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Open Access
Article
Publication date: 21 January 2022

Yong Li, Yingchun Zhang, Gongnan Xie and Bengt Ake Sunden

This paper aims to comprehensively clarify the research status of thermal transport of supercritical aviation kerosene, with particular interests in the effect of cracking on heat…

1247

Abstract

Purpose

This paper aims to comprehensively clarify the research status of thermal transport of supercritical aviation kerosene, with particular interests in the effect of cracking on heat transfer.

Design/methodology/approach

A brief review of current research on supercritical aviation kerosene is presented in views of the surrogate model of hydrocarbon fuels, chemical cracking mechanism of hydrocarbon fuels, thermo-physical properties of hydrocarbon fuels, turbulence models, flow characteristics and thermal performances, which indicates that more efforts need to be directed into these topics. Therefore, supercritical thermal transport of n-decane is then computationally investigated in the condition of thermal pyrolysis, while the ASPEN HYSYS gives the properties of n-decane and pyrolysis products. In addition, the one-step chemical cracking mechanism and SST k-ω turbulence model are applied with relatively high precision.

Findings

The existing surrogate models of aviation kerosene are limited to a specific scope of application and their thermo-physical properties deviate from the experimental data. The turbulence models used to implement numerical simulation should be studied to further improve the prediction accuracy. The thermal-induced acceleration is driven by the drastic density change, which is caused by the production of small molecules. The wall temperature of the combustion chamber can be effectively reduced by this behavior, i.e. the phenomenon of heat transfer deterioration can be attenuated or suppressed by thermal pyrolysis.

Originality/value

The issues in numerical studies of supercritical aviation kerosene are clearly revealed, and the conjugation mechanism between thermal pyrolysis and convective heat transfer is initially presented.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 32 no. 9
Type: Research Article
ISSN: 0961-5539

Keywords

Article
Publication date: 28 October 2014

Abderrazzak El Boukili

The purpose of this paper is to provide a new three dimension physically based model to calculate the initial stress in silicon germanium (SiGe) film due to thermal mismatch after…

Abstract

Purpose

The purpose of this paper is to provide a new three dimension physically based model to calculate the initial stress in silicon germanium (SiGe) film due to thermal mismatch after deposition. We should note that there are many other sources of initial stress in SiGe films or in the substrate. Here, the author is focussing only on how to model the initial stress arising from thermal mismatch in SiGe film. The author uses this initial stress to calculate numerically the resulting extrinsic stress distribution in a nanoscale PMOS transistor. This extrinsic stress is used by industrials and manufacturers as Intel or IBM to boost the performances of the nanoscale PMOS and NMOS transistors. It is now admitted that compressive stress enhances the mobility of holes and tensile stress enhances the mobility of electrons in the channel.

Design/methodology/approach

During thermal processing, thin film materials like polysilicon, silicon nitride, silicon dioxide, or SiGe expand or contract at different rates compared to the silicon substrate according to their thermal expansion coefficients. The author defines the thermal expansion coefficient as the rate of change of strain with respect to temperature.

Findings

Several numerical experiments have been used for different temperatures ranging from 30 to 1,000°C. These experiments did show that the temperature affects strongly the extrinsic stress in the channel of a 45 nm PMOS transistor. On the other hand, the author has compared the extrinsic stress due to lattice mismatch with the extrinsic stress due to thermal mismatch. The author found that these two types of stress have the same order (see the numerical results on Figures 4 and 12). And, these are great findings for semiconductor industry.

Practical implications

Front-end process induced extrinsic stress is used by manufacturers of nanoscale transistors as the new scaling vector for the 90 nm node technology and below. The extrinsic stress has the advantage of improving the performances of PMOSFETs and NMOSFETs transistors by enhancing mobility. This mobility enhancement fundamentally results from alteration of electronic band structure of silicon due to extrinsic stress. Then, the results are of great importance to manufacturers and industrials. The evidence is that these results show that the extrinsic stress in the channel depends also on the thermal mismatch between materials and not only on the material mismatch.

Originality/value

The model the author is proposing to calculate the initial stress due to thermal mismatch is novel and original. The author validated the values of the initial stress with those obtained by experiments in Al-Bayati et al. (2005). Using the uniaxial stress generation technique of Intel (see Figure 2). Al-Bayati et al. (2005) found experimentally that for 17 percent germanium concentration, a compressive initial stress of 1.4 GPa is generated inside the SiGe layer.

Details

COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, vol. 33 no. 6
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 29 October 2019

Francois Hanus, Nicolas Caillet, Sylvain Gaillard and Olivier Vassart

This paper aims to describe coupon tests performed at elevated temperatures on S355 to S500 steel grades and comparison of test results with previous research studies and current…

Abstract

Purpose

This paper aims to describe coupon tests performed at elevated temperatures on S355 to S500 steel grades and comparison of test results with previous research studies and current EN 1993-1-2 material laws. The objective is to state if these steel grades satisfy to the current material laws and if the scope of application of these laws could be extended to S500 grades.

Design/methodology/approach

Two experimental programmes were launched to investigate the behaviour of S460M and S500M steel grades developed for hot-rolled sections. The first research programme was focussed on a comparison between S355 and S460 grades, where the second experimental programme was focussed on the recently developed S500M steel grade. The latter one comprised steady-state tests, transient-state tests and two large-scale beam tests.

Findings

Results of steady-state and transient-state tests correlate well with the reduction factors defined in EN 1993-1-2, currently limited to S460 grade. On the basis of this study, the scope of EN 1993-1-2 applies to S500 grades. For steady-state tests, the testing procedure (with and without acceleration after Rp0,2) led to noticeable differences. Transient-state tests, which are not standardised up to now, have been performed considering 5 K/min and 10 K/min constant heating rates. The slowest rate leads to lower strengths as creep effects are more significant. However, all the results are in line with EN 1993-1-2 material law. Importance should be given to the reference yield strength of steel at ambient temperature.

Originality/value

The revision of EN 1993-1-2 is on-going and this piece of work provides a contribution for extending the scope of application of material law of steel under fire conditions.

Details

Journal of Structural Fire Engineering, vol. 11 no. 2
Type: Research Article
ISSN: 2040-2317

Keywords

Article
Publication date: 1 January 1994

J. Lau, Y.‐H. Pao, C. Larner, R. Govila, S. Twerefour, D. Gilbert, S. Erasmus and S. Dolot

The reliability of 0.4 mm pitch, 28 mm body size, 256‐pin plastic quad flat pack (QFP) no‐clean and water‐clean solder joints has been studied by temperature cycling and…

Abstract

The reliability of 0.4 mm pitch, 28 mm body size, 256‐pin plastic quad flat pack (QFP) no‐clean and water‐clean solder joints has been studied by temperature cycling and analytical analysis. The temperature cycling test was run non‐stop for more than 6 months, and the results have been presented as a Weibull distribution. A unique temperature cycling profile has been developed based on the calculated lead stiffness, elastic and creep strains in the solder joint, and solder data. Also, the thermal fatigue life of the solder joints has been estimated and correlated with experimental results. Furthermore, a failure analysis of the solder joints has been performed using scanning electron microscopy (SEM). Finally, a quantitative comparison between the no‐clean and water‐clean QFP solder joints has been presented.

Details

Soldering & Surface Mount Technology, vol. 6 no. 1
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 12 January 2023

Shaoyi Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, Chenghui Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Zhixian Min, Daxing Zhang and Congsi Wang

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the…

Abstract

Purpose

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

Design/methodology/approach

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

Findings

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

Originality/value

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

Details

Microelectronics International, vol. 40 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

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