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The purpose of this paper was to attempt to confirm the root cause of wafer damage issue by heavy Al wire wedge bonding and propose some permanent solutions for it.

The infra red–optical beam-induced resistance change (IR-OBIRCH) analysis defines the position of an abnormal hotspot. A cross section and an scanning electron microscope (SEM) confirmed the wafer damage issue and its position. Based on the position of wafer damage, the wedge tool with different life and Al buildup was checked found to be on the wedge tool. Finite element analysis (FEA) modeling analysis and simulation experiment guarantee the Al buildup, and low wedge deformation thickness (WDT) can cause the wafer damage issue. Finally, design of experiment (DOE) experiments are designed to optimize wedge tool dimension and wedge-bond parameters to eliminate wafer damage issue.

Wafer damage issue caused the Vpwr-OUTPUT leakage issue by IR-OBIRCH analysis. Al buildup was found on wedge tool with different life and its size gets larger along with the increase in wedge tool life. Low WDT and bigger Al buildup can cause the wafer damage. Designing new wedge tool and parameters optimization can increase WDT.

Because of the limitation of time and resources, finite element method (FEM) modeling and wedge tool dimension could not be studied more deeply.

This paper sets an example on how to find out the root cause of wafer damage by a step-by-step analysis and put forward a quick solution accordingly for the issue.

The purpose of this paper is to investigate the wear resistance behavior of the striated tool for cross wedge rolling (CWR).

A mechanical-thermal coupled, temperature-dependent FE wear model was developed to explore the wear behaviors for striated CWR tools. To verify the proposed FE model, a newly developed measuring device was also developed to measure wear on the tool ridge. To find the impact order of the parameters of striate unit, orthogonal experiment was carried out.

The experimental and numerical results both indicate that the wear resistance of striated tool is better than that of smooth tool. Minimum tool ridge wear can be achieved by choosing proper tool contact temperature with striated units on crossed ridge. The order of the striation geometrical factors’ impact on ridge wear is striation width > striation interval > striation length.

Because of the specified tool, the research results may lack generalizability. Therefore, researchers are encouraged to test the proposed propositions further.

It is shown that the wear resistance of striated CWR tool is better than that of smooth tool. The information may help CWR manufactures to design and produce tools with less wear.

This paper is aimed at Engineers involved in production wire‐bonding processes and system maintenance. It traces the development of microbonding from its origins to the present day. Principles and techniques are examined and some approaches to fault diagnosis are explored.

The dramatic expansion in the use and capability of electronic devices in recent years has been facilitated by the substantial development of production techniques. Modern electronic circuits as used in the computer, defence, aerospace, vehicle and domestic appliance industries contain a great many joints and these have to be made reliably and economically without degrading sensitive circuit components. This article describes the major microjoining developments currently of interest to the microelectronics industry, with emphasis on the work conducted by the microjoining section of The Welding Institute, much of which has been directly sponsored by the UK Ministry of Defence (DCVD).

Selection of the correct interconnection technique for high lead count integrated circuits is dependent on technical and economic factors, in particular in small batch production of application specific devices (ASICs). This paper reviews some of the interconnection options and describes work where some advances in high density interconnection have been made.

A tribological investigation into the per formance of metal cutting fluid by inducing a radioactive condition into the tool.

This paper reviews methods of quality control for the ultrasonic wire bonding process. It also covers the basic principles of the process, a model for the bonding mechanism, and the criteria which determine bond quality. In practice, quality control in production is mainly by batch destructive testing and by ensuring consistent performance of the bonding machine by, for example, periodic calibration. A more desirable approach is that of in‐process monitoring and control of every joint made. Although in‐process techniques have been extensively studied, they are currently little used because of the lack of a universal system, doubts on reliability and access problems. The in‐process monitoring and control techniques which have been studied have concentrated on methods which involve the detection of variations in the mechanical impedance of the bond zone; these are reflected back into the excitation system of the equipment during bond formation. It is believed that further development of these techniques, coupled with simultaneous monitoring of associated parameters, e.g., bonding wire deformation, offers hope of improved process control.

Supply chain network design choices and the challenges in implementing and understanding how alternatives influence firm performance are key management skills that can be applied to the case of a global company, Kulicke and Soffa Industries, Inc. (K&S), and its expansion strategy. Suitable for the MBA, EMBA, GMBA, and executive education programs, the case explores the decision to expand the company's tool bonding capacity in order to manage its growth. The question becomes whether to grow current operations in Yokneam Israel or seek alternative sites. And if it was decided to seek a location outside of Israel, where exactly should the company go?

Trimming a film resistor to its nominal value by notching resistor with a finely adjusted stream of an abrasive material, such as aluminium oxide, directly against the resistor surface.