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High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and microwave frequencies. In this paper, inductors are realized on standard Si wafers (20 Ω.cm) using MCM‐D processing. This consists of realizing two low K dielectric layers (BCB) and a thick Cu interconnect layer. Inductors with 5 μm lines and spaces are demonstrated for a 5 μm thick Cu layer, hereby leading to a very compact and high performance inductors: Q‐factors in the range of 25 to 30 have been obtained for inductances in the range of 1 to 5 nH. It is also shown how the Q‐factor and resonance frequency vary as a function of the inductor layout parameters and the thickness of the BCB and Cu layers. The realized 50 Ω CPW lines (lateral dimension of 40 μm) have a measured loss of only 0.2 dB/mm at 25 GHz.

This paper highlights the electrical behaviour of the interconnects on a 120‐pin Ball Grid Array (BGA) package from 500 MHz upto 8 GHz. The measurements are made using IMEC's MCM‐D thin film technology as the substrate and with a test set‐up called MoPoM (MCM‐on‐Package‐on‐MCM). The interconnects are classified based on length and measured with adjacent interconnects grounded as well as floating. Circuit models are extracted from the measurement and the simulation respectively for an RF interconnect including the wirebond. Comparison of the circuit models with each other and with the measurement show agreement atleast upto 6 GHz. One of the interconnects is also measured before and after globtopping and a considerable change in the impedance match is observed. The effect of package loading is found to be negligible.

This paper presents a novel mesoscale RF (mRF) relay that integrates advanced high resolution stereolithography (SL) and micro wire electro discharge machining (μEDM) technologies. Methods and infrastructure for reliable batch assembly of electromechanical actuators and structural parts less than 5 mm³ in volume are described. Switches made using these techniques are expected to have greater power handling capability relative to current micro RF relay products.

The conjecture is that the integration of SL and similar rapid additive manufacturing with other mesofabrication technologies can yield innovative miniature products with novel capabilities. A series of mRF prototypes consisting of a contact mechanism and actuator with return spring were fabricated assembled, inspected, and characterized for electromechanical performance. Characterization results led to specific conclusions regarding capabilities of the mRF product, and the integrated manufacturing technique.

The microassembly apparatus and epoxy‐based fastening system led to durable prototypes within 4 h (excluding a 16‐24 h cure cycle). Relay stroke ranged from 560 to 1,650 μm indicating a relative assembly accuracy of 90 percent. Prototypes demonstrated insertion loss of 1.3 dB at 100 MHz and isolation of better than 30 dB through 300 MHz.

Results indicated that fully functional and robust mesoscale relays are possible using integrated manufacturing with SL. However, prototypes exhibited high contact resistance and lacked assembly precision in the context of contact mechanism stroke. Opportunities exist to reduce contact resistance and switching time.

The research provides a practical new product application for integrated mesoscale rapid manufacturing.

This work represents one of the first examples of a mesoscale relay rapidly manufactured with a combination of μEDM and SL components.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.

The idea that a significant portion of what consumers do, feel, and think is driven by automatic (or “implicit”) cognitive processes has sparked a wave of interest in the development of assessment tools that (attempt to) capture cognitive processes under automaticity conditions (also known as “implicit measures”). However, as more and more implicit measures are developed, it is becoming increasingly difficult for consumer scientists and marketing professionals to select the most appropriate tool for a specific research question. We therefore present a systematic overview of the criteria that can be used to evaluate and compare different implicit measures, including their structural characteristics, the extent to which (and the way in which) they qualify as “implicit,” as well as more practical considerations such as ease of implementation and the user experience of the respondents. As an example, we apply these criteria to four implicit measures that are (or have the potential to become) popular in marketing research (i.e., the implicit association test, the evaluative priming task, the affect misattribution procedure, and the propositional evaluation paradigm).

