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Surface configuration at the interface between two materials makes a huge difference on thermal resistance. Thermal transient analysis is a powerful tool for thermal characterization of complex structures like LEDs. The purpose of this paper is to report the influence of surface finish on thermal resistance.

Surface of heat sink was modified into two categories: machined as channel like structure; and polished using mechanical polisher and tested with 3W green LED for thermal resistance analysis.

The observed surface roughness of rough and polished surface was 44 nm and 4 nm, respectively. Structure function analysis was used to determine the thermal resistance between heat sink and MCPCB board. The observed thermal resistance from junction to ambient (R_thJA) value measured with thermal paste at 700 mA was lower (34.85 K/W) for channel like surface than rough surface (36.5 K/W). The calculated junction temperature (T_J) for channel like surface and polished surface was 81.29°C and 85.24°C, respectively.

Channelled surface aids in increasing bond line thickness. Surface polishing helps to reduce the air gaps between MCPCB and heat sink and also to increase the surface contact conductance.

The proposed method of surface modification can be easily done at laboratory level with locally available techniques.

Much of the available literature is only concentrating on the design modification and heat transfer from fins to ambient. There was little research on modification of top surface of the heat sink and the proposed concept would give good results and also it will make the material cost reduction as well as material too.

Proper thermal management is a key to improve the efficiency and reliability of light-emitting diodes (LEDs). This paper aims to report the influence of applying thermally conductive materials on thermal performance of indium gallium aluminum phosphide (InGaAlP)-based thin-film surface-mounted device (SMD) LED.

The LED thermal and optical parameters were determined using the combination of thermal transient tester (T3Ster) and thermal and radiometric characterization of power LEDs (TeraLED) instruments. The LED was mounted on FR4, 2W and 5W aluminum (Al) package substrates. Measurements were carried out by setting different boundary conditions: air between LED package and substrate and using thermally conductive epoxy (TIM A) and adhesive (TIM B) of thermal conductivity 1.67 and 1.78 W/mK, respectively.

For LED mounted on FR4 package, the total real thermal resistance is improved because of TIM B by 6 and 9 per cent at 50 and 100 mA, respectively. Likewise, the relative decrease in total thermal resistance of LED on 2W Al package is about 9 and 11 per cent. As well, for LED mounted on 5W Al package, the total real thermal resistance is reduced by 2 and 4 per cent.

No much work can be found in the literature on thermal interface material effects on thermal performance of low-power SMD LED. This work can assist in thermal management of low-power LEDs.

The purpose of this research is to study the effect of thickness and surface properties of ZnO solid thin film for heat dissipation application in LED. Heat dissipation in electronic packaging can be improved by applying a thermally conductive interface material (TIM) and hence the junction temperature will be maintained. ZnO is one of the oxide materials and used as a filler to increase the thermal conductivity of thermal paste. The thickness of these paste-type material cannot be controlled which restricts the heat flow from the LED junction to ambient. The controlled thickness is only possible by using a solid thin-film interface material.

Radio Frequency (RF)-sputtered ZnO thin film on Cu substrates were used as a heat sink for high-power LED and the thermal performance of various ZnO thin film thickness on changing total thermal resistance (R _th-tot) and rise in junction temperature were tested. Thermal transient analysis was used to study the performance of the given LED. The influence of surface roughness profile was also tested on the LED performance.

The junction temperature was high (6.35°C) for 200 nm thickness of ZnO thin film boundary condition when compared with bare Cu substrates. Consecutively, low R _th-tot values were noticed with the same boundary condition. The 600 nm thickness of ZnO thin film exhibited high R _th-tot and interface resistance than the other thicknesses. Bond Line Thickness of the interface material was influenced on the interface thermal resistance which was decreased with increased BLT. Surface roughness parameter showed an immense effect on thermal transport, and hence, low R _th (47.6 K/W) value was noticed with low film roughness (7 nm) as compared with bare Cu substrate (50.8 K/W) where the surface roughness was 20.5 nm.

Instead of using thermal paste, solid thin film ZnO is used as TIM and coated Cu substrates were used as a heat sink. The thickness can be controlled, and it is a new approach for reducing the BLT between the metal core printed circuit board and heat sink.

One major problem in the lighting industry is the thermal management of the devices. Handling of thermal resistance from solder point to the ambiance of the light-emitting diode (LED) package is linked to the external thermal management that includes a selection of the cooling mode, design of heatsink/substrate and thermal interface material (TIM). Among the significant factors that increase the light output of the of the LED system are efficient substrate and TIM. In this work, the influence of TIM on the luminous flux performance of commercial indium gallium aluminium phosphide (InGaAlP) low-power (LP) LEDs was investigated.

