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The main purpose of this paper was to evaluate the validation process of food safety control measures.

The validation of control measures has been analyzed at 50 food companies in Serbia. The sample included companies that produce food of both plant and animal origin and have certified food safety management systems. A total of 156 control measures that combat physical hazards (41.6%), followed by microbial hazards (34.0%) and chemical hazards (24.4%), have been analyzed. To enable quantification of the validation protocols, each control measure was assigned a score.

The validation scores showed that the highest level of validation was observed in large companies, as opposed to small and medium-sized companies (p < 0.05). The type of food safety hazards and the food sector did not reveal any statistical differences in-between the scores. The main approach to validating control measures was referring to the technical documentation of equipment used (52.6%), followed by scientific and legal requirements (30.7%). Less than 20% of the analyzed control measures were validated with operational data collected on-site. No mathematical modeling was observed for the sampled food companies. Future steps should include the development of validation guides for different types of control measures and training modules.

This study can serve as an improvement guide for food safety consultants, food safety auditors, certification bodies, inspection services, food technologists and food managers.

This study is one of the first to provide an insight into how food companies validate their control measures to combat microbial, chemical and physical food safety hazards.

This paper aims to study the relationship between the ball grid array (BGA) flip-chip underfilling process parameter and its void formation region.

A set of top-down scanning acoustic microscope images of BGA underfill is collected and void labelled. The labelled images are trained with a convolutional neural network model, and the performance is evaluated. The model is tested with new images, and the void area with its region is analysed with its dispensing parameter.

All findings were well-validated with reference to the past experimental results regarding dispensing parameters and their quantitative regional formation. As the BGA is non-uniform, 85% of the test samples have void(s) formed in the emptier region. Furthermore, the highest rating factor, valve dispensing pressure with a Gini index of 0.219 and U-type dispensing pattern set of parameters generally form a lower void percentage within the underfilling, although its consistency is difficult to maintain.

This study enabled manufacturers to forecast the void regional formation from its filling parameters and array pattern. The filling pressure, dispensing pattern and BGA relations could provide qualitative insights to understand the void formation region in a flip-chip, enabling the prompt to formulate countermeasures to optimise voiding in a specific area in the underfill.

The void regional formation in a flip-chip underfilling process can be explained quantitatively with indicative parameters such as valve pressure, dispensing pattern and BGA arrangement.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

Porosity is a commonly analyzed defect in the laser-based additive manufacturing processes owing to the enormous thermal gradient caused by repeated melting and solidification. Currently, the porosity estimation is limited to powder bed fusion. The porosity estimation needs to be explored in the laser melting deposition (LMD) process, particularly analytical models that provide cost- and time-effective solutions compared to finite element analysis. For this purpose, this study aims to formulate two mathematical models for deposited layer dimensions and corresponding porosity in the LMD process.

In this study, analytical models have been proposed. Initially, deposited layer dimensions, including layer height, width and depth, were calculated based on the operating parameters. These outputs were introduced in the second model to estimate the part porosity. The models were validated with experimental data for Ti6Al4V depositions on Ti6Al4V substrate. A calibration curve (CC) was also developed for Ti6Al4V material and characterized using X-ray computed tomography. The models were also validated with the experimental results adopted from literature. The validated models were linked with the deep neural network (DNN) for its training and testing using a total of 6,703 computations with 1,500 iterations. Here, laser power, laser scanning speed and powder feeding rate were selected inputs, whereas porosity was set as an output.

The computations indicate that owing to the simultaneous inclusion of powder particulates, the powder elements use a substantial percentage of the laser beam energy for their melting, resulting in laser beam energy attenuation and reducing thermal value at the substrate. The primary operating parameters are directly correlated with the number of layers and total height in CC. Through X-ray computed tomography analyses, the number of layers showed a straightforward correlation with mean sphericity, while a converse relation was identified with the number, mean volume and mean diameter of pores. DNN and analytical models showed 2%–3% and 7%–9% mean absolute deviations, respectively, compared to the experimental results.

This research provides a unique solution for LMD porosity estimation by linking the developed analytical computational models with artificial neural networking. The presented framework predicts the porosity in the LMD-ed parts efficiently.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This article introduces the Special Issue on Sustainable Management of Heritage Buildings in long-term perspective.

It starts by reviewing the gaps in knowledge and practice which led to the creation and implementation of the research project SyMBoL—Sustainable Management of Heritage Buildings in long-term perspective funded by the Norwegian Research Council over the 2018–2022 period. The SyMBoL project is the motivation at the base of this special issue.

