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1 – 10 of over 4000Muhammad Aamir, Majid Tolouei-Rad, Israr Ud Din, Khaled Giasin and Ana Vafadar
Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome…
Abstract
Purpose
Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome some of the shortcomings related to its microstructure and in turn, its mechanical properties at high temperature, the addition of different elements into Tin-Silver-Copper is important for investigations. The purpose of this paper is to analyse the effect of lanthanum doping on the microstructure, microhardness and tensile properties of Tin-Silver-Copper as a function of thermal aging time for 60, 120 and 180 h at a high temperature of 150°C and at high strain rates of 25, 35 and 45/s.
Design/methodology/approach
The microstructure of un-doped and Lanthanum-doped Tin-Silver-Copper after different thermal aging time is examined using scanning electron microscopy followed by digital image analyses using ImageJ. Brinell hardness is used to find out the microhardness properties. The tensile tests are performed using the universal testing machine. All the investigations are done after the above selected thermal aging time at high temperature. The tensile tests of the thermally aged specimens are further investigated at high strain rates of 25, 35 and 45/s.
Findings
According to the microstructural examination, Tin-Silver-Copper with 0.4 Wt.% Lanthanum is found to be more sensitive at high temperature as the aging time increases which resulted in coarse microstructure due to the non-uniform distribution of intermetallic compounds. Similarly, lower values of microhardness, yield strength and ultimate tensile strength come in favours of 0.4 Wt.% Lanthanum added Tin-Silver-Copper. Furthermore, when the thermally aged tensile specimen is tested at high strains, two trends in tensile curves of both the solder alloys are noted. The trends showed that yield strength and ultimate tensile strength increase as the strain rate increase and decrease when there is an increase in thermal aging.
Originality/value
The addition of higher supplement (0.4 Wt.%) of Lanthanum into Tin-Silver-Copper showed a lower hardness value, yield strength, ultimate tensile strength, ductility, toughness and fatigue in comparison to un-doped Tin-Silver-Copper at high temperature and at high strain rates. Finally, simplified material property models with minimum error are developed which will help when the actual test data are not available.
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Abstract
Purpose
This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems.
Design/methodology/approach
The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging.
Findings
The cured ACF exhibited unique time-, temperature- and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling.
Originality/value
This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.
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Masume Khodsuz, Amir Hamed Mashhadzadeh and Aydin Samani
Electrical characteristics of transformer oil (TO) have been studied during normal and thermal aging conditions. In this paper, breakdown voltage (BDV), partial discharge (PD)…
Abstract
Purpose
Electrical characteristics of transformer oil (TO) have been studied during normal and thermal aging conditions. In this paper, breakdown voltage (BDV), partial discharge (PD), heat transfer results and the physical mechanisms considering the impact of varying the diameter of Al2O3 nanoparticles (NPs) have been investigated. Different quantities of the two sizes of Al2O3 were added to the oil using a two-step method to determine the positive effect of NPs on the electrical and thermal properties of TO. Finally, the physical mechanisms related to the obtained experimental results have been performed.
Design/methodology/approach
The implementation of nanoparticles in this paper was provided by US Research Nanomaterials, Inc., USA. The provided Al2O3 NPs have an average particle size of 20–80 nm and a specific surface area of 138 and 58 m2/g, respectively, which have a purity of over 99%. Thermal aging has been done. The IEC 60156 standard has been implemented to calculate the BDV, and a 500-mL volume test cell (Apar TO 1020) has been used. PD test is performed according to Standard IEC 60343, and a JDEVS-PDMA 300 device was used for this test.
Findings
BDV tests indicate that 20 nm Al2O3 is more effective at improving BDV than 80 nm Al2O3, with an improvement of 113% compared to 99% for the latter. The analysis of Weibull probability at BDV indicates that 20 nm Al2O3 performs better, with improvements of 141%, 125% and 112% at probabilities of 1, 10 and 50%, respectively. The results of the PD tests using the PDPR pattern also show that 20 nm Al2O3 is superior. For the heat transfer test, 0.05 g/L of both diameters were used to ensure fair conditions, and again, the advantage was with 20 nm Al2O3 (23% vs 18%).
Originality/value
The effect of Al2O3 NP diameter (20 and 80 nm) on various properties of virgin and aged TO has been investigated experimentally in this paper to examine the effect of proposed NP on electrical improvement of TO.
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Guang Chen, Xinzhan Cui, Yaofeng Wu, Wei Li and Fengshun Wu
The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free…
Abstract
Purpose
The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical-migration (EM) stressing.
