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The accuracy of the machining process is significantly impacted by the performance of hydrostatic bearings. This paper aims to analyze the influence of micro-textured on the performance of the hydrostatic bearing, and the performance of the bearing is improved by designing the arrangement of micro-textured.

Different designs have been used while creating micro-textured bearings. The finite element models of bearing with smooth and micro-textured were established and solved using the computational fluid dynamics method. The arrangement scheme of the micro-textured was evaluated by comparing the influence of the distribution position and arrangement of the micro-textured on the bearing performance.

To improve the performance of the bearing, the bearing capacity was significantly increased, and the friction coefficient of the bearing was decreased when the micro-textured was distributed in the form of an obtuse angle arrangement in the maximum pressure area of the bearing. The experimental findings validate the analysis method.

In this paper, the effect of irregularly arranged micro-textured on bearing performance is investigated to improve the bearing capacity and lubrication status.

The purpose of this paper is to present a method for ultrasonically molding polymer powder in a micro plastic part mold. In the method, a printed circuit board (PCB) in which micro‐hole arrays are drilled is used as a micro cavity insert. With the utilization of ultrasonic vibration, the polymer powder, which is prefilled and compacted in a micro cavity, mutually generates great sliding friction heat so as to be rapidly plasticized and molded.

Micro carbide drill bits of which the diameters are 100.0 μm, 150.0 μm and 200.0 μm, respectively, are used for drilling the PCB to form a micro‐hole array insert. Next, two kinds of various ultra‐high molecule weight polyethylene (UHMW‐PE) powder with various grain diameters are directly filled into a charging barrel and a mold cavity with the micro‐hole array insert. Proper process parameters are set on ultrasonic plasticizing and molding equipment so that a molding test can be performed. The melt of UHMW‐PE can be rapidly filled into the cavity. Finally, micro‐column array plastic parts are successfully prepared.

The micro‐hole array PCB is a mold insert which is quite applicable for the ultrasonic molding of the powder in the mold. When a molding material is the coarse UHMW‐PE powder with the grain diameter of about 350 μm, the diameter replication rates of the micro‐column array plastic parts become good in order with the increased micro‐hole diameter of the PCB. When the fine UHMW‐PE powder with the grain diameter of about 80 μm is adopted, the diameter replication rates of the micro‐column array plastic parts become good in order with the decreased micro‐hole diameter of the PCB.

In this paper, the micro‐column array plastic parts with good replicability are successfully prepared by a technique for ultrasonically plasticizing and molding in the cavity. The technique can be applied to the fields of medical treatment, communication, optics, chemistry and so on, such as biological micro needle arrays, micro biological chips, optical memories, and micro chemical reaction chips.

To determine the optimal dimensions for a stacked micro‐channel using the genetic algorithms (GAs) under different flow constraints.

GA is used as an optimization tool for optimizing the thermal resistance of a stacked micro‐channel under different flow constraints obtained by using the one dimensional (1D) and two dimensional (2D) finite element methods (FEM) and by thermal resistance network model as well (proposed by earlier researcher). The 2D FEM is used to study the effect of two dimensional heat conduction in the micro‐channel material. Some parametric studies are carried out to determine the resulting performance of the stacked micro‐channel. Different number of layers of the stacked micro‐channel is also investigated to study its effect on the minimum thermal resistance.

The results obtained from the 1D FEM analysis compare well with those obtained from the thermal resistance network model. However, the 2D FEM analysis results in lower thermal resistance and, therefore, the importance of considering the conduction in two dimensions in the micro‐channel is highlighted.

The analysis is valid for constant properties fluid and for steady‐state conditions. The top‐most surfaces as well as the side surfaces of the micro‐channel are considered adiabatic.

The method is very useful for practical design of micro‐channel heat‐sinks.

FEM analyses of stacked micro‐channel can be easily implemented in the optimization procedure for obtaining the dimensions of the stacked micro‐channel heat‐sinks for minimum thermal resistance.