One batch of LEDs was mounted directly onto substrates which were glass-reinforced epoxy (FR4) and aluminium-based metal-core printed circuit boards (MCPCBs) with a dielectric layer of different thermal conductivities. Another batch of LEDs was prepared in a similar way, but a layer of TIM was embedded between the LED package and substrate. The TIMs were thermally conductive epoxy (TCE) and thermally conductive adhesive (TCA). The LED parameters were measured by using the integrated system of thermal transient tester (T3Ster) and thermal-radiometric characterization of LEDs at various input currents.

With the employment of TIM, the authors found that the LED’s maximum luminous flux was significantly higher than the value mentioned in the LED datasheet, and that a significant reduction in thermal resistance and junction temperature was revealed. The results showed that for a system with low thermal resistance, the maximum luminous flux appeared to occur at a higher power level. It was found that the maximum luminous flux was 24.10, 28.40 and 36.00 lm for the LEDs mounted on the FR4 and two MCPCBs, respectively. After TCA application on the LEDs, the maximum luminous flux values were 32.70, 36.60 and 37.60 lm for the FR4 and MCPCBs, respectively. Moreover, the findings demonstrated that the performance of the LED mounted on the FR4 substrate was more affected by the employment of the TIM than that of MCPCBs.

One of the major problems in the lighting industry is the thermal management of the device. In many low-power LED applications, the air gap between the two solder pads is not filled up. Heat flow is restricted by the air gap leading to thermal build-up and higher thermal resistance resulting in lower maximum luminous flux. Among the significant factors that increase the light output of the LED system are efficient substrate and TIM.

The findings in this work can be used as a method to improve thermal management of LP LEDs by applying thermal interface materials that can offer more efficient and brighter LP LEDs. Using aluminium-based substrates can also offer similar benefits.

Users of LP LEDs can benefit from the findings in this work. Brighter automotive lighting (signalling and backlighting) can be achieved, and better automotive lighting can offer better safety for the people on the street, especially during raining and foggy weather. User can also use a lower LED power rating to achieve similar brightness level with LED with higher power rating.

Better thermal management of commercial LP LEDs was achieved with the employment of thermal interface materials resulting in lower thermal resistance, lower junction temperature and brighter LEDs.

This paper aims to study the influence of the Cu-Al₂O₃ film-coated Cu substrate as a thermal interface material (TIM) on the thermal and optical behaviour of the light-emitting diode (LED) package and the annealing effect on the thermal and optical properties of the films.

A layer-stacking technique has been used to deposit the Cu-Al₂O₃ films by means of magnetron sputtering, and the annealing process was conducted on the synthesized films.

In this paper, it was found that the un-annealed Cu-Al₂O₃–coated Cu substrate exhibited low value of thermal resistance compared to the bare Cu substrate and to the results of previous works. Also the annealing effect does not have a significant impact on the changes of properties of the films.

It is deduced that the increase of the Cu layer thickness can further improve the thermal properties of the deposited film, which can reduce the thermal resistance of the package in system-level analysis.

The paper suggested that the Cu-Al₂O₃–coated Cu substrate can be used as alternative TIM for the thermal management of the application of LEDs.

In this paper, the Cu substrate has been used as the substrate for the Cu-Al₂O₃ films, as the Cu substrate has higher thermal conductivity compared to the Al substrate as shown in previous work.

Vibration exists widely in all machineries working under high speed. The unpredictability of vibration and the change of the relative surface speed may result in difficulties in the elastohydrodynamic lubrication (EHL) analysis. By far, few studies on EHL relating to vibration have been published. The purpose of the present study is to investigate the effect of the vertical vibrations and the influence of temperature on the thermal EHL contacts.

The lubricant was assumed to be Newtonian fluid. The time-dependent numerical solutions were achieved instant after instant in each period of the vibration. At each instant, the pressure field was solved with a multi-level technique, the surface deformation was solved with a multi-level multi-integration method and the temperature filed was solved with a finite different scheme through a sweeping progress. The periodic error was checked at each end of the vibration period until the responses of pressure, film thickness and temperature were all periodic functions with the frequency of the roller’s vibrations.

The results reveal that normal vibration produces little drastic change of pressure, film thickness and temperature in EHL. Under some conditions, the vibrations of the roller can produce transient dimples within the contact conjunction. It is also showed that the lubrication in the same sliding is better than the opposite sliding.

