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Article
Publication date: 4 September 2017

Panitcha Peganant and Pisut Koomsap

The purpose of this paper is to present a new tile dispensing decision-making to improve a row formation of a product flow-based tiling automation that has been being developed to…

Abstract

Purpose

The purpose of this paper is to present a new tile dispensing decision-making to improve a row formation of a product flow-based tiling automation that has been being developed to support tile placement for custom mosaic design.

Design/methodology/approach

A new tile dispensing decision-making combines maximum tile loading and simple cycle strategies to minimize time for forming rows of tiles. The maximum tile loading strategy is for minimizing the number of loading rounds, while the simple cycle strategy is for minimizing the movement during the row formation.

Findings

This proposed decision-making has been developed; implemented in LabVIEW software; linked with other LabVIEW-based programs to control the system; and tested. The results showed the tile dispensing with the proposed decision-making performed better than the previous one.

Research limitations/implications

The tiling automation is being developed and is currently on a prototyping stage.

Originality/value

Tile dispensing is critical for this row by row automated assembly, but the existing shortest distance strategy does not guarantee the best performance for a row formation. Therefore, the combination of the maximum tile loading and simple cycle strategies has been developed to improve the performance of the product flow-based tiling automation to better support assembly of custom mosaic design that requires individual tesserae to be assembled to particular positions to illustrate an image properly.

Details

Assembly Automation, vol. 37 no. 4
Type: Research Article
ISSN: 0144-5154

Keywords

Abstract

Details

Microelectronics International, vol. 12 no. 3
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 September 1999

Joseph Fjelstad, Konstantine Karavakis and Belgacem Haba

While promising significant improvements in the cost and performance of electronic systems, the advent of new area array packaging concepts such as the BGA and newer area array…

207

Abstract

While promising significant improvements in the cost and performance of electronic systems, the advent of new area array packaging concepts such as the BGA and newer area array CSPs has placed significant new demands on the substrates used in their interconnection. New methods such as build‐up multilayers and micro vias and co‐lamination of inner layers have been described and implemented by a number of different firms in an attempt to address this important issue. One such method employs simple double‐sided plated through hole flex circuits and the use of conductive pastes and bondplies to provide reliable electrical and mechanical connection between layers during a simple lamination cycle. The process, briefly described herein as a co‐laminated multilayer flex, is detailed in terms of both process steps and manufacturing flow. The structure of the interconnection substrate is also modeled and examined to determine its electrical performance potential according to electrical modeling software. Finally, detailed are the performance of the structure in reliability testing and an analysis of the expected design and performance advantages that might be obtained by such type constructions in combination with BGAs and area array CSPs.

Details

Circuit World, vol. 25 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 August 2000

Joseph Fjelstad, Thomas DiStefano and Anthony Faraci

The concept of packaging integrated circuits while they are still in wafer form has captured the imagination of semiconductor manufacturers and packagers around the globe. One…

Abstract

The concept of packaging integrated circuits while they are still in wafer form has captured the imagination of semiconductor manufacturers and packagers around the globe. One such concept, referred to as wide area vertical expansion (WAVETM) technology promises to provide a relatively easy method for cost effectively interconnecting ICs while still on the wafer. Moreover the fundamental technology is amenable to the production of “virtual wafers” where individual IC chips can be assembled en masse. The virtual wafer variation also allows for die shrink to occur, while the IC package footprint remains constant. The technology is based on concepts that allow for the mass assembly and production of compliant packages both directly on the wafer and in “virtual wafer” format where individual chips are bonded directly to the flexible pellicle. This paper examines this important new packaging technology concept in terms of the process and device and the implications and future directions the technology is likely to take.

Details

Microelectronics International, vol. 17 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 13 March 2009

Wendy L. Tate and Lisa M. Ellram

This paper aims to present a managerial framework that facilitates successful supplier selection and ongoing management for purchasing services from offshore suppliers.

