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Despite total quality management (TQM) playing an important role in the survival and growth of the Indian automobile sector, India is still a player of little consequence in the global automobile production market. The paper identifies various dynamic interactions among the sub systems of TQM. The implications of these interactions have been captured using system dynamics modeling, which is based on causal relationship among different variables that constitute enablers and results. The model results have been discussed and validated based on a case study.

The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate. For gas-sensing application, a temperature range of 200°C-400°C is usually required by the sensing film to detect different gases which imply the requirement of thermally stable interconnects. To observe the effect of parameters influencing power of the device, electro-thermal simulation of LTCC hotplate is also presented. Simulated LTCC hotplate is fabricated using the LTCC technology.

The proposed task is to fabricate LTCC hotplate with interconnects through vertical access. Dedicated via-holes generated on the LTCC hotplate are used to provide the interconnections. These interconnections are based on adherence and bonding mechanism between LTCC and thick film. COMSOL software is used for finite element method (FEM) simulation of the LTCC hotplate structure.

Thermal reliability of these interconnections is tested by continuous operation of hotplate at 350°C for 175 h and cycling durability test performed at 500°C. Additionally, vibration test is also carried out for the hotplate with no damage observed in the interconnections. An optimized firing profile to reproduce these interconnections along with the experimental flowchart is presented.

Research activity includes design and fabrication of LTCC hotplate with metal to thick-film based interconnections through vertical access. Research work on interconnections based on adherence of LTCC and thick film is limited.

A new way of providing lead-free and reliable interconnections will be useful for gas sensor fabricated on LTCC substrate. The FEM results are useful for optimizing the design for developing low-power LTCC hotplate.

Adherence and bonding mechanism between LTCC and thick film can be used to provide interconnections for LTCC devices. Methodology for providing such interconnections is discussed.

For the survival and growth of an organization, it is important to understand the transition phases of different market scenarios. During the transition from one market scenario to another, effective strategic planning is needed to manage the performance of the organizations. The paper models different market scenarios leading to excellent and poor performance of the organizations. Policy experimentations have been conducted using system dynamics methodology. The results indicate that there is no quick fix to achieve the TQM maturity level. To sustain TQM maturity level, it is extremely important to handle the transition phases of different market scenarios effectively.

The purpose of this paper is to review critical success factors (CSFs) of total quality management (TQM), and to rank these in the Indian manufacturing industry.

To rank the CSFs, Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) was used. The data were collected using questionnaires as the research instrument.

Process management, top management leadership and customer focus are the top three factors for implementation of TQM in the manufacturing industry in India. Quality citizenship is a relatively low‐ranked factor.

The findings will be useful in successful implementation of TQM in developing countries like India. Further research may be carried out into the CSFs in different national contexts.

The paper is the first to make use of TOPSIS approach to rank the CSFs of TQM.

To expose the gate of ion‐sensitive field‐effect transistor (ISFET) to filthy and muddy water, suspended algae, etc. investigate the influence of these conditions on device performance and suggest measures for using the device in applications where suspended soil particles are present.

In this paper, cleaning procedure to make the blocked ISFET operative has been described. The effect of dirty water on pH sensitivity factor of ISFET, after it restarted functioning, has been measured. ISFET package has been modified. A relatively simple disposable nylon mesh with openings of size 100 μm for filtering bigger particles and lower for smaller particles, has been proposed for dirty applications to minimize device failures. This sieves away any dirt and thereby avoids failure.

The device action is frequently blocked by deposition of dirt on the gate. Generally, it is recoverable by proper cleaning action although with reduced sensitivity. This necessitates recalibration. But a protective filter helps in reducing failures. It is more advantageous to prevent clogging of ISFET than to revive a clogged device, sacrificing sensitivity.

After recovery, the original sensitivity of the device is not achieved, and the device has to be used with degraded sensitivity.

Measurement of pH of actual sources of water, whether clean or dirty, is important.

Problems of pH measurements of dirty samples have been studied. The study helps in understanding device behaviour in these samples and provides suitable corrective measures. Further, the pH survey of dirty and clean water samples provides useful information about the pH distribution and balance in nature.

The purpose of this paper is to help reduce power consumption by using platinum‐based microhotplate with different dielectric membranes SiO2 and Si3N4 for gas sensing applications, and to develop platinum lift‐off process using DC sputtering method for fabrication of platinum resistor.

Semiconductor gas sensors normally require high power consumption because of their elevated operating temperature 300‐600°C. Considering the thermal resistant and sensitive characteristics of metal platinum as well as heat and electricity insulating characteristics of SiO2, Si3N4 and combination of both, a kind of the Si‐substrate microhotplate was designed and simulated using ANSYS 10.0 tool. Thermal oxidation of Si wafer was carried out to get a 1.0 μm thick SiO2 layer. Pt deposition on oxidized silicon substrate by lift‐off was carried out using DC sputtering technique.

