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1 – 10 of over 17000Shahriar Abubakri, Pritpal S. Mangat, Konstantinos Grigoriadis and Vincenzo Starinieri
Microwave curing (MC) can facilitate rapid concrete repair in cold climates without using conventional accelerated curing technologies which are environmentally unsustainable…
Abstract
Purpose
Microwave curing (MC) can facilitate rapid concrete repair in cold climates without using conventional accelerated curing technologies which are environmentally unsustainable. Accelerated curing of concrete under MC can contribute to the decarbonisation of the environment and provide economies in construction in several ways such as reducing construction time, energy efficiency, lower cement content, lower carbonation risk and reducing emissions from equipment.
Design/methodology/approach
The paper investigates moisture loss and pore properties of six cement-based proprietary concrete repair materials subjected to MC. The impact of MC on these properties is critically important for its successful implementation in practice and current literature lacks this information. Specimens were microwave cured for 40–45 min to surface temperatures between 39.9 and 44.1 °C. The fast-setting repair material was microwave cured for 15 min to 40.7 °C. MC causes a higher water loss which shows the importance of preventing drying during MC and the following 24 h.
Findings
Portland cement-based normal density repair mortars, including materials incorporating pfa and polymer latex, benefit from the thermal effect of MC on hydration, resulting in up to 24% reduction in porosity relative to normal curing. Low density and flowing repair materials suffer an increase in porosity up to 16% due to MC. The moisture loss at the end of MC and after 24h is related to the mix water content and porosity, respectively.
Originality/value
The research on the application of MC for rapid repair of concrete is original. The research was funded by the European commission following a very rigorous and competitive review process which ensured its originality. Original data on the parameters of porosity and moisture loss under MC are provided for different generic cementitious repair materials which have not been studied before. Application of MC to concrete construction especially in cold climates will provide environmental, economic and energy benefits.
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Shivendra Singh Rathore and Chakradhara Rao Meesala
The purpose of this paper is to investigate the effect of the replacement of natural coarse aggregate (NCA) with different percentages of recycled coarse aggregate (RCA) on…
Abstract
Purpose
The purpose of this paper is to investigate the effect of the replacement of natural coarse aggregate (NCA) with different percentages of recycled coarse aggregate (RCA) on properties of low calcium fly ash (FA)-based geopolymer concrete (GPC) cured at oven temperature. Further, this paper aims to study the effect of partial replacement of FA by ground granulated blast slag (GGBS) in GPC made with both NCA and RCA cured under ambient temperature curing.
Design/methodology/approach
M25 grade of ordinary Portland cement (OPC) concrete was designed according to IS: 10262-2019 with 100% NCA as control concrete. Since no standard guidelines are available in the literature for GPC, the same mix proportion was adopted for the GPC by replacing the OPC with 100% FA and W/C ratio by alkalinity/binder ratio. All FA-based GPC mixes were prepared with 12 M of sodium hydroxide (NaOH) and an alkalinity ratio, i.e. sodium hydroxide to sodium silicate (NaOH:Na2SiO3) of 1:1.5, subjected to 90°C temperature for 48 h of curing. The NCA were replaced with 50% and 100% RCA in both OPC and GPC mixes. Further, FA was partially replaced with 15% GGBS in GPC made with the above percentages of NCA and RCA, and they were given ambient temperature curing with the same molarity of NaOH and alkalinity ratio.
Findings
The workability, compressive strength, split tensile strength, flexural strength, water absorption, density, volume of voids and rebound hammer value of all the mixes were studied. Further, the relationship between compressive strength and other mechanical properties of GPC mixes were established and compared with the well-established relationships available for conventional concrete. From the experimental results, it is found that the compressive strength of GPC under ambient curing condition at 28 days with 100% NCA, 50% RCA and 100% RCA were, respectively, 14.8%, 12.85% and 17.76% higher than those of OPC concrete. Further, it is found that 85% FA and 15% GGBS-based GPC with RCA under ambient curing shown superior performance than OPC concrete and FA-based GPC cured under oven curing.
