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The purpose of this study is to investigate the thermomechanical condition on the shape memory property of Polybutylene adipate-co-terephthalate (PBAT). PBAT is a widely researched and rapidly developed biodegradable copolyester. In a tensile test, we found that the fractured PBAT samples had a heat-driven shape memory effect which piqued our interest, and it will lay a foundation for the application of PBAT in new fields (such as heat shrinkable film).

The shape memory effect of PBAT and the effect of the thermomechanical condition on its shape memory property were confirmed and systematically investigated by a thermal mechanical analyzer and tensile machine.

The results showed that the PBAT film had broad shape memory transform temperature and exhibited excellent thermomechanical stability and shape memory properties. The shape memory fixity ratio (Rf) of the PBAT films was increased with the prestrain temperature and prestrain, where the highest Rf exceeded 90%. The shape memory recovery ratio (Rr) of the PBAT films was increased with the shape memory recovery temperature and decreased with the prestrain value, and the highest Rr was almost 100%. Moreover, the PBAT films had high shape memory recovery stress which increased with the prestrain value and decreased with the prestrain temperature, and the highest shape memory recovery stress can reach 7.73 MPa.

The results showed that PBAT had a broad shape memory transform temperature, exhibited excellent thermomechanical stability and shape memory performance, especially for the sample programmed at high temperature and had a larger prestrian, which will provide a reference for the design, processing and application of PBAT-based heat shrinkable film and smart materials.

This study confirmed and systematically investigated the shape memory effect of PBAT and the effect of the thermomechanical condition on the shape memory property of PBAT.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

This study aims to develop a four-dimensional (4D) textile composite that self-forms upon thermal stimulation while eliminating thermomechanical programming steps by using fused deposition modeling (FDM) 3D printing technology, and tries to refine the product development path for this composite.

Polylactic acid (PLA) printing filaments were deposited on prestretched Lycra-knitted fabric using desktop-level FDM 3D printing technology to construct a three-layer structure of thermally responsive 4D textiles. Subsequently, the effects of different PLA thicknesses and Lycra knit fabric relative elongation on the permanent shape of thermally responsive 4D textiles were studied. Finally, a simulation program was written, and a case in this study demonstrates the usage of thermally responsive 4D textiles and the simulation program to design a wrist support product.

The constructed three-layer structure of PLA and Lycra knitted fabric can self-form under thermal stimulation. The material can also achieve reversible transformation between a permanent shape and multiple temporary shapes. Thinner PLA deposition and higher relative elongation of the Lycra-knitted fabric result in the greater curvature of the permanent shape of the thermally responsive 4D textile. The simulation program accurately predicted the permanent form of multiple basic shapes.

The proposed method enables 4D textiles to directly self-form upon thermal, which helps to improve the manufacturing efficiency of 4D textiles. The thermal responsiveness of the composite also contributes to building an intelligent human–material–environment interaction system.

The purpose of this paper is to assess the feasibility of analytical models, specifically the radial basis function method, Akbari–Ganji method and Gaussian method, in conjunction with the finite element method. The aim is to examine the impact of processing parameters on temperature history.

Through analytical investigation and finite element simulation, this research examines the influence of processing parameters on temperature history. Simufact software with a thermomechanical approach was used for finite element simulation, while radial basis function, Akbari–Ganji and Gaussian methods were used for analytical modeling to solve the heat transfer differential equation.

The accuracy of both finite element and analytical methods was validated with about 90%. The findings revealed direct relationships between thermal conductivity (from 100 to 200), laser power (from 400 to 800 W), heat source depth (from 0.35 to 0.75) and power absorption coefficient (from 0.4 to 0.8). Increasing the values of these parameters led to higher temperature history. On the other hand, density (from 7,600 to 8,200), emission coefficient (from 0.5 to 0.7) and convective heat transfer (from 35 to 90) exhibited an inverse relationship with temperature history.

The application of analytical modeling, particularly the utilization of the Akbari–Ganji, radial basis functions and Gaussian methods, showcases an innovative approach to studying directed energy deposition. This analytical investigation offers an alternative to relying solely on experimental procedures, potentially saving time and resources in the optimization of DED processes.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

Polymethyl methacrylate (PMMA) is a remarkable biocompatible material for bone cement and regeneration. It is also considered 3D printable but requires in-depth process–structure–properties studies. This study aims to elucidate the mechanistic effects of processing parameters and sterilization on PMMA-based implants.

The approach comprised manufacturing samples with different raster angle orientations to capitalize on the influence of the filament alignment with the loading direction. One sample set was sterilized using an autoclave, while another was kept as a reference. The samples underwent a comprehensive characterization regimen of mechanical tension, compression and flexural testing. Thermal and microscale mechanical properties were also analyzed to explore the extent of the appreciated modifications as a function of processing conditions.

Thermal and microscale mechanical properties remained almost unaltered, whereas the mesoscale mechanical behavior varied from the as-printed to the after-autoclaving specimens. Although the mechanical behavior reported a pronounced dependence on the printing orientation, sterilization had minimal effects on the properties of 3D printed PMMA structures. Nonetheless, notable changes in appearance were attributed, and heat reversed as a response to thermally driven conformational rearrangements of the molecules.

This research further deepens the viability of 3D printed PMMA for biomedical applications, contributing to the overall comprehension of the polymer and the thermal processes associated with its implementation in biomedical applications, including personalized implants.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This paper aims to investigate the current state of biocomposites used in fused deposition modelling (FDM) with a focus on their mechanical characteristics.

The study presents a variety of biocomposite materials that have been used in filaments for 3D printing by different researchers. The process of making filaments is then described, followed by a discussion of the process parameters associated with the FDM.

To achieve better mechanical properties of 3D-printed parts, it is essential to optimize the process parameters of FDM while considering the characteristics of the biocomposite material. Polylactic acid is considered the most promising matrix material due to its biodegradability and lower cost. Moreover, the use of natural fibres like hemp, flax and sugarcane bagasse as reinforcement to the polymer in FDM filaments improves the mechanical performance of printed parts.

The paper discusses the influence of critical process parameters of FDM like raster angle, layer thickness, infill density, infill pattern and extruder temperature on the mechanical properties of 3D-printed biocomposite.

Vision, audition, olfactory, tactile and taste are five important senses that human uses to interact with the real world. As facing more and more complex environments, a sensing system is essential for intelligent robots with various types of sensors. To mimic human-like abilities, sensors similar to human perception capabilities are indispensable. However, most research only concentrated on analyzing literature on single-modal sensors and their robotics application.

This study presents a systematic review of five bioinspired senses, especially considering a brief introduction of multimodal sensing applications and predicting current trends and future directions of this field, which may have continuous enlightenments.

This review shows that bioinspired sensors can enable robots to better understand the environment, and multiple sensor combinations can support the robot’s ability to behave intelligently.

The review starts with a brief survey of the biological sensing mechanisms of the five senses, which are followed by their bioinspired electronic counterparts. Their applications in the robots are then reviewed as another emphasis, covering the main application scopes of localization and navigation, objection identification, dexterous manipulation, compliant interaction and so on. Finally, the trends, difficulties and challenges of this research were discussed to help guide future research on intelligent robot sensors.