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The gradual increase in geriatric issues and global imbalance of the ratio between patients and healthcare professionals have created a demand for intelligent systems with the least error-prone diagnosis results to be used by less medically trained persons and save clinical time. This paper aims at investigating the development of image-based colourimetric analysis. The purpose of recognising such tests is to support wider users to begin a colourimetric test to be used at homecare settings, telepathology and so on.

The concept of an automatic colourimetric assay detection is delivered by utilising two cases. Training deep learning (DL) models on thousands of images of these tests using transfer learning, this paper (1) classifies the type of the assay and (2) classifies the colourimetric results.

This paper demonstrated that the assay type can be recognised using DL techniques with 100% accuracy within a fraction of a second. Some of the advantages of the pre-trained model over the calibration-based approach are robustness, readiness and suitability to deploy for similar applications within a shorter period of time.

To the best of the authors’ knowledge, this is the first attempt to provide colourimetric assay type classification (CATC) using DL. Humans are capable to learn thousands of visual classifications in their life. Object recognition may be a trivial task for humans, due to photometric and geometric variabilities along with the high degree of intra-class variabilities, it can be a challenging task for machines. However, transforming visual knowledge into machines, as proposed, can support non-experts to better manage their health and reduce some of the burdens on experts.

This paper seeks to describe and discuss the historical development of IR sensors used in thermal imaging and to identify and consider some recent research trends.

This paper first considers cooled semiconductor photon detectors and their limitations and then traces the historical development of un‐cooled IR sensing technologies and their commercialisation. It then discusses certain present‐day developments and research trends.

This paper shows that military‐funded research by the USA in the 1980s led to families of un‐cooled IR sensors, pyroelectric detectors and microbolometers, that have since been widely commercialised. Research continues in the search for a technology that can yield un‐cooled sensors offering the sensitivity of cooled devices, such as Golay cells, microcantilever arrays and biomimetics.

This paper traces the technological evolution of un‐cooled thermal imaging sensors and identifies and considers recent research.

When looking at the possible ways of performing quality assurance or evaluation of materials in a non‐destructive manner, thermography rates as one of the key techniques available. This is because it offers several advantages, namely:

As printed wiring boards move to thin laminate structures, there is growing interest in the use of photoimageable coatings to serve as dielectric. Shipley has developed a liquid photoimageable dielectric which combines liquid coating, imaging and plateability. This paper presents work using this material to produce electrolessly plated lines and blind vias, along with initial adhesion data. Some of the interesting properties of this material are: low dielectric constant, low moisture absorption and good compliance to stress. The material can be processed to provide a high Tg and high plated adhesion can be obtained using conventional swell and etch techniques. It can be imaged and processed using conventional printed circuit coating and imaging techniques. This material will offer a relatively low cost alternative to thin clad laminates and may find use for adding one or two layers to a conventional multilayer board or in providing surface topography for surface mount devices. The paper describes recent developments related to this dielectric and its use.

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

The ability to see in the dark is a key differentiator in many military scenarios and the development of thermal imaging (TI) systems has provided the military with a battle winning capability. One of the current key thrusts is to be able to detect and identify targets at significantly longer ranges. The research programme in QinetiQ has been providing solutions to satisfy these requirements for many years. In addition, one of the major benefits from this research, has been the opportunity to provide TI sensors into the civil market for application including fire fighting. In this review many of the new concepts currently being developed are described and illustrated.