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The complexity of microelectronic circuits, their scale of integration and clock speed requirements have been increasing steadily. All these changes have the effect of increasing the power density of the microcircuits. ICs with a power of several watts and an area of over a square centimetre are quite common. Thus, there is more heat generated per device at die, component and substrate‐attach levels of electronic packaging. In order to maintain reliability of finished products, the junction temperature of the constituent devices must be kept low. It has been demonstrated that thermal management can be one key to lowering the cost and increasing the performance life of microelectronic products. The cost‐effectiveness of lowering device temperature has been demonstrated to be dramatic compared with the cost of thermal management materials. Proper thermal management of advanced microelectronic devices has to be addressed at all levels. One should address the problem from the basic level of die‐attach, through component‐attach, and eventually substrate‐attach to thermal drains. Thermal management is almost invariably coupled with a thermally induced stress problem. The increase in temperature at the device level also means a larger fluctuation of temperature from the ambient. Each cycle of on‐off for the device represents one thermal cycle. Stress‐induced failure due to coefficient of thermal expansion (CTE) mismatch is much more acute for higher power devices. In this paper, the authors address the issue of thermally induced stress on the microelectronic product at all levels of packaging, with major emphasis on component and substrate levels. Various ways and examples of reducing or eliminating this stress, which is a major cause of device failures, will be demonstrated. One of the proven methods is through the use of low Tg epoxies with high thermal stability.

An important disadvantage of conducting adhesives is their inferior heat conductivity when compared with soft solder such as Sn60Pb40. Thermal simulations, however, show that, by using thinner layers of adhesive than of solder, the module's thermal resistance does not increase greatly. Test modules with four different silver filled epoxy adhesives and tin/lead solder were manufactured. These test modules contained power diodes, 30 A, 1000 V, die bonded onto Ag/Pt thick film conductors on alumina. The die bond adhesive layer thicknesses were typically 30 or 40 μm. For die bond solder layers the thickness was 90 μm. The alumina substrates were connected to 3 mm thick copper plates with filled epoxy or silicone adhesive. The thickness of these layers was 150 μm or 50 μm, respectively. Thermal resistance of the structures was measured. The results showed that good adhesion between joined surfaces is essential for optimised heat flow. The heat conductivity of an adhesive was only a secondary factor affecting the structure's thermal resistance. When the adhesive joint is of good quality, the replacement of solder with conductive adhesives does not increase the module's thermal resistance any more than as shown by the simulations. It should, however, be remembered that the printing of thin (< 20 μm) uniform layers is not always possible.

ZAKEL, E., SIMON, J. and SCHULER, S., Verbindungstechnik in der Elektronik, Vol. 2, No. 2, pp. 53–57, June (1990) TAB is an attractive microconnecting technology for chips with a high number of I/Os. The principles of TAB technology and some new developments are presented. These are concerned with the problems of reducing pressure during gang bonding and the absence of the possibility of bumping single chips. The solutions presented are bonding with a liquid gold‐tin cushion for stress compensation and the application of selective electroless plating solutions for the bumping process. The possibilities of making TAB technology available for small and medium‐size companies are pointed out.

This study aims to investigate whether firms’ involvement in socially provocative business activities or businesses that are inconsistent with Shariah principles affect auditor’s perceived risk associated with the financial reporting information.

This study uses a median regression with measures that are consistent with prior literature. This study comprises of 11,799 firm-year observations obtained from MSCI environmental, sustainable and governance STATS database.

The results provide evidence indicating that auditors relatively charge higher audit fees for Shariah non-compliant firms except for firms that are involved with alcohol and gambling businesses. Firms that are involved in gambling activities report relatively lower audit fees, whereas firms with high involvement in alcohol business activities report non-significant relationship with audit fees.

The findings suggest that on average, ethical contextualisation on perceived acceptable behaviours is relatively consistent across beliefs and the severe lack of it has implications on auditors’ business risk assessment. However, as a social construct, the conception of ethical behaviour is highly dependent on the change in the societal values and therefore this explains the variance in the expected findings for gambling and alcohol business activities.

This study adds to the existing business risk literature, by examining the under-explored association between Shariah non-compliant risk and auditors’ perceived risk, measured by audit fees in a non-Muslim majority setting.