The platinum‐based microhotplate requires 31.3‐70.5 mW power to create the temperature 348‐752°C for gas sensing applications. The SiO2 membrane can operate the gas sensitive film at higher temperature than the Si3N4 and combination of both the membranes at same power consumption. The paper also presents the FEM simulation of different heating elements like nichrome and tantalum and its comparison to platinum for microhotplate applications.

Both the simulation and experimental work provides the low cost, high yield and repeatability in realization of microhotplate. The design and simulation work provides the better selection of heating elements and dielectric membranes. The developed experimental process provides the easy fabrication of platinum resistors using DC sputtering technique.

The Japanese have had a phenomenal impact on the world's market using 5 “S” and total quality management (TQM) philosophy. Though Indian companies also claim to follow these philosophies, however India has not been able to make substantial s in this regard. India has been ranked very low (India's rank has been 35 out of 59 economies) as per the IMD world competitiveness year book 2012 report. During a literature survey, it was found that competency-based training contributes to a greater extent for the success of 5 “S” and TQM implementation. Therefore, research was undertaken to study the effect of competency-based training on the implementation of 5 “S” and TQM principles. The paper aims to discuss these issues.

This paper attempts to assess and compare the role of competency-based training on the status of 5 “S” and TQM in Mayur Uniquoters Ltd (MUL) and SKH Metals Ltd. This paper compiles a list of the most important competency variables and prepares a competency training module for the industries. Quality award models will be used to compute a competency index, 5 “S” index, and TQM index before and after competency-based training in MUL. However, in the case of SKH Metals Ltd, the competency index, 5 “S” index and TQM index will be analyzed only after competency-based training. The index methodology has been used to assess and compare the level of performance in competency, 5 “S”, and TQM and the result will be validated through a two-sample t-test.

The paper reveals that competency-based training has a positive correlation on, 5 “S” and TQM, and is instrumental in improving the level of 5 “S” and TQM in both industries. Based on a two-sample t-test, the performance of 5 “S” and TQM improved by 74.4 and 84.5 percent, respectively, in case of MUL. This paper also prepares the competency-based training module.

The investigation and research findings are still exploratory. Future research can focus on and establish the correlation based on a larger number of organizations. A broadly based and larger sample size would provide a better picture of the relationship between competency, 5 “S” and TQM philosophy. The data have been collected before and after competency-based training in Mayur Uniquoters, whereas, in the case of SKH Metals, the data have been compiled only after competency-based training.

The study has been able to compile competency variables based on the feedback of 84 industries and also prepares a competency training module. Competency index, 5 “S” index and TQM index have been analyzed before and after competency-based training in MUL and two-sample t-test was also performed. In the case of SKH Metals Ltd, the data have been analyzed after competency-based training. The study has been able to identify that both organizations could perform better in 5 “S” and TQM after competency-based training. India stands a better chance in improving its competitiveness in the world ranking if all organizations focus on competency-based training, apart from training on 5 “S” and TQM.

The paper presents the initiative taken by leading automobile Original Equipment Manufacturer (oem) XYZ in India for their implementation of Toyota Production System (TPS) to meet competitor’s challenge and its efforts to benchmark against its principle located in Japan. The paper deals with a programme involving vendor upgradation and related TPS initiatives. The paper concludes that such efforts will definitely help XYZ to optimize its productivity and to meet competitor’s challenge successfully.

Application of Total Quality Management (TQM) approach has played an important role in the survival and growth of many industries. One of the major reasons for dismal performance of many Indian organizations can be attributed to the fact that they have not been able to put strategy in place to prioritize the various enablers and results involved in the quality management systems. TQM initiatives also fall due to lack of understanding of the complex interactions and the dynamics of these variables. To overcome this limitation System Dynamics (SD) has been used to model the combined effect of different TQM variables which will help the organizations to set their strategy right. The SD model has been experimented with data from Indian auto sector. Various policy experimentation has been conducted for this purpose to drive this point. The paper illustrates that organizations without effective strategic planning are in no position to improve their results, which is very detrimental to the survival and growth of such organizations.

Application of Total Quality Management (TQM) approach has played an important role in the survival and growth of many industries. Indian automobile sector has also adopted TQM path but it is still a player of little consequence in the global auto market. One of the major reasons for dismal performance of the Indian automobile sector can be attributed to the fact that it has not been able to prioritize and focus on the key variables, which are instrumental in enhancing TQM index. For the success of the Indian automobile sector, it is equally important to understand the implications of key variables in two different market scenarios and take policy decisions accordingly. TQM initiatives also fail due to lack of understanding of the complex interactions among different TQM variables. To overcome these limitations causal loop diagram has been developed to provide better insight regarding interactions and policy experimentations using system dynamics methodology has been used to prioritize the key variables in two different market scenarios. These experimentations reveal that the main contributing variables to enhance TQM index are leadership, strategic planning, customer and market focus, and human resource focus in both the market scenarios. However, the contribution of each variable and the priority of variables change in two different market scenarios.