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Article
Publication date: 6 February 2009

Mario Gonzalez, Fabrice Axisa, Frederick Bossuyt, Yung‐Yu Hsu, Bart Vandevelde and Jan Vanfleteren

The purpose of this paper is to present an update on the progress of the design and reliability of stretchable interconnections for electronic circuits.

Abstract

Purpose

The purpose of this paper is to present an update on the progress of the design and reliability of stretchable interconnections for electronic circuits.

Design/methodology/approach

Finite element modelling (FEM) is used to analyse the physical behaviour of stretchable interconnects under different loading conditions. The fatigue life of a copper interconnect embedded into a silicone matrix has been evaluated using the Coffin‐Manson relation and FEM.

Findings

The mechanical properties of the substrate and the design of the metal interconnection play an important role on the fatigue lifetime of circuit. In the case of copper embedded into a PDMS Sylgard 186, more than 2,500 tensile cycles have been observed for a periodic deformation of 10 per cent.

Research limitations/implications

Reliability results are limited and need further work to create a more accurate empirical model to estimate the lifetime of stretchable interconnections.

Originality/value

The combined use of FEM and experimental analysis enable a more reliable design of the stretchable metal interconnections. The proposed horseshoe design offers the benefit of reduced permanent damage during elongation.

Details

Circuit World, vol. 35 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

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Article
Publication date: 26 January 2010

Yung‐Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde and Ingrid de Wolf

The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for “fine pitch” applications in stretchable electronics.

Abstract

Purpose

The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for “fine pitch” applications in stretchable electronics.

Design/methodology/approach

A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home‐built electromechanical measurement is carried out by the four‐probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading.

Findings

The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out‐of‐plane peeling, and strain localized at the crest of a zigzag structure.

Originality/value

In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.

Details

Microelectronics International, vol. 27 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

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