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Article
Publication date: 3 February 2012

245

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Soldering & Surface Mount Technology, vol. 24 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 22 February 2011

60

Abstract

Details

Assembly Automation, vol. 31 no. 1
Type: Research Article
ISSN: 0144-5154

Content available
Article
Publication date: 1 December 2004

106

Abstract

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Assembly Automation, vol. 24 no. 4
Type: Research Article
ISSN: 0144-5154

Keywords

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Article
Publication date: 1 August 2000

29

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

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Article
Publication date: 13 February 2007

Pete Starkey and Martin Goosey

267

Abstract

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Circuit World, vol. 33 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 August 2001

31

Abstract

Details

Microelectronics International, vol. 18 no. 2
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 31 July 2009

J. Buckley, B. O'Flynn, J. Barton and S.C. O'Mathuna

The purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit (FPC). The…

5127

Abstract

Purpose

The purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit (FPC). The device is very suitable for wearable applications in which small size and lightweight are required such as body area network, medical, sports and entertainment applications.

Design/methodology/approach

Modern wireless inertial measurement units are typically implemented on a rigid 2D printed circuit board (PCB). The design concept presented here is based around the use of a novel planar, six‐faceted, crucifix or cross‐shaped FPC instead of a rigid PCB. A number of specific functional blocks (such as microelectromechanical systems gyroscope and accelerometer sensors, microcontroller (MCU), radio transceiver, antenna, etc.) are first assigned to each of the six faces which are each 1 cm2 in area. The FPC cross is then developed into a 1 cm3, 3D configuration by folding the cross at each of five bend planes. The result is a low‐volume and lightweight, 1 cm3 wireless inertial sensor that can sense and send motion sensed data wirelessly to a base station. The wireless sensor device has been designed for low power operation both at the hardware and software levels. At the base station side, a radio receiver is connected to another MCU unit, which sends received data to a personal computer (PC) and graphical user interface. The industrial, scientific and medical band (2.45 GHz) is used to achieve half duplex communication between the two sides.

Findings

A complete wireless sensor system has been realized in a 3D cube form factor using an FPC. The packaging technique employed during the work is shown to be efficient in fabricating the final cubic system and resulted in a significant saving in the final size and weight of the system. A number of design issues are identified regarding the use of FPC for implementing the 3D structure and the chosen solutions are shown to be successful in dealing with these issues.

Research limitations/implications

Currently, a limitation of the system is the need for an external battery to power the sensor system. A second phase of development would be required to investigate the possibility of the integration of a battery and charging system within the cube structure. In addition, the use of flexible substrate imposes a number of restrictions in terms of the ease of manufacturability of the final system due to the requirement of the required folding step.

Practical implications

The small size and weight of the developed system is found to be extremely useful in different deployments. It would be useful to further explore the system performance in different application scenarios such as wearable motion tracking applications. In terms of manufacturability, component placement needs to be carefully considered, ensuring that there is sufficient distance between the components, bend planes and board edges and this leads to a slightly reduced usable area on the printed circuit.

Originality/value

This paper provides a novel and useful method for realizing a wireless inertial sensor system in a 3D package. The value of the chosen approach is that a significant reduction in the required system volume is achieved. In particular, a 78.5 per cent saving in volume is obtained in decreasing the module size from a 25 to a 15 mm3 size.

Details

Microelectronics International, vol. 26 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 31 July 2009

166

Abstract

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Assembly Automation, vol. 29 no. 3
Type: Research Article
ISSN: 0144-5154

Content available
Article
Publication date: 27 July 2012

217

Abstract

Details

Assembly Automation, vol. 32 no. 3
Type: Research Article
ISSN: 0144-5154

Content available
Article
Publication date: 1 September 2002

46

Abstract

Details

Circuit World, vol. 28 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

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