Research limitations/implications
The scope of the present paper is limited to replace the FA by 15% GGBS. Further, only 50% and 100% RCA are used in place of natural aggregate. However, in future study, the replacement of FA by different amounts of GGBS (20%, 25%, 30% and 35%) may be tried to decide the optimum utilisation of GGBS so that the applications of GPC can be widely used in cast in situ applications, i.e. under ambient curing condition. Further, in the present study, the natural aggregate is replaced with only 50% and 100% RCA in GPC. However, further investigations may be carried out by considering different percentages between 50 and 100 with the optimum compositions of FA and GGBS to enhance the use of RCA in GPC applications. The present study is further limited to only the mechanical properties and a few other properties of GPC. For wider use of GPC under ambient curing conditions, the structural performance of GPC needs to be understood. Therefore, the structural performance of GPC subjected to different loadings under ambient curing with RCA to be investigated in future study.
Originality/value
The replacement percentage of natural aggregate by RCA may be further enhanced to 50% in GPC under ambient curing condition without compromising on the mechanical properties of concrete. This may be a good alternative for OPC and natural aggregate to reduce pollution and leads sustainability in the construction.
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D.T. Hsu, H.K. Kim, F.G. Shi, H.Y. Tong, S. Chungpaiboonpatana, C. Davidson and J.M. Adams
The curing reaction of a promising “no flow” flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill…
Abstract
The curing reaction of a promising “no flow” flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill can reach complete cure within 20 minutes at various cure temperatures. It is also shown that this “no flow” underfill could fully cure within one minute at 160°C after being heated at 220°C for one minute, demonstrating that this “no flow” underfill can be completely cured during the solder reflow cycle. The reaction order and the rate constant are determined to describe the curing progress. It is shown that the autocatalytic effect dominates the reaction kinetics.
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Seok-Hwan Huh, Kang-Dong Kim and Keun-Soo Kim
The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system…
Abstract
Purpose
The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 90° peel test.
Design/methodology/approach
In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system.
Findings
The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm−1) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.
Research limitations/implications
It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro- and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials.
Originality/value
From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.
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Kalyan Ghosh, Patricia Garcia and Ernest Galgoci
Reports results from studies conducted on a polyfunctional amine adduct epoxy curing agent (EPI‐CURE DPC‐3293) as a means to design low temperature cure coatings. Through the…
Abstract
Reports results from studies conducted on a polyfunctional amine adduct epoxy curing agent (EPI‐CURE DPC‐3293) as a means to design low temperature cure coatings. Through the judicious choice of epoxide resins and amine‐functional curing agents, relatively fast reaction rates and resistance to moisture and humidity are maintained under low‐temperature cure conditions, and that is evidenced by a good balance of performance properties of coating films. We have used differential scanning calorimetry (DSC) to study the extent of reaction as well as the glass transition temperatures (Tg). Electrochemical impedance spectroscopy (EIS) has been used to predict the barrier properties of coating films. These results are compared with epoxide resins cured with a phenalkamine curing agent to illustrate some of the unique advantages of using multifunctional amine adduct curing agents for the curing of epoxide resins under sub‐ambient cure conditions for a multitude of end‐use applications.
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UV light curing of adhesives has become the method of choice for many more industrial bonding, sealing, coating, potting and tacking applications. Because faster cures provide…
Abstract
UV light curing of adhesives has become the method of choice for many more industrial bonding, sealing, coating, potting and tacking applications. Because faster cures provide more efficient manufacturing processes and lower total assembly cost, and because light curing adhesives are being used in more kinds of applications, both the range of resins and curing equipment now available has expanded dramatically. Outlines the performances of currently available UV adhesives, their application and selection of UV light sources.
Masahiro Inoue and Katsuaki Suganuma
This paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy‐based binder that are caused by differences in…
Abstract
Purpose
This paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy‐based binder that are caused by differences in the curing conditions.
Design/methodology/approach
In‐situ monitoring of the various processes that were used to cure the ICA revealed that electrical conduction in the ICA specimens depends on both the high‐temperature curing conditions and the conditions during cooling to temperatures below the glass transition temperature (Tg).
Findings
The electrical resistivity of the cured ICA specimens after cooling to ambient temperature decreased with increasing degree of conversion, tending towards a convergence value that decreased with increasing curing temperature. The electrical resistivity of the specimens also varied significantly depending on the subsequent annealing process. However, the electrical resistivity achieved after annealing at temperatures above the curing temperatures clearly depended on the particular curing temperature that was used. The characteristics of the polymer structure in the adhesive binder are considered to be different, depending on the curing temperature, and this affects the electrical properties of the ICA;, i.e. the characteristics of the polymer structure obtained during the curing process affect the electrical resistance of the ICA, even after subsequent annealing processes.
