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This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation.

The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results.

Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress.

This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry.

This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.

The purpose of this paper is the development of an efficient approach for extraction of the microwave FET noise wave temperatures.

The proposed approach is based on an artificial neural network (ANN) trained to determine the noise wave temperatures from the given measured transistor noise parameters.

The presented approach enables not only efficient, but also an accurate direct extraction of the noise wave temperatures. This is confirmed by the validation of the proposed approach that is done by comparison of the transistor noise parameters obtained using the extracted noise wave temperatures with the measured noise parameters.

Application of ANN is a novel approach to extract the noise wave temperatures, which provides more efficient microwave FET noise wave modeling.

The purpose of this paper is to investigate the decomposition behavior of binary mixtures of organic activators commonly used in the no-clean wave flux systems upon their exposure to thermal treatments simulating wave soldering temperatures. The binary blends of activators were studied at varying ratios between the components.

Differential scanning calorimetry and thermogravimetric analysis were used to study the characteristics of weak organic acid (WOA) mixtures degradation as a function of temperature. The amount of residue left on the surface after the heat treatments was estimated by gravimetric measurements as a function of binary mixture type, temperature and exposure time. Ion chromatography analysis was used for understanding the relative difference between decomposition of activators in binary blends. The aggressivity of the left residue was assessed using the acidity indication gel test, and effect on reliability was investigated by DC leakage current measurement performed under varying humidity and potential bias conditions.

The results show that the typical range of temperatures experienced by electronics during the wave soldering process is not sufficient for the removal of significant activator amounts. If the residues contain binary mixture of WOAs, the final ratio between the components, the residue level and the corrosive effects depend on the relative decomposition behavior of individual components. Among the WOA investigated under the conventional wave soldering temperature, the evaporation and removal of succinic acid is more dominant compared to adipic and glutaric acids.

The findings are attributed to the chemistry of WOAs typically used as flux activators for wave soldering purposes. The results show the importance of controlling the WOA content and ratio between activating components in a flux formulation in relation to its tendencies for evaporation during soldering and the impact of its residues on electronics reliability.

The results show that the significant levels of flux residues can only be removed at significantly higher temperatures and longer exposure times compared to the conventional temperature range used for the wave soldering process. The potential corrosion issues related to insufficient flux residues removal will be determined by the residue amount, its composition and ratio between organic components. The proper time of thermal treatment and careful choice of fluxing formulation could ensure more climatically reliable product.

Numerical instability such as spurious oscillation is an important problem in the simulation of heat wave propagation. The purpose of this study is to propose a time discontinuous Galerkin isogeometric analysis method to reduce numerical instability of heat wave propagation in the medium subjected to heat sources, particularly heat impulse.

The essential vectors of temperature and the temporal gradients are assumed to be discontinuous and interpolated individually in the discretized time domain. The isogeometric analysis method is applied to use its property of smooth description of the geometry and to eliminate the mesh-dependency. An artificial damping scheme with proportional stiffness matrix is brought into the final discretized form to reduce the numerical spurious oscillations.

The numerical spurious oscillations in the simulation of heat wave propagation are effectively eliminated. The smooth description of geometry with spline functions solves the mesh-dependency problem and improves the numerical precision.

The time discontinuous Galerkin method is applied within the isogeometric analysis framework. The proposed method is effective in the simulation of the wave propagation problems subjecting to impulse load with numerical stability and accuracy.

A simple interaction‐potential model has been established to calculate the higher order elastic constants of intermetallic YbAl2 in the temperature range from 10‐300K. Temperature dependent second and third order elastic constants are used for the determination of the ultrasonic attenuation, velocity, Grüneisen numbers, Acoustic‐coupling constants, and thermal relaxation time at the different temperatures. Temperature dependency of the ultrasonic properties of YbAl2 is similar at low temperatures to that of pure metals and the low carrier heavy fermion systems ‐ LaSb, YbAs and YbP having simple NaCl‐type structures. Thermal energy density makes significant contribution to the total attenuation in the compound at the higher temperatures from 100‐300K. Effect of the magnetic field on the ultrasonic attenuation is also evaluated using the magneto resistance data. At 100K, the effect of the magnetic field becomes insignificant. The attenuation decreases with the field at 3K to 50K.

