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Article
Publication date: 23 August 2021

Xiuqi Wang, Fenglian Sun, Bangyao Han, Yilun Cao, Jinyang Du, Long Shao and Guohuai Liu

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying…

Abstract

Purpose

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability.

Design/methodology/approach

Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints.

Findings

The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC.

Originality/value

This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

Details

Soldering & Surface Mount Technology, vol. 34 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 6 June 2016

Bingsheng Xu, Yan Wu, Lina Zhang, Junwei Chen and Zhangfu Yuan

This research aims to provide a theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and…

207

Abstract

Purpose

This research aims to provide a theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and V-shaped substrate, which also gives guidance for those complicated welding operation objects in brazing technique.

Design/methodology/approach

Wetting experiments were performed to measure the contact angles at different temperatures of molten Sn-3.0Ag-0.5Cu wetting on the quartz substrate with an included angle of 90°. According to the experimental results, the theoretical spreading morphology of molten solder on V-shaped substrate at corresponding temperature was simulated by Surface Evolver.

Findings

The theoretical morphology profiles of the molten solder sitting on the V-shaped substrate are simulated using Surface Evolver when the molten solder reaches spreading equilibrium. The spreading mechanisms as well as the impact of surface tension and gravity on interfacial energy of the molten solder wetting on the V-shaped groove substrate are also discussed where theoretical results agree well with experiment results. The contact area between the gas and liquid phases shows a tendency of first increasing and later decreasing. Otherwise, the spreading distance and the height of the molten solder increases as the droplet volume increases as the included angle and the contact angle are given as constants, and both the interfacial energy and the gravitational energy increase as well. This research has a wide influence on predicting the outcomes in commercial impact and also gives guidance for those complicated welding operation objects in brazing technique.

Research limitations/implications

It is of very important significance in both science and practice to investigate the differences between the flat surface and V-shaped surface. Some necessary parameters including intrinsic contact angle and surface tension need to be directly measured when the droplet spreads on the flat surface. The relevant simulation conclusions on the inherent characteristics can be given based on these intrinsic parameters. Compared with the flat surface, the V-shaped substrate is chosen for further discuss on the effects of gravity on the droplet spreading behavior and the changes of apparent contact angle which can only occurs as the substrate is inclined. Therefore, this research provides theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and substrate.

Practical implications

The research is developed for verifying the accuracy of the model built in Surface Evolver. Based on this verified model, other researches on the spreading distance along y-axis and the contact area that are especially difficult to be experimentally measured can be directly simulated by Surface Evolver, which can provides a convenient method to discuss the changes of horizontal spreading distance, droplet height and contact area with increasing the included angle of V-shaped substrate or with increasing the droplet volume. Actually, the modeling results are calculated for supplying the theoretical parameters and technical guidance in the welding process.

Social implications

This research provides theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and substrate, which has a wide influence on prediction the outcomes in commercial impact and also gives guidance for those complicated welding operation objects in brazing technique.

Originality/value

Surface Evolver, can also be used to discuss the structure and spreading mechanism of droplets on V-shaped substrates, which have not been discussed before.

Details

Soldering & Surface Mount Technology, vol. 28 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 February 1988

G. Schouten

This paper describes some fundamental aspects involved in wave soldering of surface mount devices. Calculations are given on capillary behaviour to provide a greater understanding…

Abstract

This paper describes some fundamental aspects involved in wave soldering of surface mount devices. Calculations are given on capillary behaviour to provide a greater understanding of the problems involved in wetting SMDs. The soldering of SMDs with a new single wave soldering concept will also be featured.

Details

Circuit World, vol. 14 no. 3
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 1 December 2004

George K. Stylios

Examines the tenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects…

3513

Abstract

Examines the tenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.

