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Direct ink writing (DIW) is a robust additive manufacturing technology for the fabrication of fiber-reinforced thermoset composites. However, this technique is currently limited to low design complexity and minimal heights. This study aims to investigate the feasibility of UV-assisted DIW of composites to enhance the green-part strength of the printed inks and resolve the complexity and the height limitations of DIW technology.

The experimental approach involved the preparation of the thermoset inks that are composed of nanoclay, epoxy, photopolymer and glass fiber reinforcement. Composite specimens were fabricated in complex geometries from these ink feedstocks using UV-assisted, hybrid 3D-printing technology. Fabricated specimens were characterized using optical microscopy, three-point bending mechanical tests and numerical simulations.

The introduced hybrid, UV-assisted 3D-printing technology allowed the fabrication of tall and overhanging thermoset composite structures up to 30% glass fiber reinforcement without sagging during or after printing. Glass fiber reinforcement tremendously enhanced the mechanical performance of the composites. UV-curable resin addition led to a reduction in strength (approximately 15%) compared to composites fabricated without UV resin. However, this reduction can be eliminated by increasing the glass fiber content within the hybrid thermoset composite. Numerical simulations indicate that the fiber orientation significantly affects the mechanical performance of the printed composites.

This study showed that the fabrication of high-performing thermoset composites in complex geometries was possible via hybrid DIW technology. This new technology will tremendously expand the application envelope of the additively manufactured thermoset composites and the fabrication of large composite structures with high mechanical performance and dimensional freedom will benefit various engineering fields including the fields of aerospace, automotive and marine engineering.

Reviews the traditional use of thermoset (epoxy) adhesives for various bonding applications and highlights some limitations in today’s microelectronics arena. In particular, concerns for thermal and stress management associated with large area silicon bonded to a wide variety of substrate materials has led to an increasing interest in thermoplastic adhesive technology. Thermoplastics are not always the best solution for every application. This paper sets out to address the “pros and cons” of each polymer technology for different microelectronic applications taking into account some of the key physical properties such as Tg, TCE and modulus. In addition, practical issues such as handling, storage and processing are considered in detail.

Glycidyl terminated rigid‐rod monomers can be cured in a liquid crystalline state. The resulting thermoset offers high potential as protective coating thanks to its outstanding properties. In particular a superior fracture toughness and a reduced internal stress are two typical parameters offered by this new class of compounds. Transport properties are not strongly affected by the state of order of the cross‐linked resin, in the sense that gas permeabilities are of the same order of magnitude of conventional epoxy resins.

In this study the effect of the aminofunctional silicone softeners on fabrics’ heat and moisture transport properties has been investigated by means of Alambeta and Permetest instruments. The silicone treated PES blended fabrics are warmer to the touch, but less comfortable as regards their reduced water‐vapour permeability. The finishing stage of the fabrics has considerable influence on their thermal touch sensation and water‐vapour permeability.

The flammability of epoxy resin is a major disadvantage in applications that require flame resistance. Epoxy monomers and hardeners containing flame-retardant elements are molecularly incorporated in the resin network are expected to exhibit better flame resistance than those borne on an additive approach. In recent years, because of health and environmental regulation, the use of waterborne coatings has received many attentions. However, waterborne epoxy resin curing agent with excellent flame retardancy has been seldom reported. The paper aims to study the preparation of waterborne P-N-containing epoxy resin curing agent and its performances (P-N – phosphorous and nitrogen).

Waterborne P-N-containing epoxy curing agent was prepared in this study using reactive flame retardant 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-xa-10-phosphaphenanthrene-10-oxide, liquid epoxy resin, triethylenetetramine and butyl glycidyl ether at the mole ratio of 1.0:2.0:2.0:2.0.

The results show that the epoxy thermoset from the prepared P-N-containing curing agent presents good flame retardancy and can pass the V-1 rating, and the cured epoxy thermoset film presents excellent performances such as water resistance, adhesion, impact resistance and pencil hardness. This study provides useful suggestions for the application of the water-borne flame retardancy epoxy resins in coating industry.

Each step of products during the preparation of waterborne P-N-containing epoxy curing agent cannot be accurately tested.

This method for synthesis of waterborne P-N-containing epoxy curing agent is novel and could be used for various applications in epoxy coating industry.

Resistance of thermoset powder coatings to mechanical and environmental corrosion damage enables GKN Kent Alloys Ltd, Rochester, to provide alloy road wheel finishes which meet stringent standards of European and North American vehicle manufacturers.