Research limitations/implications
This paper discusses generalities of variation in the electrical properties of ICAs during heating and cooling processes. The variation in behaviour in practice will differ depending on the type of adhesive binder in the ICA.
Originality/value
This paper clarifies how the electrical properties of ICAs evolve during the curing, annealing and cooling processes.
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T. Maity, B.C. Samanta, S. Dalai and A.K. Banthia
In order to study its cure response and to understand its kinetic behaviour, this paper seeks to examine how a multifunctional epoxy resin…
Abstract
Purpose
In order to study its cure response and to understand its kinetic behaviour, this paper seeks to examine how a multifunctional epoxy resin, N,4‐bis(4‐(bis(2‐oxiranylmethyl)amino)‐2‐chlorobenzyl)‐3‐chloro‐N‐(2‐oxiranylmethyl)benzenamine (BCCOMB), synthesised from amine functional chloroaniline formaldehyde condensate (AFCFC) and epichlorohydrine, is cured with AFCFC as curing agent.
Design/methodology/approach
For effective curing, AFCFC (12.5 phr, part per 100 resin) was added to BCCOMB resin and mixed thoroughly for 15 minutes. The clear viscous solution was then subjected to DSC analyses for kinetics study of the curing reaction.
Findings
The AFCFC was successfully utilised as curing agents for BCCOMB as the DSC curves show complete curing exotherm. The presence of oxirane group in the BCCOMB was able to react with active hydrogen atoms of amine. This led to conversion of liquid monomers of thermoset resin into three‐dimensional network.
Research limitations/implications
In the present discussion, the curing study of BCCOMB had been done using AFCFC as a curing agent. However, other curing agents, synthesised from other amine and aldehyde, could also be used to see whether they would be effective for curing study of BCCOMB.
Originality/value
The method for curing study of multifunctional epoxy resin (BCCOMB) was novel and the cured epoxy network could find numerous applications as surface coating and adhesive on to an intricate structure.
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Tithi Maity and Bidhan Samanta
The purpose of this paper is to investigate the curing efficiency of amine functional aniline furfuraldehyde condensate (AFAFFC) for diglycidyl ether of bisphenol A (DGEBA) resin…
Abstract
Purpose
The purpose of this paper is to investigate the curing efficiency of amine functional aniline furfuraldehyde condensate (AFAFFC) for diglycidyl ether of bisphenol A (DGEBA) resin to achieve toughness, chemical resistance, etc.
Design/methodology/approach
To study curing reaction, the curing agent AFAFFC is synthesised first from the reaction of aniline and furfuraldehyde in acid medium and characterised by Fourier transform infrared spectroscopic analysis, elemental analysis, concentration of primary and secondary amine analysis. Then, equimolecular mixture of AFAFFC and DGEBA is subjected to curing reaction and the reaction is followed by differential scanning calorimetry (DSC) analysis. The kinetic studies of this curing reaction, mechanical properties, dynamic mechanical analysis and thermogravimetric analysis (TGA) of cured epoxy are also reported.
Findings
The DSC analysis shows the complete exotherms of effective curing reaction indicating the efficiency of AFAFFC as curing agent for DGEBA resin. The kinetic studies reveal that the curing reaction is first order. Mechanical properties reflect the brittleness of cured matrix and TGA shows that the cured matrixes are stable up to around 240°C.
Research limitations/implications
The curing agent AFAFFC has been synthesised by using aniline and furfuraldehyde. By changing amine and aldehyde, other curing agents could be synthesised and the curing efficiency of these for epoxy resin could also be studied.
Originality/value
The method for curing study of epoxy resin (DGEBA) is novel and relevant as the cured products have high performance applications in protective coatings and adhesives for most substrates.
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Seng‐Neon Gan and Kim‐Teck Teo
Reports the effects of composition and curing temperature on the film properties of three water reducible enamels prepared from palm stearin alkyds. The properties studied were…
Abstract
Reports the effects of composition and curing temperature on the film properties of three water reducible enamels prepared from palm stearin alkyds. The properties studied were hardness, flexibility, and adhesion. While all the formulations exhibit excellent adhesion, generally increasing the melamine content and curing temperature can increase the hardness but reduce the resistance to cracking and deformation of the coating. Applies Fourier transform infra‐red spectroscopy (FTIR) to the study of the curing reactions. Finds that FTIR is able to identify the predominant cross‐linking reactions.
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