Details

International Journal of Clothing Science and Technology, vol. 16 no. 6
Type: Research Article
ISSN: 0955-6222

Keywords

Article
Publication date: 1 December 2002

George K. Stylios

Looks at the eighth published year of the ITCRR and the research, from far and near, involved in this. Muses on the fact that, though all the usual processes are to the fore, the…

Abstract

Looks at the eighth published year of the ITCRR and the research, from far and near, involved in this. Muses on the fact that, though all the usual processes are to the fore, the downside part of the industry is garment making which is the least developed side. Posits that the manufacture of clothing needs to become more technologically advanced as does retailing. Closes by emphasising support for the community in all its efforts.

Details

International Journal of Clothing Science and Technology, vol. 14 no. 6
Type: Research Article
ISSN: 0955-6222

Keywords

Article
Publication date: 1 December 2003

George K. Stylios

Examines the ninth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects…

1197

Abstract

Examines the ninth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.

Details

International Journal of Clothing Science and Technology, vol. 15 no. 6
Type: Research Article
ISSN: 0955-6222

Keywords

Article
Publication date: 1 May 1970

R.G. Clifton, G.B. Roberts and J.R. Williams

IT is one of the hard facts of life that tyres tend to skid more readily under wet road or runway conditions — this is a most unsatisfactory basic situation and merits the…

Abstract

IT is one of the hard facts of life that tyres tend to skid more readily under wet road or runway conditions — this is a most unsatisfactory basic situation and merits the greatest possible effort to make a substantial improvement. The problem has been studied basically by various bodies including N.A.S.A.

Details

Aircraft Engineering and Aerospace Technology, vol. 42 no. 5
Type: Research Article
ISSN: 0002-2667

Article
Publication date: 9 February 2010

B. Wessling, M. Rischka and J. Posdorfer

The purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes.

Abstract

Purpose

The purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes.

Design/methodology/approach

This new finish utilises nanotechnology and is based on a new formulation of the “organic metal” (OM).

Findings

The final surface finish is an approximately 50 nm thin permanent layer, consisting of a complex between the OM and silver (Ag). Panels finished with OrmeSTAR™ Ultra show excellent solderability in spite of a low‐layer thickness and therefore offer significant advantages over existing surface finishes.

Originality/value

This new finish has proven to be a competitive alternative to current final finishes with excellent properties for soldering applications. The new nanotechnology can also significantly improve the environmental and economical consequences of solderable surface finishing.

Details

Circuit World, vol. 36 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 5 May 2022

Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Azman Jalar, Mohamad Riduwan Ramli and Fakhrozi Che Ani

Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate…

Abstract

Purpose

Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area.

Design/methodology/approach

The dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering.

Findings

The results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints.

Originality/value

The reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.

Details

Microelectronics International, vol. 39 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 21 March 2016

Andrea Zocca, Cynthia Gomes, Ulf Linow, Heidi Marx, Jörg Melcher, Paolo Colombo and Jens Günster

This paper aims to present an additive manufacturing-based approach in which a new strategy for a thermally activated local melting and material flow, which results in…

Abstract

Purpose

This paper aims to present an additive manufacturing-based approach in which a new strategy for a thermally activated local melting and material flow, which results in densification of printed structures, is introduced.

Design/methodology/approach

For enabling this self-organized relaxation of printed objects by the viscous flow of material, two interconnected structures are printed simultaneously in one printing process, namely, Structure A actually representing the three dimensional object to be built and Structure B acting as a material reservoir for infiltrating Structure A. In an additional process step, subsequent to the printing job, an increase in the objects’ temperature results in the melting of the material reservoir B and infiltration of structure A.

Findings

A thermally activated local melting of the polymethylsilsesquioxane results in densification of the printed structures and the local formation of structures with minimum surface area.

Originality/value

The present work introduces an approach for the local relaxation of printed three-dimensional structures by the viscous flow of the printed material, without the loss of structural integrity of the structure itself. This approach is not restricted only to the materials used, but also offers a more general strategy for printing dense structures with a surface finish far beyond the volumetric resolution of the 3D printing process.

Details

Rapid Prototyping Journal, vol. 22 no. 2
Type: Research Article
ISSN: 1355-2546

Keywords

1 – 10 of over 5000