This paper aims at presenting the analysis of the views of construction participants in China’s construction industry on three major site safety issues. First, data from three distinctive roles (project managers, safety officers, and foremen) on site safety knowledge were analysed. Results indicate that they have low levels of safety knowledge. This is consistent with the existing literature, implying that safety training and education is a major issue around the world. In addition, the views of project managers and safety officers are further elicited on the second issue (that is, factors affecting site safety) and the third issue (that is, methods for improving project safety management). Results indicate that both parties have quite consistent views. The six most important factors are “lack of attention to safety protection by workers”, “lack of attention to safety management by main contractors/project managers”, “insufficient safety training”, “inadequate safety level”, “tiredness of workers”, and “poor quality of construction materials and equipments”. The five most promising methods are “increase in safety investment in terms of manpower, capital and finance”, “improvement in safety operations”, “no alcohol at work”, “increase in safety training and education for workers”, and “increase in safety inspection”. Discussions are given in this paper.

Weather is one of the main factors affecting labour productivity. Existing weather-productivity models focussed on hot and cold climates paying less attention to the tropics. Many tropical countries are expected to be the most areas affected by accelerated climate change and global warming, which may have a severe impact on labour health and productivity. The purpose of this paper is to assess whether the existing models can be used to predict labour productivity based on weather conditions in the tropics.

Five models are identified from the literature for evaluation. Using real labour productivity data of a high-rise building project in Malaysia, the actual productivity rate was compared with predicted productivity rates generated using the five models. The predicted productivity rates were generated using weather variables collected from an adjusting weather station to the project.

Compared with other models evaluated in this paper, the United States Army Corps of Engineers (USACE) was found to be the best model to predict productivity based on the case study data. However, the result shows only a 57% accuracy level of the USACE model indicating the need to develop a new model for the tropics for more accurate prediction.

The result of this study is perhaps the first to apply meteorological variables to predict productivity rates and validate them using actual productivity data in the tropics. This study is the first step to developing a more accurate productivity model, which will be useful for project planning and more accurate productivity rate estimation.

Corporate apologies, relative to other responses to well-publicized past transgressions, have distinct implications, sparking a rich tradition of apology research. But in addition, each apology is unique, such that it becomes critical to address individual content (what), spokesperson (who), timing (when) and delivery (how) elements. This paper aims to clarify how people evaluate key apology elements (individually and collectively) and the associated trade-off between short-term risks (e.g. business costs) and long-term benefits (e.g. relational assets), in light of key contingency factors that represent the level of the transgression-related threat to the firm.

An in-depth conceptual review, analysis and synthesis of corporate apology theories, research, business practices and case examples underlie the development of a conceptual framework that features 6 key tenets and 16 formal, testable propositions.

The holistic apology framework details how and why different corporate apology elements individually and collectively influence firm performance, in the presence of key transgression-related factors. The outlined tenets and propositions, in turn, provide clear guidelines for how to design and implement effective corporate apology strategies in response to publicized transgressions, as well as a platform for academics to advance research in this domain.

This paper contributes to apology theories by proposing 6 key tenets and 16 formal, testable propositions, incorporating apology mechanisms, contingencies and strategies (i.e. corporate apology typology), thus providing a more comprehensive view of corporate apologies in the marketing discipline.

This paper introduces 6 official tenets and 16 associated propositions that collectively (and interactively) serve as strategic guidelines for managers and opportunities for academics to advance research in this domain.

The proposed conceptual framework offers a novel, holistic understanding of the fundamental components of a corporate apology.

This paper highlights that the strategic use of design, a competitive pattern typically associated with creative industries, those creating and trading meanings, also characterizes industries that produce functional or utilitarian goods not typically considered creative. The paper explores the origins of this phenomenon in the context of three industry settings: cars, speciality coffee and personal computers. The analysis theorizes three distinct strategic paths that explain how design may become an institutionalized aspect of competition in industries that are not creative. We explain how firms link their products to the identities of their users, how design is linked to stakeholders' emotions and visceral reactions to products and how intermediaries are relevant to enhancing attention to design. Illuminating these strategic paths allows harnessing some of the well-established understandings about competition in creative industries towards understanding competition in noncreative industries.

Trust is a key concept in business, particularly in electronic commerce (e‐commerce). In order to understand online trust, one must first study trust research conducted in the offline world. The findings of such studies, dating from the 1950’s to the present, provide a foundation for online trust theory in e‐commerce. This paper provides an overview of the existing trust literature from the fields of philosophy, psychology, sociology, management, and marketing. Based on these bodies of work, online trust is briefly explored. The range of topics for future research in online trust in e‐commerce is presented.