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This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

The purpose of this paper is to examine the mechanical characteristics and optimization of wear parameters of hybrid (TiO₂ + Y₂O₃) nanoparticles with Al matrix using squeeze casting technique.

The hybrid aluminium matrix nanocomposites (HAMNCs) were fabricated with varying concentrations of titanium oxide (TiO₂) and yttrium oxide (Y₂O₃), from 2.5 to 10 Wt.% in 2.5 Wt.% increments. Dry sliding wear test variables were optimized using the Taguchi method.

The introduction of hybrid nanoparticles in the aluminium (Al) matrix was evenly distributed in contrast to the base matrix. HAMNC6 (5 Wt.% TiO₂ + 5 Wt.% Y₂O₃) reported the maximum enhancement in mechanical properties (tensile strength, flexural strength, impact strength and density) and decrease in porosity% and elongation% among other HAMNCs. The results showed that the optimal combination of parameters to achieve the lowest wear rate was A3B3C1, or 15 N load, 1.5 m/s sliding velocity and 200 m sliding distance. The sliding distance showed the greatest effect on the dry sliding wear rate of HAMNC6 followed by applied load and sliding velocity. The fractured surfaces of the tensile sample showed traces of cracking as well as substantial craters with fine dimples and the wear worn surfaces were caused by abrasion, cracks and delamination of HAMNC6.

Squeeze-cast Al-reinforced hybrid (TiO₂+Y₂O₃) nanoparticles have been investigated for their impact on mechanical properties and optimization of wear parameters.

This study aims to present an experimental approach to develop a high-strength 3D-printed recycled polymer composite reinforced with continuous metal fiber.

The continuous metal fiber composite was 3D printed using recycled and virgin acrylonitrile butadiene styrene-blended filament (RABS-B) in the ratio of 60:40 and postused continuous brass wire (CBW). The 3D printing was done using an in-nozzle impregnation technique using an FFF printer installed with a self-modified nozzle. The tensile and single-edge notch bend (SENB) test samples are fabricated to evaluate the tensile and fracture toughness properties compared with VABS and RABS-B samples.

The tensile and SENB tests revealed that RABS-B/CBW composite 3D printed with 0.7 mm layer spacing exhibited a notable improvement in Young’s modulus, ultimate tensile strength, elongation at maximum load and fracture toughness by 51.47%, 18.67% and 107.3% and 22.75% compared to VABS, respectively.

This novel approach of integrating CBW with recycled thermoplastic represents a significant leap forward in material science, delivering superior strength and unlocking the potential for advanced, sustainable composites in demanding engineering fields.

Limited research has been conducted on the in-nozzle impregnation technique for 3D printing metal fiber-reinforced recycled thermoplastic composites. Adopting this method holds the potential to create durable and high-strength sustainable composites suitable for engineering applications, thereby diminishing dependence on virgin materials.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

The purpose of this paper is to develop a concept and design to cast Al alloys/metal matrix composites (MMCs) by continuous casting process. The various steps involved in the evolution of the design have been reported and discussed in this study.

On the basis of developed design concept, initial prototype design has been prepared in this study. The casting process's melt flow pattern was studied via computer simulation, and the resulting changes were implemented in the original design. The single-phase fluid flow pattern through bottom feeding technique is studied. The equipment was fabricated based on computer simulation and water modelling studies. Finally, validation was performed for the preparation of Al alloys/ MMCs after parameter optimisation. The results were observed in the optical metallography to confirm the alloying and Al MMC preparation.

The developed continuous casting process with bottom feeding technique for the addition of constituent particles shows more efficiency in comparison to the existing batch processes. The final manufactured setup demonstrates effective Al alloy/MMC production as the basis for final fabrication has been accomplished by both computer simulation and water model test. In addition, the microstructure exhibits homogeneous distribution, validating the reliability of the setup.

Integrating continuous casting with continuous reinforcement or master alloy addition is novel in this area. The constraints that batch production had that have been rectified will also lower the contemporary cost of production.

The purpose of this study is to enhance the functional properties of Hessian fabric through resin finishing. Hessian bags made of lignocellulosic jute fiber are commonly used to pack, store and transport agro-commodities, including horticultural crops such as rice, potato, onion and wheat. However, because of high water affinity, these bags undergo degradation in properties due to moisture release by the stored commodities themselves. Exposure to natural elements, e.g. rain and dew, also causes moisture absorption in hessian bags. Once the bag gets moistened, degradation of jute bags starts due to microbial attack, leading to loss in tensile strength and change in extensibility, leading to ultimate breakage in warp and weft directions of the fabric.