The editorial paper briefly presents the main outcomes of SyMBoL. It then reviews the contributions to the Special Issue, focussing on the connection or differentiation with SyMBoL and on multidisciplinary findings that address some of the initial referred gaps.

The article shortly summarizes topics related to sustainable preservation of heritage buildings in time of reduced resources, energy crisis and impacts of natural hazards and global warming. Finally, it highlights future research directions targeted to overcome, or partially mitigate, the above-mentioned challenges, for example, taking advantage of no sestructive techniques interoperability, heritage building information modelling and digital twin models, and machine learning and risk assessment algorithms.

This study evaluates the potential of using the material extrusion (MEX) process for recycling waste tire rubber (WTR). By investigating the process parameters, mechanical behaviour and morphological characterisation of a thermoplastic polyurethane-waste tire rubber composite filament (TPU-WTR), this study aims to establish a framework for end-of-life tire (ELT) recycling using the MEX technology.

The research assesses the impact of various process parameters on the mechanical properties of the TPU-WTR filament. Hysteresis analysis and Poisson’s ratio estimation are conducted to investigate the material’s behaviour. In addition, the compressive performance of diverse TPU-WTR triply periodic minimal surface lattices is explored to test the filament suitability for printing intricate structures.

Results demonstrate the potential of the TPU-WTR filament in developing sustainable structures. The MEX process can, therefore, contribute to the recycling of WTR. Mechanical testing has provided insights into the influence of process parameters on the material behaviour, while investigating various lattice structures has challenged the material’s capabilities in printing complex topologies.

This research holds significant social implications addressing the growing environmental sustainability and waste management concerns. Developing 3D-printed sustainable structures using recycled materials reduces resource consumption and promotes responsible production practices for a more environmentally conscious society.

This study contributes to the field by showcasing the use of MEX technology for ELT recycling, particularly focusing on the TPU-WTR filament, presenting a novel approach to sustainable consumption and production aligned with the United Nations Sustainable Development Goal 12.

This study aims to analyze the factors, evaluation techniques of the durability of existing railway engineering.

China has built a railway network of over 150,000 km. Ensuring the safety of the existing railway engineering is of great significance for maintaining normal railway operation order. However, railway engineering is a strip structure that crosses multiple complex environments. And railway engineering will withstand high-frequency impact loads from trains. The above factors have led to differences in the deterioration characteristics and maintenance strategies of railway engineering compared to conventional concrete structures. Therefore, it is very important to analyze the key factors that affect the durability of railway structures and propose technologies for durability evaluation.

The factors that affect the durability and reliability of railway engineering are mainly divided into three categories: material factors, environmental factors and load factors. Among them, material factors also include influencing factors, such as raw materials, mix proportions and so on. Environmental factors vary depending on the service environment of railway engineering, and the durability and deterioration of concrete have different failure mechanisms. Load factors include static load and train dynamic load. The on-site rapid detection methods for five common diseases in railway engineering are also proposed in this paper. These methods can quickly evaluate the durability of existing railway engineering concrete.

The research can provide some new evaluation techniques and methods for the durability of existing railway engineering.

The purpose of this study is to increase awareness of current supply chain (SC) security-related issues by providing an extensive analysis of existing SC security solutions and their limitations. The security of SCs has received increasing attention from researchers, due to the emerging risks associated with their distributed nature. The increase in risk in SCs comes from threats that are inherently similar regardless of the type of SC, thus, requiring similar defence mechanisms. Being able to identify the types of threats will help developers to build effective defences.

In this work, we provide an analysis of the threats, possible attacks and traceability solutions for SCs, and highlight outstanding problems. Through a comprehensive literature review (2015–2021), we analysed various SC security solutions, focussing on tracking solutions. In particular, we focus on three types of SCs: digital, food and pharmaceutical that are considered prime targets for cyberattacks. We introduce a systematic categorization of threats and discuss emerging solutions for prevention and mitigation.

Our study shows that the current traceability solutions for SC systems do not offer a broadened security analysis and fail to provide extensive protection against cyberattacks. Furthermore, global SCs face common challenges, as there are still unresolved issues, especially those related to the increasing SC complexity and interconnectivity, where cyberattacks are spread across suppliers.

This is the first time that a systematic categorization of general threats for SC is made based on an existing threat model for hardware SC.