The purpose of this paper is to calibrate the surface emissivity of micro drill bit and to investigate the effect of different drilling parameters on the temperature of micro drill bit in printed circuit board (PCB) micro drilling process.

The surface emissivity of micro drill bit was obtained by experiments. Analysis of variance (ANOVA) was applied in this study to analysis the effect of different drilling parameters on the temperature of micro drill bit in PCB micro hole drilling. The most significant influencing factor on micro drill bit temperature was achieved by ANOVA.

First, the surface emissivity of cemented carbide rod decreased from 0.4 to 0.32 slowly with temperature in the range of 50-220°C. Second, the most significant influencing factor on the micro drill bit temperature was spindle speed among the drilling parameters including spindle speed, retract rate and infeed rate.

In this paper, the influence of roughness of black coating, carbide rod and micro drill bit on the surface emissivity calibration and the temperature measurement was not considered.

A new simple method has been presented to calibrate the surface emissivity of micro drill bit. Through calibrating the surface emissivity of micro drill bit, the temperature of micro drill bit can be measured accurately by infrared thermometry. Analyzing the influences of different drilling parameters on the temperature of micro drill bit, the mechanism of drilling parameters on drilling temperature is achieved. The basis for the selection of drilling parameters to improve the hole quality is enhanced.

The purpose of this paper is to obtain the micro drill bit temperature field distribution in micro-drilling process and the temperature drop in retracting process with simulation software. Meanwhile, the key factors that affect the micro drill bit temperature will be obtained as well. The results can also be used to improve the accuracy in on-line drilling temperature measurement.

The purpose of this paper is to obtain the micro drill bit temperature field distribution in micro-drilling process and the temperature drop in retracting process with simulation software. Meanwhile, the key factors that affect the micro drill bit temperature will be obtained as well. The results can also be used to improve the accuracy in on-line drilling temperature measurement.

Micro drill bit high-temperature area mainly concentrates in the cutting edge and chisel edge. With the increase of spindle speed and feed speed, the micro drill bit highest temperature increased. The micro drill bit temperature drop rate reaches 20° in the micro-drilling retraction process with certain parameters. The micro drill bit highest temperature detected by an infrared camera is lower by 22° than that in real drilling. The simulation results can be used to guide the actual industrial production.

The simulation results can be applied to revise the temperature measurement by an infrared camera in the drilling process. Drilling experiments show that the simulation method is correct and has certain practical significance. The current temperature measurement method can satisfy most of the requirements of temperature measurements.

The purpose of this paper is to present key points relating to the development of micro drill bits with high aspect ratios and to provide a solution for high aspect ratio hole drilling.

Based on the analysis of challenges in high aspect ratio hole drilling, key points for the development of micro drills bit with high aspect ratio are discussed. A design example of a micro drill bit with 0.3 mm diameter and a 7.2 mm flute length is presented. Experiments are conducted to verify the performance of the developed micro drill bit.

Helix angle, web thickness and flute land ratio are three key parameters that significantly influence the behaviour of micro drill bits with high aspect ratios. Large helix angle, web thickness and flute land ratio are beneficial in terms of improving the performance of high aspect ratio micro drill bits. Step drilling is essential to prevent drill breakage and to ensure smooth debris evacuation. Meanwhile, proper steps and drilling parameters are of great importance to complete high aspect ratio hole drilling.

The paper highlights key points relating to the development of micro drill bits with high aspect ratios that can provide a satisfactory solution for high aspect ratio micro drill bit design.

Cutting tool wear is known to affect tool life, surface quality, cutting forces and production time. Micro-milling of difficult-to-cut materials like Inconel 718 leads to significant flank wear on the cutting tool. To ensure the respect of final part specifications and to study cutting forces and tool catastrophic failure, flank wear (VB) has to be controlled. This paper aims to achieve flank wear prediction during micro-milling process, which fills the void of the commercial finite element software.

