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The purpose of this study is to investigate the thermomechanical condition on the shape memory property of Polybutylene adipate-co-terephthalate (PBAT). PBAT is a widely researched and rapidly developed biodegradable copolyester. In a tensile test, we found that the fractured PBAT samples had a heat-driven shape memory effect which piqued our interest, and it will lay a foundation for the application of PBAT in new fields (such as heat shrinkable film).

The shape memory effect of PBAT and the effect of the thermomechanical condition on its shape memory property were confirmed and systematically investigated by a thermal mechanical analyzer and tensile machine.

The results showed that the PBAT film had broad shape memory transform temperature and exhibited excellent thermomechanical stability and shape memory properties. The shape memory fixity ratio (Rf) of the PBAT films was increased with the prestrain temperature and prestrain, where the highest Rf exceeded 90%. The shape memory recovery ratio (Rr) of the PBAT films was increased with the shape memory recovery temperature and decreased with the prestrain value, and the highest Rr was almost 100%. Moreover, the PBAT films had high shape memory recovery stress which increased with the prestrain value and decreased with the prestrain temperature, and the highest shape memory recovery stress can reach 7.73 MPa.

The results showed that PBAT had a broad shape memory transform temperature, exhibited excellent thermomechanical stability and shape memory performance, especially for the sample programmed at high temperature and had a larger prestrian, which will provide a reference for the design, processing and application of PBAT-based heat shrinkable film and smart materials.

This study confirmed and systematically investigated the shape memory effect of PBAT and the effect of the thermomechanical condition on the shape memory property of PBAT.

Polymethyl methacrylate (PMMA) is a remarkable biocompatible material for bone cement and regeneration. It is also considered 3D printable but requires in-depth process–structure–properties studies. This study aims to elucidate the mechanistic effects of processing parameters and sterilization on PMMA-based implants.

The approach comprised manufacturing samples with different raster angle orientations to capitalize on the influence of the filament alignment with the loading direction. One sample set was sterilized using an autoclave, while another was kept as a reference. The samples underwent a comprehensive characterization regimen of mechanical tension, compression and flexural testing. Thermal and microscale mechanical properties were also analyzed to explore the extent of the appreciated modifications as a function of processing conditions.

Thermal and microscale mechanical properties remained almost unaltered, whereas the mesoscale mechanical behavior varied from the as-printed to the after-autoclaving specimens. Although the mechanical behavior reported a pronounced dependence on the printing orientation, sterilization had minimal effects on the properties of 3D printed PMMA structures. Nonetheless, notable changes in appearance were attributed, and heat reversed as a response to thermally driven conformational rearrangements of the molecules.

This research further deepens the viability of 3D printed PMMA for biomedical applications, contributing to the overall comprehension of the polymer and the thermal processes associated with its implementation in biomedical applications, including personalized implants.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

Accurately evaluating fluid flow behaviors and determining permeability for deforming porous media is time-consuming and remains challenging. This paper aims to propose a novel machine-learning method for the rapid estimation of permeability of porous media at different deformation stages constrained by hydro-mechanical coupling analysis.

A convolutional neural network (CNN) is proposed in this paper, which is guided by the results of finite element coupling analysis of equilibrium equation for mechanical deformation and Boltzmann equation for fluid dynamics during the hydro-mechanical coupling process [denoted as Finite element lattice Boltzmann model (FELBM) in this paper]. The FELBM ensures the Lattice Boltzmann analysis of coupled fluid flow with an unstructured mesh, which varies with the corresponding nodal displacement resulting from mechanical deformation. It provides reliable label data for permeability estimation at different stages using CNN.

The proposed CNN can rapidly and accurately estimate the permeability of deformable porous media, significantly reducing processing time. The application studies demonstrate high accuracy in predicting the permeability of deformable porous media for both the test and validation sets. The corresponding correlation coefficients (R²) is 0.93 for the validation set, and the R² for the test set A and test set B are 0.93 and 0.94, respectively.

This study proposes an innovative approach with the CNN to rapidly estimate permeability in porous media under dynamic deformations, guided by FELBM coupling analysis. The fast and accurate performance of CNN underscores its promising potential for future applications.

The purpose of this paper is to compile a comprehensive status report on pipes/piping networks across different industrial sectors, along with specifications of materials and sizes, and showcase welding avenues. It further extends to highlight the promising friction stir welding as a single solid-state pipe welding procedure. This paper will enable all piping, welding and friction stir welding stakeholders to identify scope for their engagement in a single window.

The paper is a review paper, and it is mainly structured around sections on materials, sizes and standards for pipes in different sectors and the current welding practice for joining pipe and pipe connections; on the process and principle of friction stir welding (FSW) for pipes; identification of main welding process parameters for the FSW of pipes; effects of process parameters; and a well-carved-out concluding summary.

A well-carved-out concluding summary of extracts from thoroughly studied research is presented in a structured way in which the avenues for the engagement of FSW are identified.

The implications of the research are far-reaching. The FSW is currently expanding very fast in the welding of flat surfaces and has evolved into a vast number of variants because of its advantages and versatility. The application of FSW is coming up late but catching up fast, and as a late starter, the outcomes of such a review paper may support stake holders to expand the application of this process from pipe welding to pipe manufacturing, cladding and other high-end applications. Because the process is inherently inclined towards automation, its throughput rate is high and it does not need any consumables, the ultimate benefit can be passed on to the industry in terms of financial gains.

To the best of the authors’ knowledge, this is the only review exclusively for the friction stir welding of pipes with a well-organized piping specification detailed about industrial sectors. The current pipe welding practice in each sector has been presented, and the avenues for engaging FSW have been highlighted. The FSW pipe process parameters are characteristically distinguished from the conventional FSW, and the effects of the process parameters have been presented. The summary is concise yet comprehensive and organized in a structured manner.

With the rapid advancement in the automotive industry, the friction coefficient (FC), wear rate (WR) and weight loss (WL) have emerged as crucial parameters to measure the performance of automotive braking systems, so the FC, WR and WL of friction material are predicted and analyzed in this work, with an aim of achieving accurate prediction of friction material properties.

Genetic algorithm support vector machine (GA-SVM) model is obtained by applying GA to optimize the SVM in this work, thus establishing a prediction model for friction material properties and achieving the predictive and comparative analysis of friction material properties. The process parameters are analyzed by using response surface methodology (RSM) and GA-RSM to determine them for optimal friction performance.

The results indicate that the GA-SVM prediction model has the smallest error for FC, WR and WL, showing that it owns excellent prediction accuracy. The predicted values obtained by response surface analysis are closed to those of GA-SVM model, providing further evidence of the validity and the rationality of the established prediction model.

The relevant results can serve as a valuable theoretical foundation for the preparation of friction material in engineering practice.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.