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The purpose of this paper is to present a new method of measuring thermal resistance of power light-emitting diodes (LEDs). Properties of power LEDs strongly depend on their internal temperature. The value of this temperature depends on the cooling conditions characterized by thermal resistance.

The new method of measuring the value of this parameter belongs to the group of electric methods. In this method, the problem of estimating the value of electrical power converted into light is solved. By comparing the values of the case temperature obtained for the LED operating in the forward mode and the reverse-breakdown mode, the thermal power is estimated. On the basis of the measured value of the thermally sensitive parameter (the LED forward voltage) and the estimated value of the thermal power, thermal resistance is calculated.

The elaborated method was used to measure thermal resistance of the selected types of power LEDs operating at different cooling conditions. The correctness of the elaborated measurement method was proved by comparing the results of measurements obtained with the use of the new method and the infrared method.

On the basis of the obtained results of measurements and the catalog data of the tested diodes, the dependence of the measurement error of thermal resistance of the LED on its luminous efficiency is discussed.

The new measurement method is easy to use and more accurate than the classical method of thermal resistance measurement of the diode.

This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.

Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.

The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.

It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

This paper will describe how methods developed in structural dynamics may be used to solve a problem of microsystem technologies. In microsystem simulation, determination of the physical properties is of considerable interest. The method of thermal wave measurement is often used today to describe the thermal behaviour of microstructures. The simulation of thermal wave effects based on thermal mode vectors and followed by a sensitivity analysis enables the correction of primarily estimated thermal parameters by fitting calculated results with measured information. Model description and sensitivity analysis offer an effective tool for determining thermal parameters by thermal wave measurement in a fast and clear manner. Thermal wave measurement, simulation and sensitivity analysis together may be used for device design as well as for testing.

A new hybrid substrate technology for power electronic applications has been characterised by thermal resistance and mechanical stress measurements. The new substrate utilises thermal spray technology for deposition of dielectric layer and electrical conductors. The results are compared with the more established technology of alumina substrates with direct copper bonding (DCB) metallisation. Silicon test chips for thermal resistance and mechanical stress measurement were used for the characterisation. The experimental results were compared with finite element analysis and a reasonable agreement was found.

The purpose of this paper is to acquire thermal conductivities of both fresh and preheated polyamide 12 powder under various conditions to provide a basis for effective and accurate control during the laser sintering (LS) process.

A Hot Disk® TPS 500 thermal measurement system using a transient plane source (TPS) technology was employed for thermal conductivity measurements. Polyamide 12 powder was packed at different densities, and different carrier gases were used. Tests were also performed on fully dense laser sintered polyamide 12 to establish a baseline.

Polyamide 12 powder thermal conductivity varies with packing density and temperature, which is approximately one-third bulk form thermal conductivity. Inter-particle bonding is the primary factor influencing polyamide 12 thermal conductivity.

Limited ranges of density were tested, and the carrier gas needed carefully control to prevent powder oxidation. Thermal properties obtained were not tested in the LS process.

This experimental result could be used to enhance thermal control during the LS process.

This paper aims to present the results of measurements and calculations illustrating mutual thermal coupling between power Schottky diodes made of silicon carbide situated in the common case.

The idea of measurements of mutual transient thermal impedances of the investigated device is described.

The results of measurements of mutual transient thermal impedances between the considered diodes are shown. The experimentally verified results of calculations of the internal temperature waveforms of the considered diodes obtained with mutual thermal coupling taken into account are presented and discussed. The influence of mutual thermal coupling and a self-heating phenomenon on the internal temperature of the considered diodes is pointed out.

The presented methods of measurements and calculations can be used for constructing the investigated diodes made of other semiconductor materials.

The presented results prove that mutual thermal coupling between diodes mounted in the common case must be taken into account to calculate correctly the waveforms of the device internal temperature.

The purpose of this paper is to analyze the bulk energy transport processes in the build chamber environment before and during laser sintering (LS) to provide a basis for effective and accurate thermal control for the LS process. This leads to improved mechanical properties and geometrical tolerances for LS products and may be applied to optimize operation cycle times for the LS process.

Computational models with two levels of complexity were built to explore the heat transfer mechanisms in the LS process. In a one-dimensional model (1D), the powder performed as a semi-infinite solid and heater flux to the powder surface was modeled with a heater control law. A two-dimensional (2D) fluid/solid finite element model of the build chamber and powder bins provided insight into the thermal processes in the build chamber.

Numerical 1D simulations were verified with measurements from sensors embedded in the build chamber powder bed. Using a 2D model, computed powder surface temperatures during the warm up and build phases were verified with an infrared camera. Convective currents in the build chamber and non-uniformities in the distribution of temperature over the radiant heater surface were found to be substantial contributors to non-uniformities in the powder bed surface temperature.

Limited heat sources were analyzed. No three-dimensional model was built. Assumptions to decrease the part bed temperature difference were not tested.

These simulation and experimental results may be used to enhance thermal control and operation efficiency during the LS process and to improve LS product mechanical properties.

The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules.

LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors.

The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB.

Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current.

The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

The purpose of this paper is to deal with performance verification of thermal insulation fillings that are used for outer clothes into cold environments. Thermal properties of filling materials (down and three sophisticated fillings) were tested under condition approaching real weather conditions in Middle Europe.

In the paper, modern method of thermal resistance Rct measurement, by Sweating Guarded-Hotplate system, was compared with method of Technical University of Liberec (TUL method). The TUL method shows good results and it is applicable even at ambient temperatures below zero, which fully corresponds to real application of the insulation filling.

Evaluation of fibre battings were carried out even at temperatures below the freezing point, which is important for simulation of actual application of these filling structures. The highest thermal resistance of goose down confirm that natural materials have their irreplaceable position, especially in application into clothes for extreme conditions.

There does not include effect of the humidity change on thermal insulation properties. It will be subject of further research of authors.

The investigation of thermal insulation properties were carried out under conditions approaching real application of tested materials, namely, at low ambient temperature.