4606

Abstract

Purpose

This paper aims to present a managerial framework that facilitates successful supplier selection and ongoing management for purchasing services from offshore suppliers.

Design/methodology/approach

This research is grounded in transaction cost theory and developed using data from case studies of six Fortune 500 firms that have a minimum of three years experience purchasing services from suppliers located in India.

Findings

Viewing the selection and management of suppliers for the purchase of offshore outsourced services as strategic in nature helps organizations ensure quality and low cost in the service delivery and also reduces complexity and associated risk to the organization.

Research limitations/implications

The overarching limitation is the number and size of the companies being researched.

Practical implications

This research presents a framework to guide managers in reducing risk and improving performance in these complex service purchases. Formalizing the selection and management of offshore outsourced services and investing in supplier improvements/measurement was found to improve operating relationships and enhance the business‐to‐business relationship.

Originality/value

This research provides a supply management perspective on a relatively new phenomenon. There has been little academic research on business process offshoring and few theoretical insights to guide managers in the purchase of services from suppliers located in different geographies with different cultures and operating structures. This paper looks at this phenomenon from a US‐based perspective and provides guidelines for managers.

Details

Journal of Business & Industrial Marketing, vol. 24 no. 3/4
Type: Research Article
ISSN: 0885-8624

Keywords

Article
Publication date: 1 April 1996

T. DiStefano and J. Fjelstad

Flexible circuits are ideally suited to solving the design demands of next generation electronics. Theflexible circuit offers a number of advantages that are unavailable to those…

215

Abstract

Flexible circuits are ideally suited to solving the design demands of next generation electronics. The flexible circuit offers a number of advantages that are unavailable to those using more traditional, rigid type interconnection structures. A number of new applications for flexible circuits have been developed that may well provide a glimpse of what is yet to come in electronic packaging technology. These new applications embrace the whole spectrum of the electronics interconnection world from chip packaging to high density multilayer structures. Reviewed here are some of the more novel uses of the flex circuit for high performance electronic interconnection.

Details

Microelectronics International, vol. 13 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Book part
Publication date: 8 September 2022

Fabrizio Bientinesi

Starting from Gino Arias’s dictum on the uselessness of international trade theory for fascism, this contribution aims to demonstrate two main points. First, the free trade…

Abstract

Starting from Gino Arias’s dictum on the uselessness of international trade theory for fascism, this contribution aims to demonstrate two main points. First, the free trade attitude displayed by fascism immediately before and after the “March on Rome” clashed with its nationalist origins. The nationalist movement had supported a strong protectionist policy starting from a rejection of the main principles of marginalist theory. This explains why some issues raised by Pareto and Barone which could have been used as arguments in favor of protectionism were neglected. In turn, this impasse played a major role in the rejection of Mihail Manoilescu’s theory in the thirties. The second point concerns the possibility of some – at least relatively – free theoretical debate on international trade theory and policy. When the regime set itself a clear objective, like the reduction of trade to begin with, and then autarky, the scope for free discussion narrowed to the point of eventually closing. In this context, refusing to support the regime’s choices in economic policy meant resigning oneself to becoming an outcast. A situation offering one more tessera in the complex mosaic of relations between science and politics in authoritarian regimes.

Details

Research in the History of Economic Thought and Methodology: Including a Symposium on the Work of William J. Baumol: Heterodox Inspirations and Neoclassical Models
Type: Book
ISBN: 978-1-80382-708-7

Keywords

Content available
Article
Publication date: 1 December 2000

27

Abstract

Details

Microelectronics International, vol. 17 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 June 1999

Joseph Fjelstad

“A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers”. The balance of this brief article will hopefully serve to help…

493

Abstract

“A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers”. The balance of this brief article will hopefully serve to help the reader understand this remarkable interconnection technology and appreciate just how widely the technology can be applied.

Details

Circuit World, vol. 25 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Content available
Article
Publication date: 1 June 1999

46

Abstract

Details

Circuit World, vol. 25 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

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