For the unpredictability of vibration, it is not easy to do the experiment to realize a real comparison with numerical results. The reach does not show any verification and consider the effect of non-Newtonian fluid.

The effect of the vertical vibrations on the thermal EHL point contact hast been studied. The effects of both the amplitude and the frequency on the predicted load-carrying capacity, minimum film thickness, center pressure and center temperature and the coefficient of friction were investigated. The role of the thermal effect was given.

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (R_th) and rise in junction temperature (T_J) are critical parameters. The purpose of this work is to evaluate the R_th and T_j of the LED attached with the modified heat transfer area of the heatsink to improve thermal management.

This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink.

T_J was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm² (flat) to 3,076 mm² (outward step). On comparison with inward step geometry, the T_J value was low for outward step configuration (ΔT_J ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both R_th and T_J for different driving currents.

This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.

This paper aims to develop an efficient numerical method for nonlinear transient heat conduction problems with local radiation boundary conditions and nonlinear heat sources.

Based on the physical characteristic of the transient heat conduction and the distribution characteristic of the Green’s function, a quasi-superposition principle is presented for the transient heat conduction problems with local nonlinearities. Then, an efficient method is developed, which indicates that the solution of the original nonlinear problem can be derived by solving some nonlinear problems with small structures and a linear problem with the original structure. These problems are independent of each other and can be solved simultaneously by the parallel computing technique.

Within a small time step, the nonlinear thermal loads can only induce significant temperature responses of the regions near the positions of the nonlinear thermal loads, whereas the temperature responses of the remaining regions are very close to zero. According to the above physical characteristic, the original nonlinear problem can be transformed into some nonlinear problems with small structures and a linear problem with the original structure.

An efficient and accurate numerical method is presented for transient heat conduction problems with local nonlinearities, and some numerical examples demonstrate the high efficiency and accuracy of the proposed method.

The paper aims to give an insight into the behaviour of reinforced concrete columns during and after the cooling phase of a fire. The study is based on numerical simulations as these tools are frequently used in structural engineering. As the reliability of numerical analysis largely depends on the validity of the constitutive models, the development of a concrete model suitable for natural fire analysis is addressed in the study.

The paper proposes theoretical considerations supported by numerical examples to discuss the capabilities and limitations of different classes of concrete models and eventually to develop a new concrete model that meets the requirements in case of natural fire analysis. Then, the study performs numerical simulations of concrete columns subjected to natural fire using the new concrete model. A parametric analysis allows for determining the main factors that affect the structural behaviour in cooling.

Failure of concrete columns during and after the cooling phase of a fire is a possible event. The most critical situations with respect to delayed failure arise for short fires and for columns with low slenderness or massive sections. The concrete model used in the simulations is of prime importance and the use of the Eurocode model would lead to unsafe results.

The paper includes implications for the assessment of the fire resistance of concrete elements in a performance‐based environment.

The paper provides original information about the risk of structural collapse during cooling.

The purpose of this paper is to prepare procedures for determination of characteristics and parameters of DC cables on the basis of transient and steady thermal field distribution in their cross-sections.

Steady-state current rating was computed iteratively, with the use of steady thermal field distribution in the cable. The iterative process was regulated with respect to this field by changes of the mean surface temperature of the sheath of the cable. It was also controlled with respect to the unknown current rating by deviations of the temperature of the core from the maximum sustained temperature of the insulation (material zone) adjacent to the core. Heating curves were determined (in arbitrarily selected points of the cross-section of the cable) by a parallel algorithm described thoroughly in the first part of the paper. The algorithm was used for computing of transient thermal field distribution throughout the whole cross-section. Thermal time constant distributions were determined by the trapezium rule, where the upper integration limit of respective thermal field distributions was being changed.

Using the methods prepared the following characteristics/parameters of the cable were determined: steady-state current rating, spatial-time heating curves, mean thermal time constant distribution. The results were verified and turned to be in conformance with those of the IEC 287 Standard and a commercial software – Nisa v. 16. Speedup and efficiency of the parallel computations were calculated. It was concluded that the parallel computations took less time than the sequential ones.

The specialized algorithms and software are dedicated to cylindrical DC cables.

The knowledge of the determined characteristics and parameters contributes to optimal exploitation of a DC cable during its use.

The algorithms of determination of the steady-state current rating and thermal time constant are original. The software described in the appendix has also been made by the authors.