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Multifilamentary Bi₂Sr₂CaCu₂O_x (Bi2212) superconductor composite wires are the only high-temperature superconducting round wires (RW) with sufficient critical current density (J_c) for superconducting magnets generating magnetic fields greater than 25 Tesla. Very complex microstructures of Bi2212 RWs including the voids or gas bubbles, filament to filament bridges and wire architecture strongly influence their electrical behavior. Especially, a large number of voids in Bi2212 superconducting filaments is believed to be the major current-limiting mechanism. However, the effect of the void structure on the Jc is not well understood yet.

In this paper, the authors first statistically analyzed the size and distribution of voids in filaments using the reported microscopic data, obtaining the essential statistical regularities. An electrical model was further developed to predict the J_c of multifilamentary wires while taking into account of the current limiting mechanisms of the void structure in filaments, and the current sharing roles of filament to filament bridges.

The model predicts the quantitative dependence of J_c on the number of Bi2212 filaments in each bundle of a double-restack wire and porosity. The results are useful optimizing design and fabrication of Bi2212 multifilamentary wires.

For the complex structure of voids and interfilamentary bridges inside Bi2212 multifilamentary superconducting wires, the authors took a statistical characterization and studied its effect on the critical current density Jc (the key index of evaluating the current carrying capacity).

To explore the economical and reasonable semi-rigid permeable base layer ratio, solve the problems caused by rainwater washing over the pavement base layer on the slope, improve its drainage function, improve the water stability and service life of the roadbed pavement and promote the application of semi-rigid permeable base layer materials in the construction of asphalt pavement in cold regions.

In this study, three semi-rigid base course materials were designed, the mechanical strength and drainage properties were tested and the effect and correlation of air voids on their performance indexes were analyzed.

It was found that increasing the cement content increased the strength but reduced the air voids and water permeability coefficient. The permeability performance of the sandless material was superior to the dense; the performance of the two sandless materials was basically the same when the cement content was 7%. Overall, the skeleton void (sand-containing) type gradation between the sandless and dense types is more suitable as permeable semi-rigid base material; its gradation is relatively continuous, with cement content? 4.5%, strength? 1.5 MPa, water permeability coefficient? 0.8 cm/s and voids of 18–20%.

The study of permeable semi-rigid base material with large air voids could help to solve the problems of water damage and freeze-thaw damage of the base layer of asphalt pavements in cold regions and ensure the comfort and durability of asphalt pavements while having good economic and social benefits.

This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries. The investigation involves a numerical approach and a physical validation with selected geometry configurations and high current loads to reveal possible failure sources. The work is a continuation of a previous study.

Current density was investigated using finite element modeling on BGA joints. Dummy BGA components, 0402 and 0603 zero ohm jumper resistors, were used, both in daisy chain setups on standard FR4 printed circuit boards (PCBs). Respective physical loading experiments were set to find effects of elevated current density at hot zones of the joints. Cross-section analysis, scanning electron microscopy and shear force tests were used to analyze the joints.

The findings reveal alterations in the joints, while the current loading is not directly affecting the structure. The modeling reveals the current density map in the selected formations with increased current crowding zones. Overall, the degradation does not reach the level of electromigration (EM)-induced voiding due to the limiting factor of the FR4 substrate.

The heavy current load affects joint reliability, but there are limitations of EM-induced failures on PCB-based assemblies due to the thermomechanical weakness of the FR4 material.

The experiments investigate current density from a novel aspect on frequently used BGA surface mounted components with modeling configurations focusing on possible effects of via-in-pad structure.

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

The purpose of the present paper is to quantify and analyze the strain-rate dependence of the yield stress for both unfilled acrylonitrile-butadiene-styrene (ABS) and short carbon fiber-reinforced ABS (CF-ABS) materials, fabricated via material extrusion additive manufacturing (ME-AM). Two distinct and opposite infill orientation angles were used to attain anisotropy effects.