This paper aims to investigate the sintering and solid liquid interdiffusion bonding (SLID) techniques to attach AlGaN/GaN-on-Si chips to direct bond copper (DBC) substrate. The influence of metal layers deposited on the backside of AlGaN/GaN-on-Si dies on the assembly process is also investigated.

The authors assumed the value of the shear strength to be a basic parameter for evaluation of mechanical properties. Additionally, the surface condition after shearing was assessed by SEM photographs and the shear surface was studied by X-ray diffraction method. The SLID requires Sn-plated DBC substrate and can be carried out at temperature slightly higher than 250°C and pressure reduced to 4 MPa, while the sintering requires process temperature of 350°C and the pressure at least 7.5 MPa.

Ag-, Au-backside covered high electron mobility transistor (HEMT) chips can be assembled on Sn-plated DBC substrates by SLID technology. In case of sintering technology, Cu- or Ag-backside covered HEMT chips can be assembled on Ag- or Ni/Au-plated DBC substrates. The SLID process can be realized at lower temperature and decreased pressure than sintering process.

For SLID technology, the adhesion between Cu-backside covered HEMT die and DBC with Sn layer loses its operational properties after short-term ageing in air at temperature of 300°C.

In the SLID process, Sn-Cu and Sn-Ag intermetallic compounds and alloys are responsible for creation of the joint between Sn-plated DBC and micropowder Ag layer, while the sintered joint between the chip and Ag-based micropowder is formed in diffusion process.

The purpose of this paper is to develop a research framework for exploring and improving patient empowerment through the analysis of the effects produced by a satisfying physician relationship on patient involvement in the healthcare process.

The authors begin with a literature review of patient empowerment in healthcare, useful to highlight the importance of relational aspects. Then, the authors tested the hypotheses of the research through the analysis of 450 questionnaires. The results are analyzed through covariance-based structural equation modeling.

This paper highlights how empowerment is a more complex phenomenon, needing many dimensions to be investigated. The hypotheses were tested, and correlations computed, highlighting a medium-strong positive correlation between physician relationship and patient involvement determining satisfying patient empowerment.

The considerations conducted in the paper are restricted to physician relationship and needs further research aimed to analyze and evaluate the changes in the patient behaviors influenced by empowerment.

The research points offer new insight into patient empowerment and allow the healthcare provider to create new opportunities for promoting patient empowerment through the development of quality relationship for effective patient involvement.

The study developed contributes new insight about patient empowerment in the healthcare management literature, proving the key role of satisfying physician relationship useful for future researches.

The purpose of this paper is to examine how crises impact overall tourist behaviour and travel preferences in times of crisis events, both man-made and natural disasters. In doing so, the present paper has been designed to provide a new conceptualization of travellers’ shifting preferences in terms of the selection of holiday destinations through the new concept of tourophobia and to classify this as a new type of tourist behaviour.

The present study uses a literature review as a qualitative deductive content analysis of 58 field studies published by major hospitality and tourism journals. By using a deductive content analysis approach, the current paper is designed to delineate tourist behaviour through a generic review of relevant literature detailing travellers’ preferences in times of crisis.

The developed concept of tourophobia and the suggested model, which proposes two possible scenarios, shows that traveller behaviour is heterogeneous in terms of the destination selection process; this finding is based on a content analysis of the articles chosen. Further, by using the developed model, the decline in travel and tourism can also be explained by an increase in what is termed in this paper “tourophobia”, which results from the various devastating effects of crises.

The proposed model is expected to help destination managers and marketers to segment and forecast the future market demand of tourist travel preferences, thereby enabling them to form effective marketing strategies and increase their responsiveness during difficult times. Only articles from hospitality and tourism journals were subjected to content analysis; this is a major limitation of the study.

The present research contributes to current knowledge by describing the concept of tourophobia as a tourist behaviour in times of crisis. As an emerging phenomenon, it is also introduced as being one criterion for the selection of destinations and, therefore, is regarded as a driver for tourist behaviour, thus generating the originality of the paper. This study strives to provide a new direction for future studies on tourist behaviour, rather than offering new empirical data.

