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The purpose of this paper is to show how, with a view to the shortcomings of traditional optimization methods, a multi‐objective optimization concerning the structure sizes of micro‐channel heat sink is performed by adaptive genetic algorithm. The optimized micro‐channel heat sink is simulated by computational fluid dynamics (CFD) method, and the total thermal resistance is calculated to compare with that of thermal resistance network model.

Taking the thermal resistance and the pressure drop as goal functions, a multi‐objective optimization model was proposed for the micro‐channel cooling heat sink based on the thermal resistance network model. The coupled solution of the flow and heat transfer is considered in the optimization process, and the aim of the procedure is to find the geometry most favorable to simultaneously maximize heat transfer while obtaining a minimum pressure drop. The optimized micro‐channel heat sink was numerically simulated by CFD software.

The results of optimization show that the base convection thermal resistance contributes to maximum the total thermal resistance, and base conduction thermal resistance contributes to least. The width of optimized micro‐channel and fin are 197 and 50 μm, respectively, and the corresponding total thermal resistance of the whole micro‐channel heat sink is 0.838 K/W, which agrees well with the analysis result of thermal resistance network model.

The convection heat transfer coefficient is calculated approximately here for convenience, and that may induce some errors.

The maximum difference in temperature of the optimized micro‐channel cooling heat sink is 84.706 K, which may satisfy the requirement for removal of high heat flux in new‐generation chips. The numerical simulation results are also presented, and the results of numerical simulation show that the optimized micro‐channel heat sink can enhance thermal transfer performance.

This paper shows how the evolutionary structural optimization (ESO) algorithm can be used to achieve a multiple criterion design for a structure in a thermal environment. The proposed thermal ESO procedure couples an evolutionary iterative process of a finite element heat conduction solution and a finite element thermoelastic solution. The overall efficiency of material usage is measured in terms of the combination of thermal stress levels and heat flux densities by using a combination strategy with weighting factors. The ESO method then works by eliminating from the structural domain under‐utilized material. In this paper, a practical design example of a printed circuit board substrate is presented to illustrate the capabilities of the ESO algorithm for thermal design optimization in multiple load environments.

The purpose of this paper is to describe an element addition strategy for topology optimization of thermally actuated compliant mechanisms under uniform temperature fields.

The proposed procedure is based on the evolutionary structural optimization (ESO) method. In previous works, this group of authors has successfully applied the ESO method for compliant mechanism optimization under directly applied input loads. The present paper progresses on this work line developing an extension of this procedure, based on an additive version of the method, to approach the more complicated case of thermal actuators.

The adopted method has been tested in several numerical applications and benchmark examples to illustrate and validate the approach, and designs obtained with this method are compared favorably with the analytical solutions and results derived by other authors using different optimization methods, showing the viability of this technique for uniformly heated actuators optimization.

As a simple initial approach, this research considers only uniform heating of the system, while many thermal actuators are heated nonuniformly. Future works will be based on electrothermal actuation, and nonuniform Joule heating will be considered as well, which might lead to more elegant and efficient solutions.

Compliant micromechanisms that are responsible for movement play a crucial role in microelectromechanical systems (MEMS) design, which cannot be manufactured using typical assembly processes and may not make use of traditional hinges or bearings. The topology optimization method described in this paper enables the systematic design of these devices, which can result in reduced conception time and manufacturing cost.

The ESO method has been successfully applied to several optimum material distribution problems, but not for thermal compliant mechanisms. Even if most applications of this method have been oriented for maximum stiffness structure design, this paper shows that this computation method may be also useful in the design of thermal compliant mechanisms and provides engineers with a very simple and practical alternative design tool.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

The purpose of this paper is to compare the thermal resistances between optimized gallium- and water-based heat sinks to show which one is superior.

Taking the thermal resistances of heat sinks as the goal function, an optimization process is programmed based on the genetic algorithm. The optimal channel/fin widths and the corresponding thermal resistances of gallium- and water-based heat sinks are obtained and compared with/without a laminar flow constraint. The analytic model and CFD method are applied in different situations to ensure sufficient accuracy.

The results show that in the laminar regime, the thermal resistance of optimized gallium-based heat sink is lower than the water-based counterpart in most cases, but the latter becomes better if it is long enough or the channel is sufficient high. Without the laminar constraint, the thermal resistance of the optimized gallium-based heat sink can be decreased by 33-45 per cent compared with the water-based counterparts. It is interesting to find that when the heat sink is long or the channel height is short, the optimal geometry of gallium-based heat sink is a mini gap.

This paper demonstrates that the cooling performance of gallium-based heat sink can be significantly improved by optimization without the laminar flow constraint.

Improper evaluation and information mismanagement concerning thermal comfort appears to negatively affect occupants' satisfaction and building energy consumption in precast concrete (PC) building contexts. Predictive models are particularly problematic in PC building construction projects where natural ventilation levels do not coincide with occupants' thermal comfort and thermal sensation specifications.

A systematic literature review is undertaken to explore the viability and benefits of a new ICT-based approach for meeting social and environmental objectives.

Sophisticated thermal comfort system solutions are essential for optimising thermal comfort and saving energy in PC building construction projects.