Tensile test samples were printed with two different infill orientation angles. Uniaxial tensile tests were performed at five different constant linear strain rates. Apparent densities were measured to compensate for the voided structure. Scanning electron microscope fractography images were analyzed. An Eyring-type flow rule was evaluated for predicting the strain-rate-dependent yield stress.

Anisotropy was detected not only for the yield stresses but also for its strain-rate dependence. The short carbon fiber-filled material exhibited higher anisotropy than neat ABS material using the same ME-AM processing parameters. It seems that fiber and molecular orientation influence the strain-rate dependence. The Eyring-type flow rule can adequately describe the yield kinetics of ME-AM components, showing thermorheologically simple behavior.

A polymer’s viscoelastic behavior is paramount to be able to predict a component’s ultimate failure behavior. The results in this manuscript are important initial findings that can help to further develop predictive numerical tools for ME-AM technology. This is especially relevant because of the inherent anisotropy that ME-AM polymer components show. Furthermore, short carbon fiber-filled ABS enhanced anisotropy effects during ME-AM, which have not been measured previously.

The purpose of this study is to confirm that the stiffness of fused filament fabrication (FFF) three-dimensionally (3D) printed fiber-reinforced thermoplastic (FRP) materials can be predicted using classical laminate theory (CLT), and to subsequently use the model to demonstrate its potential to improve the mechanical properties of FFF 3D printed parts intended for load-bearing applications.

The porosity and the fiber orientation in specimens printed with carbon fiber reinforced filament were calculated from micro-computed tomography (µCT) images. The infill portion of the sample was modeled using CLT, while the perimeter contour portion was modeled with a rule of mixtures (ROM) approach.

The µCT scan images showed that a low porosity of 0.7 ± 0.1% was achieved, and the fibers were highly oriented in the filament extrusion direction. CLT and ROM were effective analytical models to predict the elastic modulus and Poisson’s ratio of FFF 3D printed FRP laminates.

In this study, the CLT model was only used to predict the properties of flat plates. Once the in-plane properties are known, however, they can be used in a finite element analysis to predict the behavior of plate and shell structures.

By controlling the raster orientation, the mechanical properties of a FFF part can be optimized for the intended application.

Before this study, CLT had not been validated for FFF 3D printed FRPs. CLT can be used to help designers tailor the raster pattern of each layer for specific stiffness requirements.

In order to fully understand the properties of porous asphalt, investigation should be conducted from different point of views. This is from the fact that porous asphalt mixture designed with the same aggregate gradation and air void content can give different infiltration rate due to the different formation of the internal structure. Therefore, the purpose of this paper is to investigate the micro-structural properties and functional performance of porous asphalt simultaneously.

The aim is to develop imaging techniques to process and analyze the internal structure of porous asphalt mixture. A few parameters were established to analyze the air void properties and aggregate interlock within the gyratory compacted samples captured using a non-destructive scanning technique of X-ray computed tomography (CT) throughout the samples. The results were then compared with the functional performance in terms of permeability. Four aggregate gradations used in different countries, i.e. Malaysia, Australia, the USA and Singapore. The samples were tested for resilient modulus and permeability. Quantitative analysis of the microstructure was used to establish the relationships between the air void properties and aggregate interlock and the resilient modulus and permeability.

Based on the results, it was found that the micro-structural properties investigated have successfully described the internal structure formation and they reflect the results of resilient modulus and permeability. In addition, the imaging technique which includes the image processing and image analysis for internal structure quantification seems to be very useful and perform well with the X-ray CT images based on the reliable results obtained from the analysis.

In this study, attention was limited to the study of internal structure of porous asphalt samples prepared in the laboratory using X-ray CT but can also be used to assess the quality of finished asphalt pavements by taking core samples for quantitative and qualitative analysis. The use of CT for material characterization presents a lot of possibilities in the future of asphalt concrete mix design.

Based on the validation process which includes comparisons between the values obtained from the image analysis and those from the performance test and it was found that the developed procedure satisfactorily assesses the air voids distribution and the aggregate interlock for this reason, it can be used.