本文旨在研究在人为和自然灾害的危机事件中, 危机是如何影响旅游者的整体行为和旅游偏好的。在此过程中, 本论文旨在通过旅游恐惧症的概念, 对旅游者在选择度假目的地方面的偏好变化提供一个新的概念化过程, 并将其归类为一种新的旅游行为类型。

本研究采用文献回顾的方法, 对发表在主流酒店和旅游学术期刊上的58个实地研究进行定性演绎分析。本文运用演绎内容分析法, 通过对危机时期旅游者偏好的相关文献的综述, 勾勒出旅游者的行为特征。

旅游恐惧症的发展概念和假设模型提出了两种可能的情况, 表明旅行者的行为在目的地选择过程中是异质的；这一发现是基于对所选文章的内容分析。此外, 通过使用已开发的模型, 旅游业和旅游业的衰退也可以用本文所称的“旅游恐惧症”的增加来解释, 这是由危机的各种破坏性影响造成的。

该模型有望帮助旅游目的地管理者和营销者对旅游偏好的未来市场需求进行细分和预测, 从而形成有效的营销策略, 增强他们在困难时期的反应能力。本文的一个主要局限是, 仅对酒店和旅游期刊的文章进行了内容分析。

本研究通过将旅游恐惧症的概念描述为危机时期的一种旅游行为, 为当前的知识做出了贡献。旅游恐惧症作为一种新出现的现象, 也是旅游目的地选择的一个标准, 因此它被认为是旅游行为的驱动因素, 从而体现了本文的独创性。本研究旨在为未来的旅游行为研究提供一个新的方向, 而不是提供新的实证数据。

El objetivo del presente documento es examinar cómo las crisis impactan el comportamiento turístico general y las preferencias de viaje en tiempos de crisis, relacionadas con desastres naturales, así como, provocadas por el hombre. Al hacerlo, el presente documento ha sido diseñado para proporcionar una nueva conceptualización de las preferencias cambiantes de los viajeros en términos de la selección de destinos de vacaciones a través del nuevo concepto de “tourophobia”, y para clasificar esto como un nuevo tipo de comportamiento turístico.

El presente estudio emplea una revisión de la literatura basado en un análisis de contenido deductivo cualitativo de 58 estudios de campo publicados por las principales revistas de hotelería y turismo. Al utilizar un enfoque de análisis de contenido deductivo, el documento actual está diseñado para delinear el comportamiento turístico a través de una revisión genérica de literatura relevante que detalla las preferencias de los viajeros en tiempos de crisis.

El concepto desarrollado de “tourophobia” y el modelo sugerido, que propone dos escenarios posibles, muestra que el comportamiento del viajero es heterogéneo en términos del proceso de selección del destino; Este hallazgo se basa en un análisis de contenido de los artículos elegidos. Además, mediante el uso del modelo desarrollado, la disminución de los viajes y el turismo también puede explicarse por un aumento en lo que se denomina en este documento “tourophobia”, que resulta de los diversos efectos devastadores de las crisis.

Se espera que el modelo propuesto ayude a los directores de planificación turística de destinos, así como a los de marketing a segmentar y pronosticar la demanda futura del mercado con respecto a las preferencias de viajes turísticos, lo que les permite formar estrategias de marketing efectivas y aumentar su capacidad de respuesta en tiempos difíciles. Solo los artículos de revistas de hotelería y turismo fueron sometidas al análisis de contenido; ésta constituye una limitación importante del estudio.

La presente investigación contribuye al conocimiento actual al describir el concepto de “tourophobia” como un comportamiento turístico en tiempos de crisis. Como fenómeno emergente, también se presenta como un criterio para la selección de destinos y, por lo tanto, se considera un motor del comportamiento turístico, generando así la originalidad del documento. Este estudio se esfuerza por proporcionar una nueva dirección para futuros estudios sobre el comportamiento turístico, en lugar de ofrecer nuevos datos empíricos.