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Defines a vacuum and gives some basic facts about it, including an explanation of vacuum force and air pressure. Describes the three main applications of vacuum; low range, industrial and scientific and gives examples of uses. A vacuum can be created mechanically or by compressed air: discusses the advantages and disadvantages of mechanical vacuum pumps and compressed air‐driven ejector pumps. Concludes with a brief look at vacuum in relation to altitude.

Vapor phase soldering (VPS), also known as condense soldering, is capable of improving the mechanical reliability of solder joints in electronic packaging structures. The paper aims to discuss this issue.

In the present study, VPS is utilized to assemble two typical packaging types (i.e. ceramic column grid array (CCGA) and BGA) for electronic devices with lead-containing and lead-free solders. By applying the peak soldering temperatures of 215°C and 235°C with and without vacuum condition, the void formation and intermetallic compound (IMC) thickness are compared for different packaging structures with lead-containing and lead-free solder alloys.

It is found that at the soldering temperature of 215°C, CCGA under a vacuum condition has fewer voids but BGA without vacuum environment has fewer voids despite of the existence of lead in solder alloy. In light of contradictory phenomenon about void formation at 215°C, a similar CCGA device is soldered via VPS at the temperature of 235°C. Compared with the size of voids formed at 215°C, no obvious void is found for CCGA with vacuum at the soldering temperature of 235°C. No matter what soldering temperature and vacuum condition are applied, the IMC thickness of CCGA and BGA can satisfy the requirement of 1.0–3.0 µm. Therefore, it can be concluded that the soldering temperature of 235°C in vacuum is the optimal VPS condition for void elimination. In addition, shear tests at the rate of 10 mm/min are performed to examine the load resistance and potential failure mode. In terms of failure mode observed in shear tests, interfacial shear failure occurs between PCB and bulk solder and also within bulk solder for CCGA soldered at temperatures of 215°C and 235°C. This means that an acceptable thicker IMC thickness between CCGA solder and device provides greater interfacial strength between CCGA and device.

Due to its high I/O capacity and satisfactory reliability in electrical and thermal performance, CCGA electronic devices have been widely adopted in the military and aerospace fields. In the present study, the authors utilized VPS to assemble a typical type of CCGA with the control package of conventional BGA to investigate the relation between essential condition (i.e. soldering temperature and vacuum) to void formation.

The purpose of this paper is to show how to precisely control the liquid resin coating thickness in stereolithography (SL).

A vacuum adsorption coating equipment and technology are developed to precisely control the liquid resin coating thickness in SL. Dual‐electrode device is used, so adsorption can be precisely controlled and the electrode polarization can be avoided.

It turns out that the apparatus can control coating thickness effectively, and thickness uniformity is increased remarkably, which induces the standard deviation thickness decrease from 0.00547 to 0.00243 mm, and efficiency of rapid prototyping production increase by 53 percent.

The paper demonstrates that the apparatus can control coating thickness effectively.

The aim of this paper is to evaluate using statistical methods how two soldering techniques – the convection reflow and vapour phase reflow with vacuum – influence reduction of voids in lead-free solder joints under Light Emitted Diodes (LEDs) and Ball Grid Arrays (BGAs).

Distribution of voids in solder joints under thermal and electrical pads of LEDs and in solder balls of BGAs assembled with convection reflow and vapour phase reflow with vacuum has been investigated in terms of coverage or void contents, void diameters and number of voids. For each soldering technology, 80 LEDs and 32 solder balls in BGAs were examined. Soldering processes were carried out in the industrial or semi-industrial environment. The OM340 solder paste of Innolot type was used for LED soldering. Voidings in solder joints were inspected with a 2D X-ray transmission system. OriginLab was used for statistical analysis.

Investigations supported by statistical analysis showed that the vapour phase reflow with vacuum decreases significantly void contents and number and diameters of voids in solder joints under LED and BGA packages when compared to convection reflow.

Voiding distribution data were collected on the basis of 2D X-ray images for test samples manufactured during the mass production processes. Statistical analysis enabled to appraise soldering technologies used in these processes in respect of void formation.

The effects of space environment on friction and wear and on the selection of lubricants and self‐lubricating materials for spacecraft mechanisms are discussed, with special emphasis on the ultrahigh vacuum of space. Experimental studies have demonstrated the feasibility of using selected oils and greases to lubricate lightly loaded ball bearings without replenishment for periods of over one year under the following conditions of operation : speeds of 8,000 rpm, temperatures of 160 to 200°F., and vacuum of 10–8 torr. Over one‐half year of successful operation has been achieved under similar operating conditions with self‐lubricating retainers of reinforced Teflon, provided that the loads were light. Bonded films of molybdenum disulfide have given shorter lifetimes and poor repro‐ducibility. Metal‐to‐metal slip‐ring contacts introduce excessive electrical noise into circuits when operated in vacuum of 10–7 torr. The noise (as well as the friction and wear) can be markedly reduced by providing a small amount of oil vapor, sufficient to maintain a pressure on the order of 10–6 torr, or by incorporating molybdenum disulfide into the brush material.

