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This study empirically investigated the different attributes (i.e. convenience, online reviews, online ratings, visual appeal and various food choices) of food delivery applications (FDAs) that impacted customers' perceived benefits, satisfaction and loyalty. Price consciousness was positioned as the moderator while customer satisfaction was positioned as the mediator.

Utilizing the purposive sampling technique, 360 useable respondents were gathered from existing FDAs' customers in China. Partial least squares structural equation modelling (PLS-SEM) was employed to verify the interrelationships among variables.

The results confirmed the significant impact of four FDA attributes (i.e. convenience, online ratings, visual appeal and various food choices) on perceived benefits. Customer satisfaction positively influenced loyalty. Moreover, the mediating role of customer satisfaction and the moderating role of price consciousness were confirmed.

FDA operators should engage in providing more benefits to stimulate satisfaction and loyalty among customers. Promotion discounts remain a key factor in enhancing the satisfaction and loyalty of price-conscious customers.

This study extends the applicability of the stimulus–organism–response (SOR) framework and enriches FDA literature by assessing the external stimuli, organisms and moderating factors that trigger customer loyalty.

This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted at low temperature.

The results showed that with a continuous increase in the Zn-particle content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu₆Sn₅ to wavy-shaped Cu₅Zn₈. Moreover, the IMC thickness of the upper/lower interface of joints first decreased and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content continued to increase, the shear strengths of the joints decreased. Additionally, when the Zn content increased to 50%, because the oxidation degree of Zn particles increased, the joints were mainly broken among Zn particles.

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the Cu/Cu joint at 180°C.

With the development of digitalization and interconnection, there is a growing need for enterprise customers to ensure the compatibility of the third-party components they are using in the manufacturing process, thus raising the integration requirements for the Industrial Internet platform and its third-party developers. Therefore, our study investigates the optimal integration decision of the Industrial Internet platform while considering its access price, the integration cost, and the net utility derived by enterprise customers from the third-party components.

We model a two-sided Industrial Internet platform that connects customers on the demand side to the developers on the supply side. We then explore the integration decision of the Industrial Internet platform and its important factors by solving the optimal profit function.

First, despite the high integration cost of third-party developers, the platform still chooses to integrate when enterprise customers derive high utility from the third-party components. Second, due to the compatibility effect, charging the enterprise customers a higher price may reduce the platform profits when these customers derive low utility from the third-party components. Third, the platform profits will increase along with the integration cost of third-party developers when it is low in the case where enterprise customers derive low utility from third-party components.

Our findings offer insightful takeaways for the Industrial Internet platform when making integration decisions.

This study examines the relationship between internal control and corporate environmental responsibility.

Unlike US studies that concentrate solely on internal control over financial reporting, this study uses a comprehensive index that encompasses internal control over financial reporting, operations, and compliance. Corporate environmental responsibility is measured by environmental investments. Our research sample comprises Chinese listed firms from 2010 to 2018.

The results demonstrate a positive correlation between internal control and corporate environmental investments. Furthermore, we find that firms with high-quality internal control can improve their financial and environmental performance through environmental investments. After decomposing internal control into its five components, we show that the control environment, control activities, and information and communication components exhibit stronger effects on environmental investments than the risk assessment and monitoring components. Finally, the cross-sectional analyses reveal that the positive effect of internal control is more pronounced in private firms and in firms that are subject to weaker environmental regulation.

By focusing on the effect of a comprehensive internal mechanism on corporate environmental responsibility in China, this study contributes to the literature in developed-country settings that overwhelmingly focuses on the impact of external stakeholders and regulations.

This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted.

The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn₅ intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu₅Zn₈ and for another layer, the IMCs near the solder were CuZn₅. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer.

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints.

A new method that 1 um Zn-particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched.

The composition of the intermetallic compounds (IMCs) on the upper and lower interfaces of Cu/SACZ/Cu joints remained unchanged, which was Cu₅Zn₈ in aging process, and the thickness of the IMCs on the upper and lower interfaces of the Cu/SACZ/Cu joints increased accordingly. Compared with the as-received joints, the thickness of the upper and lower interfaces IMCs of the soldering aged time for 24 h increased by 404.7% and 505.5% at 150ºC, respectively. The IMCs formation tendency and the IMCs growth rate of the lower interface are larger than those of the upper interface because the soldering seam near the IMCs at the upper and lower interfaces of the as-received joints were mostly white SAC0307 balls black Zn-particles, respectively. The growth activation energy of IMCs in the upper and lower interfaces is about 89.21 and 55.11 kJ/mol, respectively. Under the same aging time, with the increase of the aging temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than that of the as-received joints because the oxidation degree of Zn particles in the joint with the increase of aging temperature and time.