Design/methodology/approach
In this paper, SAC305 solder alloy doped with 0.1 Wt.% FNS was prepared via the powder metallurgy method. A sandwich-like sample and a U-shaped sample were designed and prepared to conduct an isothermal ageing test and an EM test. The isothermal ageing test was implemented under vacuum atmosphere at 150°C, whereas the EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both plain and composite solder joints after thermal ageing and EM stressing were comparatively studied.
Findings
A growth of Ag3Sn intermetallic compounds (IMCs) in solder matrix and Cu-Sn interfacial IMCs in composite solder joints was notably suppressed under isothermal ageing condition, whereas the hardness and shear strength of composite solder joints significantly outperformed those of non-reinforced solder joints throughout the ageing period. The EM experimental results showed that for the SAC305 solder, the interfacial IMCs formulated a protrusion at the anode after 360 h of EM stressing, whereas the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, whereas the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/FNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode sides; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, whereas the hardness data showed a relatively homogeneous distribution in the SAC305/FNS solder joint.
Originality/value
The experimental results showed that the FNS reinforcement could effectively mitigate the failure risk in solder joints under isothermal ageing and high-current stressing. Specifically, the FNS particles in solder joints can work as a barrier to suppress the diffusion and migration of Sn and Cu atoms. In addition, the nanoidentation results also indicated that the addition of the FNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high-current densities.
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Manman Li, Qing Bao, Sumin Lei, Linlin Xing and Shu Gai
The service environment of urban polyethylene (PE) pipes has a crucial influence on their long-term safety and performance. Based on the application and structural performance…
Abstract
Purpose
The service environment of urban polyethylene (PE) pipes has a crucial influence on their long-term safety and performance. Based on the application and structural performance analysis of PE pipe failure cases, this study aims to investigate the impact of organic substances in the soil on the aging behavior of PE pipes by designing organic solutions with different concentrations, which are based on the composition of organic substances in the soil environment, and periodic immersion tests.
Design/methodology/approach
Soil samples in the vicinity of the failed pipes were analyzed by gas chromatography-mass spectrometry, sensitive organic substances were screened and soaking solutions of different concentrations were designed. After the soaking test, the PE pipe samples were analyzed using differential scanning calorimetry, Fourier-transform infrared spectroscopy and other testing methods.
Findings
The performance difference between the outer surface and the middle of the cross section of PE pipes highlights the influence of the soil service environment on their aging. Different organic solutions can have varying impacts on the aging behavior of PE pipes when immersed. For instance, when exposed to amine organic solutions, PE pipes may have an increased weight and decreased material yield strength, although there is no reduction in their thermal or oxygen stability. On the contrary, when subjected to ether organic solutions, the surface of PE pipe specimens may be affected, leading to a reduction in material fracture elongation and a decrease in their thermal and oxygen stability. Furthermore, immersion in either amine or ether organic solutions may result in the production of hydroxyl and other aging groups on the surface of the material.
Originality/value
Understanding the potential impact of organic substances in the soil environment on the aging of PE pipe ensures the long-term performance and safety of urban PE pipe. This research approach will provide valuable insights into improving the durability and reliability of urban PE pipes in soil environments.
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Peter K. Bernasko, Sabuj Mallik and G. Takyi
The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints…
Abstract
Purpose
The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.
Design/methodology/approach
To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).
Findings
It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.
Research limitations/implications
A proper correlation between shear strength and fracture mode is required.
Practical implications
The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.
Originality/value
The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.
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Jianing Wang, Jieshi Chen, Zhiyuan Zhang, Peilei Zhang, Zhishui Yu and Shuye Zhang
The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as…
Abstract
Purpose
The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer.
Design/methodology/approach
The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study.
Findings
Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates.
Originality/value
In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.
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C.Z. Liu, E. Sachlos, D.A. Wahl, Z.W. Han and J.T. Czernuszka
To investigate the effect of operation parameters and printing configuration on the manufacturability of moulds in the manufacture of tissue engineering scaffolds using a 3D…
Abstract
Purpose
To investigate the effect of operation parameters and printing configuration on the manufacturability of moulds in the manufacture of tissue engineering scaffolds using a 3D printing system.
Design/methodology/approach
The scaffold moulds were built using proprietary biocompatible materials using a modified Solidscape T66 ink‐jet printing system. The manufacturability of biological scaffold moulds has been investigated in terms of resolution, accuracy, and minimum and maximum manufacturable features.
