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This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

Three-dimensional printing (3DP) is an established process to print structural parts of metals, ceramic and polymers. Further, multi-material 3DP has the potentials to be a milestone in rapid manufacturing (RM), customized design and structural applications. Being compatible as functionally graded materials in a single structural form, multi-material-based 3D printed parts can be applied in structural applications to get the benefit of modified properties.

The fused deposition modelling (FDM) is one of the established low cost 3DP techniques which can be used for printing functional/ non-functional prototypes in civil engineering applications.

The present study is focused on multi-material printing of primary recycled acrylonitrile butadiene styrene (ABS), polylactic acid (PLA) and high impact polystyrene (HIPS) in composite form. Thermal (glass transition temperature and heat capacity) and mechanical properties (break load, break strength, break elongation, percentage elongation at break and Young’s modulus) have been analysed to observe the behaviour of multi-material composites prepared by 3DP. This study also highlights the process parameters optimization of FDM supported with photomicrographs.

The present study is focused on multi-material printing of primary recycled ABS, PLA and HIPS in composite form.

Purpose – The purpose of this research is to synthesize modified thermoplastic sago starch (TPS) through in-situ mechanism by reacting sago starch with diphenylmethanediisocyanate (MDI) and castor oil simultaneously, resulting in a more homogenous and finer-sized polyurethane prepolymer (PUP).

Design/Methodology/Approach – The methods used were Thermal Gravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC) for thermal characterization and stability of PUP, modified TPS non-extracted and extracted with toluene and water.

Findings – TGA test results presented shows that PUP begins to decompose thermally at a temperature of 300–500 °C. Weight loss occurs rapidly between these temperatures and is completely discharged at a temperature of 500°C, which is called weight loss transition.

Research Limitations/Implications – When extracted with toluene and a water solvent, the melting point and latent heat of fusion slightly decreased; however, it is still higher than the original value of sago. In terms of thermal stability, modified TPS decomposes and loses weight at 150–200 °C in small quantities, continues with weight loss rapidly, and is completely discharged at 500°C. The thermal stability is considered high; thus, modified TPS application can be varied.

Practical Implications – DSC analysis and TGA shows that modified TPS has good thermal characteristics and thermal stability. Modified TPS has a melting point of 104.69°C, and the latent heat of fusion (ΔH) is 234.27 J/g. This value is close to the PUP melting point and latent heat of fusion, which reveals the formation of cross-link between the starch and PUP.

In fire resistance tests (FRTs) of building materials, a crucial criterion to pass the test procedure is to avoid the leakage of the hot flue gases caused by gaps and cracks occurring due to the thermal exposure. The present study's aim is to calculate the deformation of a steel door, which is embedded within a wall made of bricks, and qualitatively determine the flue gas leakage.

A computational fluid dynamics/finite element method (CFD/FEM) coupling was introduced representing an intermediate approach between a one-way and a full two-way coupling methodology, leading to a simplified two-way coupling (STWC). In contrast to a full two way-coupling, the heat transfer through the steel door was simulated based on a one-way approach. Subsequently, the predicted temperatures at the door from the one-way simulation were used in the following CFD/FEM simulation, where the fluid flow inside and outside the furnace as well as the deformation of the door were calculated simultaneously.

The simulation showed large gaps and flue gas leakage above the door lock and at the upper edge of the door, which was in close accordance to the experiment. Furthermore, it was found that STWC predicted similar deformations compared to the one-way coupling.

Since two-way coupling approaches for fluid/structure interaction in fire research are computationally demanding, the number of studies is low. Only a few are dealing with the flue gas exit from rooms due to destruction of solid components. Thus, the present study is the first two-way approach dealing with flue gas leakage due to gap formation.