To overcome the degradation in the functional properties of hessian fabric due to exposure to moisture and microbial attack, the application of semi-synthetic polymeric materials was carried out.

Tenacity, bursting strength, puncture resistance, tear strength and breaking load, as well as life cycle of resin-treated jute fabric was found to be better than control jute.

To the best of the authors’ knowledge, no recent reports of resin finishing on jute (hessian) fabric with semi-synthetic resins are presently available, other than coating with rubber.

Polyurethane (PUR) foam parts are traditionally manufactured using metallic molds, an unsuitable approach for prototyping purposes. Thus, rapid tooling of disposable molds using fused filament fabrication (FFF) with polylactic acid (PLA) and glycol-modified polyethylene terephthalate (PETG) is proposed as an economical, simpler and faster solution compared to traditional metallic molds or three-dimensional (3D) printing with other difficult-to-print thermoplastics, which are prone to shrinkage and delamination (acrylonitrile butadiene styrene, polypropilene-PP) or high-cost due to both material and printing equipment expenses (PEEK, polyamides or polycarbonate-PC). The purpose of this study has been to evaluate the ease of release of PUR foam on these materials in combination with release agents to facilitate the mulding/demoulding process.

PETG, PLA and hardenable polylactic acid (PLA 3D870) have been evaluated as mold materials in combination with aqueous and solvent-based release agents within a full design of experiments by three consecutive molding/demolding cycles.

PLA 3D870 has shown the best demoldability. A mold expressly designed to manufacture a foam cushion has been printed and the prototyping has been successfully achieved. The demolding of the part has been easier using a solvent-based release agent, meanwhile the quality has been better when using a water-based one.

The combination of PLA 3D870 and FFF, along with solvent-free water-based release agents, presents a compelling low-cost and eco-friendly alternative to traditional metallic molds and other 3D printing thermoplastics. This innovative approach serves as a viable option for rapid tooling in PUR foam molding.

The purpose of this paper is to study the correlation between different topographies and the reaction of Ulva Linza fouling species.

In this research, topographies with a different method, such as hot embossing and hot pulling, were achieved, and biological analyses were done with macroalgae Ulva Linza cells. The effect of topography via local binding geometry (honeycomb size gradients) and Wenzel roughness on the settling of Ulva microorganisms was tested.

As a result, Ulva spores confirmed different reactions to a similar set of tapered microstructures that was in agreement with the results on distinct honeycombs. The local binding geometry and the Wenzel roughness factor “r” were dominant on settling of Ulva Linza spores.

The reaction of an organism at the interface of vehicles’ substrate is powerfully affected by surface topographies.

The best embedment occurred on structures with bigger sizes than Ulva Linza’s spores. The density of settled spores was proportional to Wenzel roughness and the spores favour to attach to “kink sites” positions.

Unfortunately, unpleasant aggregation of marine biofouling on marine vehicles’ surfaces, generate terrific difficulties in the relevant industry.

There was a sharp relationship between Wenzel roughness and settle of Ulva Linza spores. The local binding geometry and the Wenzel roughness factor “r” were dominant on settling of Ulva Linza spores.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

The purpose of this paper is to develop a coupled lattice Boltzmann model for the simulation of the freezing process in unsaturated porous media.

In the developed model, the porous structure with complexity and disorder was generated by using a stochastic growth method, and then the Shan-Chen multiphase model and enthalpy-based phase change model were coupled by introducing a freezing interface force to describe the variation of phase interface. The pore size of porous media in freezing process was considered as an influential factor to phase transition temperature, and the variation of the interfacial force formed with phase change on the interface was described.

The larger porosity (0.2 and 0.8) will enlarge the unfrozen area from 42 mm to 70 mm, and the rest space of porous medium was occupied by the solid particles. The larger specific surface area (0.168 and 0.315) has a more fluctuated volume fraction distribution.

The concept of interfacial force was first introduced in the solid–liquid phase transition to describe the freezing process of frozen soil, enabling the formulation of a distribution equation based on enthalpy to depict the changes in the water film. The increased interfacial force serves to diminish ice formation and effectively absorb air during the freezing process. A greater surface area enhances the ability to counteract liquid migration.