaptive mesh technology was used to update the wear depth. The simulation results were compared with the experimental results and the typically used stress-wear model. The temperature of the contact surface, distribution of the wear depth and evolution of the wear rate were analyzed.

With the increase in the current flow, the linear relationship between the wear depth and time changed to the parabola. Electrical contact wear occurred in two stages, namely, acceleration and stability stages. In the acceleration stage, the wear rate increased continuously because of the influence of material hardness reduction and oxidation loss.

In previous wear simulation models, the influence of multiple physical fields in friction and wear has been typically ignored. In this study, the oxidation loss during electrical contact wear was considered, and the thermo-stress-wear complete coupling method was used to analyze the wear process.