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Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study the long-term reliability of the Au stud bump treated by four different high temperature storage times (200°C for 0, 100, 200 and 300 h).

The bonding strength and the fracture behavior are investigated by chip shear test. The experiment is further studied by microstructural characterization approaches such as scanning electron microscope, energy dispersive spectrometer and so on.

It is recognized that there were mainly three typical fracture models during the chip shear test among all the Au stud bump samples treated by high temperature storage. For solder bump before aging, the fracture occurred at the interface between the Cu pad and the Au stud bump. As the aging time increased, the fracture mainly occurred inside the Au stud bump at 200°C for 100 and 200 h. When aging time increased to 300 h, it is found that the fracture transferred to the interface between the Au stud bump and the Al Pad.

In addition, the bonding strength also changed with the high temperature storage time increasing. The bonding strength does not change linearly with the high temperature storage time increasing but decreases first and then increases. The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation.

The purpose of this study is to introduce a new type of sensor which uses microwave metamaterials and direct-coupled split-ring resonators (DC-SRRs) to measure the dielectric properties of solid materials in real time. The sensor uses a transmission line with a bridge-type structure to measure the differential frequency, which can be used to calculate the dielectric constant of the material being tested. The study aims to establish an empirical relationship between the dielectric properties of the material and the frequency measurements obtained from the sensor.

In the proposed design, the opposite arm of the bridge transmission line is loaded by DC-SRRs, and the distance between DC-SRRs is optimized to minimize the mutual coupling between them. The DC-SRRs are loaded with the material under test (MUT) to perform differential permittivity sensing. When identical MUT is placed on both resonators, a single transmission zero (notch) is obtained, but non-identical MUTs exhibit two split notches. For the design of differential sensors and comparators based on symmetry disruption, frequency splitting is highly useful.

The proposed structure is demonstrated using electromagnetic simulation, and a prototype of the proposed sensor is fabricated and experimentally validated to prove the differential sensing principle. Here, the sensor is analyzed for sensitivity by using different MUTs with relative permittivity ranges from 1.006 to 10 and with a fixed dimension of 9 mm × 10 mm ×1.2 mm. It shows a very good average frequency deviation per unit change in permittivity of the MUTs, which is around 743 MHz, and it also exhibits a very high average relative sensitivity and quality factor of around 11.5% and 323, respectively.

The proposed sensor can be used for differential characterization of permittivity and also as a comparator to test the purity of solid dielectric samples. This sensor most importantly strengthens robustness to environmental conditions that cause cross-sensitivity or miscalibration. The accuracy of the measurement is enhanced as compared to conventional single- and double-notch metamaterial-based sensors.

The main purpose of this paper was to evaluate the validation process of food safety control measures.

The validation of control measures has been analyzed at 50 food companies in Serbia. The sample included companies that produce food of both plant and animal origin and have certified food safety management systems. A total of 156 control measures that combat physical hazards (41.6%), followed by microbial hazards (34.0%) and chemical hazards (24.4%), have been analyzed. To enable quantification of the validation protocols, each control measure was assigned a score.

The validation scores showed that the highest level of validation was observed in large companies, as opposed to small and medium-sized companies (p < 0.05). The type of food safety hazards and the food sector did not reveal any statistical differences in-between the scores. The main approach to validating control measures was referring to the technical documentation of equipment used (52.6%), followed by scientific and legal requirements (30.7%). Less than 20% of the analyzed control measures were validated with operational data collected on-site. No mathematical modeling was observed for the sampled food companies. Future steps should include the development of validation guides for different types of control measures and training modules.

This study can serve as an improvement guide for food safety consultants, food safety auditors, certification bodies, inspection services, food technologists and food managers.

This study is one of the first to provide an insight into how food companies validate their control measures to combat microbial, chemical and physical food safety hazards.