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By the use of ceramic ball grid array connections, the number of I/Os can be increased substantially in comparison with PGA (pin grid array) while maintaining an unchanged module size. In most cases, this also signifies a higher packing density and thus a higher power density, which must be dissipated as occurring heat. The fact that the dissipation of heat can also be improved considerably by the use of modules with CBGA (ceramic ball grid array) connections instead of PGA connections is demonstrated on a simulation model. Moreover, the use of chip carriers made of different ceramics (LTCC or Al₂O₃) has a substantial influence on the possible heat dissipation (LTCC= low temperature cofired ceramic).