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Article
Publication date: 18 October 2021

Danna Tang, Yushen Wang, Zheng Li, Yan Li and Liang Hao

The low-temperature sintering of silica glass combined with additive manufacturing (AM) technology has brought a revolutionary change in glass manufacturing. This study aims to…

Abstract

Purpose

The low-temperature sintering of silica glass combined with additive manufacturing (AM) technology has brought a revolutionary change in glass manufacturing. This study aims to carry out in an attempt to achieve precious manufacturing of silicate glassy matrix through the method of slurry extrusion.

Design/methodology/approach

A low-cost slurry extrusion modelling technology is used to extrude silicate glassy matrix inks, composed of silicate glass powder with different amounts of additives. Extrudability of the inks, their printability window and the featuring curves of silicate glassy matrix are investigated. In addition, the properties of the low-temperature sintering green part as a functional part are explored and evaluated from morphology, hardness and colour.

Findings

The results showed that the particle size was mainly distributed from 1.4 µm to 5.3 µm, showing better slurry stability and print continuity. The parameters were set to 8 mm/s, 80% and 0.4 mm, respectively, to achieve better forming of three-dimensional (3D) samples. Besides, the organic binder removal step was concentrated on 200°C–300°C and 590°C–650°C was the fusion bonding temperature of the powder. The hardness values of 10 test samples ranged from 588 HL to 613 HL, which met the requirements of hard stones with super-strong mechanical strength. In addition, the mutual penetration of elements caused by temperature changes may lead to a colourful appearance.

Originality/value

The custom continuous AM technology enables the fabrication of a glass matrix with 3D structural features. The precise positioning technology of the glass matrix is expected to be applied more widely in functional parts.

Details

Rapid Prototyping Journal, vol. 28 no. 4
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 1 June 2021

Yushen Wang, Wei Xiong, Danna Tang, Liang Hao, Zheng Li, Yan Li and Kaka Cheng

Traditional simulation research of geological and similar engineering models, such as landslides or other natural disaster scenarios, usually focuses on the change of stress and…

Abstract

Purpose

Traditional simulation research of geological and similar engineering models, such as landslides or other natural disaster scenarios, usually focuses on the change of stress and the state of the model before and after destruction. However, the transition of the inner change is usually invisible. To optimize and make models more intelligent, this paper aims to propose a perceptible design to detect the internal temperature change transformed by other energy versions like stress or torsion.

Design/methodology/approach

In this paper, micron diamond particles were embedded in 3D printed geopolymers as a potential thermal sensor material to detect the inner heat change. The authors use synthetic micron diamond powder to reinforced the anti-corrosion properties and thermal conductivity of geopolymer and apply this novel geopolymer slurry in the direct ink writing (DIW) technique.

Findings

As a result, the addition of micron diamond powder can greatly influence the rheology of geopolymer slurry and make the geopolymer slurry extrudable and suitable for DIW by reducing the slope of the viscosity of this inorganic colloid. The heat transfer coefficient of the micron diamond (15 Wt.%)/geopolymer was 50% higher than the pure geopolymer, which could be detected by the infrared thermal imager. Besides, the addition of diamond particles also increased the porous rates of geopolymer.

Originality/value

In conclusion, DIW slurry deposition of micron diamond-embedded geopolymer (MDG) composites could be used to manufacture the multi-functional geological model for thermal imaging and defect detection, which need the characteristic of lightweight, isolation, heat transfer and wave absorption.

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