It is imperative that designers and manufacturers are kept up-to-date with the possibilities and potentials associated with new and nascent technologies so that building projects can meet key sustainability criteria.

This paper aims to investigate thermal geometric optimisation of rectangular heat conductive cooling structures within solid heat‐generating media for the purpose of minimising peak temperatures and enabling optimum use of spatial volume within integrated power electronics.

A vortex‐centred finite volume numerical solver was developed, employing a fully implicit solution algorithm to obtain 3D temperature distributions. By comparing the peak temperatures obtained for a wide range of related cases, optimised cross‐sectional shapes for particular input conditions were obtained.

Optimum shapes are dependent on seven identified parameters. In cases where a low percentage of volume is occupied by cooling structures, a high tendency exists for continuous thin cooling layers, as opposed to discrete rectangular cooling inserts, to present the best thermal behaviour. At higher volume percentages, the opposite is true.

The reduced dimensions of cooling inserts have caused manufacturability to be a concern. Research has shown that at small dimensional scale ranges the cross‐sectional shape of the cooling insert has little influence on its thermal performance. In such cases little or no thermal advantage or loss is incurred by making use of continuous cooling layers, which are easiest to manufacture.

The tendencies of optimum cooling structure shapes were obtained and described in terms of seven geometric and material property‐related parameters. Thermal performance of individual inserts is not linearly proportional to dimensional scaling and it was found that, at small‐scale ranges, optimisation from a manufacturing viewpoint would not significantly impact on thermal performance.

This paper aims to develop a selective energy optimisation of the photovoltaic–thermal (PV/T) system performance. The PV cell inside the PV/T system could be periodically manipulated to produce domestic hot water without applying an external power supply.

A numerical simulation model of the proposed PV/T model was developed in MATLAB/Simulink to analyse the selective energy optimisation of the model. The extrinsic cell resistance (R_se) is adjusted to control the ratio of thermal to the electrical energy, generated from the PV cell inside the PV/T system. Therefore, the internal heat of the PV cell inside the PV/T system is periodically used as a thermal element to produce electrical power and hot water.

The optimisation of PV/T energy shows that the electrical power efficiency can increase by 11.6% when R_se was 0 Ω, and the 200 L water tank temperature increased by 22ºC when R_se was 50 Ω.

This study showed that the use of the PV cell could be extended to domestic hot water and space heating, and not only for electricity.

Responsible for lift generation, the helicopter rotor is an essential component to protect against ice accretion. As rotorcraft present a smaller wing cross-section and a lower available onboard power compared to aircraft, electro-thermal heating pads are favored as they conform to the blades’ slender profile and limited volume. Their optimization is carried out here taking into account, for the first time, the highly three-dimensional (3D) nature of the flow and ice accretion, in contrast to the current state-of-the-art that is limited to two-dimensional (2D) airfoils.

Conjugate heat transfer simulation results are provided by the truly 3D finite element Navier–Stokes analysis package-ICE code, embedded in a proprietary rotorcraft simulation toolkit, with reduced-order modeling providing a time-efficient evaluation of the objective and constraint functions at every iteration. The proposed methodology optimizes heating pads extent and power usage and is versatile enough to address in a computationally efficient manner a wide variety of optimization formulations.

Low-error reduced-order modeling strategies are introduced to make the tackling of complex 3D geometries feasible in todays’ computers, with the developed framework applied to four problem formulations, demonstrating marked reductions to power consumption along with improved aerodynamics.

The present paper proposes a 3D framework for the optimization of electro-thermal rotorcraft ice protection systems, in hover and forward flight. The current state-of-the-art is limited to 2D airfoils.

There are many investigations in design methodologies, but there are also divergences and convergences as there are so many points of view. This study aims to evaluate to corroborate and deepen other researchers’ findings, dissipate divergences and provide directing to future work on the subject from a methodological and convergent perspective.

This study analyzes the previous reviews (about 15 reviews) and based on the consensus and the classifications provided by these authors, a significant sample of research is analyzed in the design for additive manufacturing (DFAM) theme (approximately 80 articles until June of 2017 and approximately 280–300 articles until February of 2019) through descriptive statistics, to corroborate and deepen the findings of other researchers.

Throughout this work, this paper found statistics indicating that the main areas studied are: multiple objective optimizations, execution of the design, general DFAM and DFAM for functional performance. Among the main conclusions: there is a lack of innovation in the products developed with the methodologies, there is a lack of exhaustivity in the methodologies, there are few efforts to include environmental aspects in the methodologies, many of the methods include economic and cost evaluation, but are not very explicit and broad (sustainability evaluation), it is necessary to consider a greater variety of functions, among other conclusions

The novelty in this study is the methodology. It is very objective, comprehensive and quantitative. The starting point is not the case studies nor the qualitative criteria, but the figures and quantities of methodologies. The main contribution of this review article is to guide future work on the subject from a methodological and convergent perspective and this article provides a broad database with articles containing information on many issues to make decisions: design methodology; optimization; processes, selection of parts and materials; cost and product management; mechanical, electrical and thermal properties; health and environmental impact, etc.