The purpose of this paper is to describe the design and construction of a custom‐built low‐cost thermal vacuum chamber (TVC) for spacecraft environmental testing and verification. The paper provides detailed analysis and an insight into the design and development of the chamber. The chamber was specifically constructed for carrying out the thermal and vacuum environmental tests in a 16″ dia × 16″ long horizontal thermal vacuum chamber. The chamber is constructed using a combination of mechanical (roughing) pump and turbo‐molecular pump, used to pump the chamber down to 10⁻⁵ Torr and a combination of radiation heaters and nitrogen gas is used to vary the temperature within the chamber from +80 to −50°C.

The TVC equipment is built as part of the picosatellite and nanosatellite program at Space Systems Research Laboratory of Saint Louis University. The equipment is built at a low cost and is suited for testing an entire picosatellite and several components and subsystems of nanosatellite simulating thermal and vacuum conditions similar to space environment. The different main parts of the equipment are described in a way which explains the choice of construction and partly makes it possible to replicate similar equipment.

The TVC equipment is successfully used to simulate the thermal and vacuum conditions of space similar to the conditions experienced by a picosatellite or nanosatellite in low earth orbit.

The design and construction of TVC in this paper have broader implications and can be a platform for future research on low‐cost TVC. This equipment can be utilized in the research areas of electronics and communications, biology and medicine to name a few. Thermal and vacuum experiments on several astro‐biological experiments can be performed.

The paper is intended to be a source of inspiration for industrial or academic space research laboratories which would like to design and construct a similar test‐equipment, instead of investing expensive commercially available alternatives.

The paper discusses in detail, the simplified cost‐effective approach of constructing TVC and also outlines the various issues to be considered. The TVC equipment is custom‐built and is described in an easily understandable way, which makes this a helpful paper for those who wish to produce similar equipment. This will be the only known manuscript in the literature to detail the design and construction of low‐cost, economical TVC.

This paper describes the new technique used by International Computers Limited for vacuum bagging multilayer PCB bonding stacks. It is used as a cost‐effective alternative to previous consumable bagging systems used in autoclave vacuum bonding.

Various revolutions continue in the technology of semiconductor manufacturing and equipment. The transfer system used in a vacuum is indispensable to the semiconductor manufacturing process, and the vacuum manipulator is the main component of this system. Yaskawa, which is the supplier of the electrically controlled industrial robot known well as “Motoman”, supplies a manipulator that can be used in a vacuum. For this manipulator, Yaskawa adopts the direct drive method with an original motor for the vacuum environment. Moreover, the manipulator has a specially designed controller for direct drive in a vacuum, and software functions for the transfer system. These provide Yaskawa’s vacuum manipulator with various features such as high reliability, high speed and high accuracy.

HIGH vacuum engineering has made rapid strides within the last decade for applications within many branches of science and engineering, including metallurgy, general engineering, optics, cryogenics, electronics, and, of course, aeronautics and astronautics. It is the aim of this article to describe briefly the techniques involved in high vacuum engineering and to describe some of the equipment being produced by one of the British companies occupying a leading position in this field—Bir‐Vac Ltd.

The aim of this work was to study the effect of the different temperatures on drying kinetics and quality parameters of vacuum oven-dried mediterranean or black mussel (Mytilus galloprovincialis) specimens.

Drying process was performed at 50, 60 and 70 °C and a vacuum drying pressure of 0.1 kPa. The proximate composition analysis was done. Drying rates of the mussels were computed. Mathematical modeling was carried out. Effective moisture diffusivity, activation energy and total energy consumption were calculated. Color measurement was conducted.

Drying took place entirely in the falling rate period. The obtained results indicated that the drying air temperature has a remarkable influence on the moisture content and drying rate. Drying resulted in a significant increasing of protein and fat content. The D_eff values ranged from 1.44 × 10⁻⁹–3.23 × 10⁻⁹ m²/s, with the activation energy 4.47 kW kg⁻¹. The Alibas model is the most proper model to define the drying curves. This method provided high energy efficiency and quality in dried products.

Fresh mussels grown in Eceabat location were used as the study sample. In the drying process, 50, 60, 70 °C temperatures and 0.1 kPa pressure was used. These are the limitations of the research.

This work is the first to report the influence of vacuum oven drying on the color changes and drying kinetics of black mussels.