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‘The Joining Environment’ Dates: 14–15 October 1992 Venue: Forte Posthouse, Coventry, England This Conference will provide a venue for discussion on advances in joining technology, and papers will cover a wide range of scientific and technical developments, focusing in particular on soldering, brazing and diffusion bonding practices which may involve environmental considerations.
Date: 26 October 1995 Venue: The National Motorcycle Museum, Solihull, West Midlands The above Conference will consist of Soldering and Brazing sessions which will run in parallel, with the opportunity for delegates to transfer between sessions. In each case a keynote speaker will set the scene by reviewing progress in these industries over the last 25 years. Thereafter the focus of the sessions will be to discuss the evolving technologies which will shape the industry over the next 25 years.
Heraeus of Hanau, W. Germany, have introduced a new solder paste (Series SC 3300), designed for SM technology. Heraprint and Cermalloy solder paste formulations eliminate the formulation of solder balls during reflow, thus assuring very high yields. The organic system in these materials prevents crusting and viscosity changes while providing rheology characteristics which allow improved screen printing resolution.