Cu/Cu joints were successfully achieved under ultrasonic-assisted at low-temperature.

This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints.

A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength.

The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu₅Zn₈) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu₅Zn₈) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface.

The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.

With continuous concerning on the toxic of element Pb, Pb-free solder was gradually used to replace traditional Sn-Pb solder. However, during the transition period from Sn-Pb to Pb-free solder, mixing of Sn-Pb and Pb-free is inevitable occurred in certain products, and in China where Sn-Pb solder was still used extensively in certain areas especially. Correspondingly, understanding reliability of Sn-Pb solder joints was very important, and further studies were needed.

Thermal shock test between −55°C and 125 °C was conducted on Sn-37Pb solder bumps in the BGA package to investigate the microstructure evolution and the growth mechanism of interfacial intermetallic compound (IMC) layer. The effects of thermal shock on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

Pb-rich phase was coarsened and voids were increased at first; Pb-rich phase was refined and voids were decreased secondly with the increase of thermal shock cycles; the shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67MPa at 2,000 cycles; interfacial IMCs of solder bumps was from typical scallop-type into smooth, the composition of IMCs was from Cu₆Sn₅ into Cu₆Sn₅ and Cu₃S_n after thermal shock with 1,500 and 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure respectively.

Compared with the board level test method, the impact shear test for the single solder bump is more convenient and economical and is actively pursued by the industries. The shear strength of solder bumps was slightly decreased after thermal shock, but was back up to 73.67 MPa at 2,000 cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure.

The purpose of this paper is to investigate the negative consequences of employee perceptions of supervisor self-interested behavior (SIB). Using social exchange theory, the authors argue that perceived supervisor SIB reduces affective commitment to the supervisor (ACS), which in turn fosters employees’ negative reciprocal behavior in the form of counterproductive work behavior – interpersonal (CWBI) and counterproductive work behavior – organizational (CWBO). In addition, the authors identify employee power distance orientation (PDO) as an important contingent factor that influences the indirect effects.

Using a final sample of 441 employees from 146 workgroups across 6 firms in China, the hypotheses are tested using multilevel path analysis to account for the nesting effects.

Perceived supervisor SIB is negatively related to ACS, which in turn is related to employee CWBI and CWBO. Furthermore, employee PDO moderates the indirect effects of perceived supervisor SIB on employee CWBI and CWBO through decreased ACS. Specifically, when employee PDO is low, the indirect effects on employee CWBI and CWBO are stronger.

This is one of the first studies to investigate the influence of employee perceptions of supervisor SIB on negative employee behavior in the workplace. Furthermore, it furthers our understanding of how negative exchange can stimulate negative reciprocal behavior, which is a relatively underexplored area. Another strength of this paper is the multi-time survey design and the adoption of multilevel path analysis.

This paper aims to investigate an identification strategy for the nonlinear state-space model (SSM) in the presence of an unknown output time-delay. The equations to estimate the unknown model parameters and output time-delay are derived simultaneously in the proposed strategy.

The unknown integer-valued time-delay is processed as a latent variable which is uniformly distributed in a priori known range. The estimations of the unknown time-delay and model parameters are both realized using the Expectation-Maximization (EM) algorithm, which has a good performance in dealing with latent variable issues. Moreover, the particle filter (PF) with an unknown time-delay is introduced to calculated the Q-function of the EM algorithm.

Although amounts of effective approaches for nonlinear SSM identification have been developed in the literature, the problem of time-delay is not considered in most of them. The time-delay is commonly existed in industrial scenario and it could cause extra difficulties for industrial process modeling. The problem of unknown output time-delay is considered in this paper, and the validity of the proposed approach is demonstrated through the numerical example and a two-link manipulator system.

The novel approach to identify the nonlinear SSM in the presence of an unknown output time-delay with EM algorithm is put forward in this work.