Based on tool geometry structure and DEFORM finite element simulation, flank wear of the micro tool during micro-milling process is obtained. Finally, experiments of micro-milling Inconel 718 validate the accuracy of the proposed method for predicting flank wear of the micro tool during micro-milling Inconel 718.

A new prediction method for flank wear of the micro tool during micro-milling Inconel 718 based on the assumption that the wear volume can be assumed as a cone-shaped body is proposed. Compared with the existing experiment techniques for predicting tool wear during micro-milling process, the proposed method is simple to operate and is cost-effective. The existing finite element investigations on micro tool wear prediction mainly focus on micro tool axial wear depth, which affects size accuracy of machined workpiece seriously.

The research can provide significant knowledge on the usage of finite element method in predicting tool wear condition during micro-milling process. In addition, the method presented in this paper can provide support for studying the effect of tool flank wear on cutting forces during micro-milling process.

This study aims to examine the cross-sectional variation in risk of US-based micro-cap open-end mutual funds. Micro-cap mutual funds allow investors to access very low-priced stocks issued by the smallest of companies. The stock of these firms is usually not traded in major exchanges, and their financial information is not readily available and, thus, regarded as risky investments.

The author examines the cross-sectional variation in risk and higher moments of US-based micro-cap mutual funds in comparison with that of small-cap and mid-cap mutual funds. Total, systematic and idiosyncratic risk metrics, along with higher moments, are estimated before, during and after the 2008 financial crisis.

The author finds that, indeed, based on total and idiosyncratic risk metrics, the sample of micro-cap funds is riskier than the size-matched samples of small-cap and mid-cap funds. The author also reports that the sample of micro-cap funds fail to generate higher excess returns than the less risky small-cap and mid-cap funds.

To the best of the author’s knowledge, this is the first time that the risk of small-cap mutual funds has been examined.

The “Snap back” problem of the micro‐cantilever remains one of the dominant failure mechanisms in the Micro Electro‐mechanical System (MEMS). By analyzing the Hamaker micro continuum medium and solid physics principle, the consistency model of Wigner‐Seitz (W‐S) continuum medium is presented. The gap revision coefficients of the body with the face‐centered cubic structure are derived, which include the attractive force and the repulsive one. The adhesion model of the 500 µ m X 1 µ m silicon micro‐cantilever coated by Au is established. The micro‐cantilever static relationship between the elastic force and the adhesion force is discussed. The reason of the microcantilever “snap back” problem, an instable balanced point, is discovered. Increasing the rigidity of the micro‐cantilever, a method to avoid the micro‐cantilever “snap back” to happen, is put forward, which improves MEMS structure design and enhances MEMS reliability.

The purpose of this paper is to optimize the configuration sizes of micro‐channel cooling heat sink using the thermal resistance network model. The optimized micro‐channel heat sink is simulated by computational fluid dynamics method, and the total thermal resistance is calculated to compare with that of thermal resistance network model.

Taking the thermal resistance and the pressure drop as goal functions, a multi‐objective optimization model was proposed for the micro‐channel cooling heat sink based on the thermal resistance net work model. The Sequential Quadratic Programming procedure was used to do the optimization design of the structure size of the micro‐channel. The optimized micro‐channel heat sink was numerically simulated by computational fluid dynamics (CFD) software.

For the heat sink to cool a chip with the sizes of L × W = 2.5 mm × 2.5 mm and the power of 8 W, the optimized width and height of the micro‐channel are 154 μm and 1,000 μm, respectively, and its corresponding total thermal resistance is 8.255 K/W. According to the simulation results, the total thermal resistance of whole micro‐channel heat sink R_total is 7.596 K/W, which agrees well with the analysis result of thermal resistance network model.

The convection heat transfer coefficient is calculated approximatively here for convenience, and that may induce some errors. Originality/value –The maximum difference in temperature of the optimized micro‐channel cooling heat sink is 59.064 K, which may satisfy the requirement for removal of high heat flux in new‐generation chips.