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Article
Publication date: 1 September 2004

Wei‐Ping Dow and Hsiang‐Hao Chen

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to…

Abstract

Printed circut boards (PCBs) have diminished in size and, simultaneously, their circuit densities have increased. Conventional multi‐layered PCBs have a limitation to higher packaging densities. This paper introduces a new copper electroplating formula that is able to fill vias and through holes simultaneously and is used in a DC plating method, in which the copper thickness deposited on the board surface is relatively very thin after the electroplating is completed.

Details

Circuit World, vol. 30 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

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Article
Publication date: 1 September 2004

Cheng‐Ching Yeh, Kuo‐Hsing Lan, Wei‐Ping Dow, Jui‐Hsia Hsu, Cliff Lee, Chih‐Hao Hsu, Ken Lee, Jordan Chen and Philip Lu

The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporate high density…

Abstract

The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporate high density interconnection technology (such as build‐up and semi‐additive processes). Micro stacked via is one technology utilized to produce high‐density structures. Dielectric resin, conductive paste or via plating are usually applied for the filling process. As compared with other filling methods, via filling plating technology has advantages in offering a shorter process and higher reliability. This paper discusses the influence of different equipment design, operating conditions and additives on via filling plating technology.

Details

Circuit World, vol. 30 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

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Article
Publication date: 16 August 2019

Zhihua Tao, Guanting Liu, Yuanxun Li and Hua Su

The adsorption and acceleration behavior of 3-mercaptopropyl sulfonate (MPS) were investigated by electrochemical tests for microvia filling by copper electroplating.

Abstract

Purpose

The adsorption and acceleration behavior of 3-mercaptopropyl sulfonate (MPS) were investigated by electrochemical tests for microvia filling by copper electroplating.

Design/methodology/approach

The synergistic effects of one suppressor of propylene oxide ethylene oxide propylene oxide named PEP and MPS as the accelerator during copper electroplating were also investigated by electrochemical methods such as electrochemical impedance spectroscopy cyclic voltammetric stripping (CVS) and Galvanostatic measurements (GMs).

Findings

The research results suggest that the adsorption of MPS onto the Cu-RDE metal surface was a spontaneous process and the adsorbing of MPS on cathode was proposed to physical-chemistry adsorption in the plating formula. There was no potential difference (i.e. ?? = 0) of GMs until MPS was injected into the plating solution suggest that copper deposition is not diffusion-controlled in the presence of PEP–Cl–JGB.

Originality/value

A new composition of plating bath was found to be effective to perform bottom-up copper filling of microvias in the fabrication of PCB in electronic industries. The adsorption of MPS into the Cu-RDE metal surface was a spontaneous process and the adsorbing of MPS on cathode was studied by EIS and the results proposed to physical-chemistry adsorption in the plating formula. An optimal plating solution composed of CuSO4, H2SO4, chloride ions, PEP, MPS and JGB was obtained, and the microvia could be fully filled using the plating formula.

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