The main advantages of vapour phase soldering are a non-oxygen environment, the elimination of overheating and the possibility of the vacuum application, which can guarantee undeniably higher quality of solder joints, especially as regards void formation. These features are less affected by the alloy composition. The paper aims to discuss these issues.

The quality of solder joints made in two VPS options (with and without vacuum) was investigated in terms of voids formation. Solder alloys of 37%Pb63%Sn (PbSn) and 96%Sn3.5%Ag0.5%Cu (SAC 305) were applied to an etched Cu layer on a glass-epoxy substrate using the screen-printing method. 1206 SMD resistors were placed on the solder pads with a Quadra pick-and place machine. For the inspection of joint structure and void identification, 3D X-ray images of samples were taken using a computed tomography system with a 180 kV/15 W nanofocus. For comparison, traditional cross-sections of the samples were performed using a metallographic polisher. The cross-section analysis was done in a scanning electron microscope (SEM). To confirm the relevance of these data, a statistical analysis was carried out.

The paper shows that alloy composition has less impact on the quality of joints as regards void formation. The tendency for a different arrangement of voids in a junction depending on the distance SMD element and the thickness of the solder layer was investigated using X-ray computed tomography.

The use of 3D computed tomography for void investigation gives full information about the internal structure of the joint and allows for precise void identification. Vacuum application during the soldering allows significant voids elimination.

A simulation framework that includes a finite element analysis (FEA) and computational fluid dynamics (CFD) model is generated to study the effect of unstable two-phase flow-induced vibrations at a vertical 90° pipe bend. The corresponding fluid-structure interaction (FSI) of an unstable flow may pose danger to the piping structure. This paper intends to discuss this interaction.

Four cases of flows under the slug flow and churn flow regimes were investigated. The flow regimes vary in superficial gas velocities with velocities from 0.978 m/s to 9.04 m/s, while the superficial liquid velocity is kept constant at 0.61 m/s. The pipe model consists of an internal diameter of 0.0525 m, a bend radius of 0.0762 m, and a stainless-steel pipe structure.

Results show that the average unstable void fractions increase with the superficial gas velocities, but the peak frequencies were constant at 13 Hz for three of the cases. The total displacement and von Mises stress increase with a declining rate in each subsequent case, while the RMS of von Mises stress begins to stall at superficial gas velocities between 5 m/s and 9.04 m/s. The peak frequencies of von Mises stress decrease in each subsequent case.

The proposed model can be used to investigate the FSI effect of unstable void fractions at pipe bends and could assist in the development of piping systems in which the use of piping elements arranged close together are unavoidable.

This paper aims to present experimental and numerical analyses of fused filament fabrication (FFF) printed parts and show how mechanical characteristics of printed ABS-MG94 (acrylonitrile butadiene styrene) are influenced by the void volume fraction, cooling rate and residual thermal stresses.

Printed specimens were experimentally tested to evaluate the mechanical properties for different printing speeds, and micrographs were taken. A thermo-mechanical finite element model, able to simulate the FFF process, was developed to calculate the temperature fields in time, cooling rate and residual thermal stresses. Finally, the experimental mechanical properties and the microstructure distribution could be explained by the temperature fields in time, cooling rate and residual thermal stresses.

Micrographs revealed the increase of void volume fraction with the printing speed. The variations on voids were associated to the temperature fields in time: when the temperatures remained high for longer periods, less voids were generated. The Young's Modulus of the deposited filament varied according to the cooling rate: it decreased when the cooling rate increased. The influence of the residual thermal stresses and void volume fraction on the printed parts failure was also investigated: in the worst scenarios evaluated, the void volume fraction reduced the strength in 9 per cent, while the residual thermal stresses reduced it in 3.8 per cent.

This work explains how the temperature fields can affect the void volume fraction, Young's Modulus and failure of printed parts. Experimental and numerical results are shown. The presented research can be used to choose printing parameters to achieve desired mechanical properties of FFF printed parts.