Findings
The results demonstrated that the 3D system used in this study is able to fabricate structures with high reproducibility and flexibility. It was found that thermal degradation of BioSupport material had an adverse effect on resolution and accuracy of moulds printed for scaffold manufacturing. The maximum features, including maximum length and height, are geometrical dimension and orientation dependent. The system could produce a longer and higher features when the mould was aligned perpendicular to the axis of the mill than that parallel to the axis of the mill. The bigger the cross‐sectional area, the longer/higher the manufacturable feature the machine can produce. The accuracy and resolution are attributed to the size of the molten droplet of BioBuild that caused local melting of the support layer and which partially diffused into the support layer.
Research limitations/implications
The results provide a guide to the design and fabrication of precision scaffold for tissue engineering using biocompatible materials.
Originality/value
This paper describes a method and process to evaluate the manufacturability of a scaffold mould using 3D printing technique. The limits to mould design are established, it could be extended to other solid freeform fabrication systems for effective operation and precision control.
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Xingchen Yan, Kexin Xu, Junjie Wang, Xicheng Wei and Wurong Wang
The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints…
Abstract
Purpose
The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints after thermal aging.
Design/methodology/approach
The specimens were thermally aged at 150°C for 0, 24, 168 and 500 h. The microstructure and morphology of the interface IMC layer were observed by means of scanning electron microscope. The IMCs and the solder bump surface were analyzed by EDS. Moreover, the thickness of IMC layer was measured by using the image analysis software.
Findings
The morphology of IMC of Cu/SAC0307/Ni solder joint was consistent with that of the Cu/SACPG/Ni joint, which indicates that the addition of P and Ge had little effect on the IMC formation. The needle-like (Cu,Ni)6Sn5 was formed at the interface of solder/Ni solder joints. Meanwhile, the tiny particles inferred as Ag3Sn phase attached to the surface of (Cu,Ni)6Sn5. The growth rate of IMC layer of the Cu/SACPG/Ni joint was smaller than that of Cu/SAC0307/Ni joint with aging time increasing, which means the addition of trace P and Ge can slightly suppress the diffusion rate of the interfacial IMC.
Originality/value
There are no previous studies on the formation mechanism of the IMC layer of SAC0307 solder alloys with P and Ge addition.
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Harkamal Deep Singh and Jashandeep Singh
As a result of the deregulations in the power system networks, diverse beneficial operations have been competing to optimize their operational costs and improve the consistency of…
Abstract
Purpose
As a result of the deregulations in the power system networks, diverse beneficial operations have been competing to optimize their operational costs and improve the consistency of their electrical infrastructure. Having certain and comprehensive state assessment of the electrical equipment helps the assortment of the suitable maintenance plan. Hence, the insulation condition monitoring and diagnostic techniques for the reliable and economic transformers are necessary to accomplish a comprehensive and proficient transformer condition assessment.
Design/methodology/approach
The main intent of this paper is to develop a new prediction model for the aging assessment of power transformer insulation oil. The data pertaining to power transformer insulation oil have been already collected using 20 working power transformers of 16-20 MVA operated at various substations in Punjab, India. It includes various parameters associated with the transformer such as breakdown voltage, moisture, resistivity, tan δ, interfacial tension and flashpoint. These data are given as input for predicting the age of the insulation oil. The proposed aging assessment model deploys a hybrid classifier model by merging the neural network (NN) and deep belief network (DBN). As the main contribution of this paper, the training algorithm of both NN and DBN is replaced by the modified lion algorithm (LA) named as a randomly modified lion algorithm (RM-LA) to reduce the error difference between the predicted and actual outcomes. Finally, the comparative analysis of different prediction models with respect to error measures proves the efficiency of the proposed model.
Findings
For the Transformer 2, root mean square error (RMSE) of the developed RM-LA-NN + DBN was 83.2, 92.5, 40.4, 57.4, 93.9 and 72 per cent improved than NN + DBN, PSO, FF, CSA, PS-CSA and LA-NN + DBN, respectively. Moreover, the RMSE of the suggested RM-LA-NN + DBN was 97.4 per cent superior to DBN + NN, 96.9 per cent superior to PSO, 81.4 per cent superior to FF, 93.2 per cent superior to CSA, 49.6 per cent superior to PS-CSA and 36.6 per cent superior to LA-based NN + DBN, respectively, for the Transformer 13.
Originality/value
This paper presents a new model for the aging assessment of transformer insulation oil using RM-LA-based DBN + NN. This is the first work uses RM-LA-based optimization for aging assessment in power transformation insulation oil.
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