This study aims to examine the impacts of higher memory dependencies on a novel semiconductor material that exhibits generalized photo-piezo-thermo-elastic properties. Specifically, the research focuses on analyzing the behavior of the semiconductor under three distinct temperature models.

The study assumes a homogeneous and orthotropic piezo-semiconductor medium during photo-thermal excitation. The field equations have been devised to encompass higher order parameters, temporal delays and a specifically tailored kernel function to address the problem. The eigenmode technique is used to solve these equations and derive analytical expressions.

The research presents graphical representations of the physical field distribution across different temperatures, higher order plasma heat conduction models and time. The results reveal that the amplitude of the distribution profile is markedly affected by factors such as the memory effect, time, conductive temperature and spatial coordinates. These factors cannot be overlooked in the analysis and design of the semiconductor.

Specific cases are also discussed in detail, offering the potential to advance the creation of precise models and facilitate future simulations.

The research offers valuable information on the physical field distribution across various temperatures, allowing engineers and designers to optimize the design of semiconductor devices. Understanding the impact of memory effect, time, conductive temperature and spatial coordinates enables device performance and efficiency improvement.

This manuscript is the result of the joint efforts of the authors, who independently initiated and contributed equally to this study.

Increased use of surface mount ceramic capacitors in wave solder applications has resulted in a number of field failures due to migration of microcracks through the capacitor. Cracks are initiated in board assembly by a number of processes including excessive forces of assembly equipment, board warpage and/or deflection, rework temperatures, and wave solder profiles. Thermal shock from wave solder contributes approximately 20–25% of the failures. The majority of capacitor manufacturers recommend no greater than 100°C delta between pre‐heat and wave solder temperature during processing. This can be difficult to achieve when processing a range of board sizes. A delta of 120°C allows for different size boards without using a custom thermal profile for each. This study shows no increased failure rate for X7R 1206 capacitors between the two process deltas of 100°C and 120°C. The suggested delta of 100°C is based on a 15000 psi tensile strength of the dielectric and is conservative. The temperature profile may be extended to include the more versatile 120° delta without compromising the reliability of the component.

This paper deals with the thermal, chemical and metallurgical interactions between the printed circuit board and the solder wave. Special attention is devoted to the quality of the final solder fillet as a function of each variable. The individual zones inside of a solder wave is analysed. Their effect on the printed circuit and their components is explained. Guidelines for production parameters, i.e., solder temperature, conveyor speed, depths of immersion, impedance angle, hole‐to‐wire ratio, etc., are outlined. The wave solder operation cannot be isolated from fluxing and preheating; therefore, these two additional operations are also analysed. This will be limited, however, to those aspects directly related with wave dynamics. The paper concludes with a discussion of voids and entrapment in the solder fillet as they relate to the wave soldering process. A case history is used to outline the effect of voids on quality. Suggestions are made to avoid fillet imperfections such as blow holes, voids and incomplete fillets. Proper touch‐up procedures is also covered.

In this study, the purpose was to introduce two‐dimensional hyperbolic heat conduction equations in order to simulate the fast precooling process of a cylindrically shaped food product with internal heat generation. A modified model for internal heat generation due to respiration in the food product was proposed to take the effect of relaxation time into account. The obtained governing equations were solved numerically using an efficient finite difference technique. The influence of Biot number and heat generation parameters on thermal characteristics was examined and discussed. The results based on hyperbolic model were compared with the classical parabolic heat diffusion model. The present numerical code was validated via comparison with analytical solution and a good agreement was found.

The obtained governing equations were solved numerically using an efficient finite difference technique.

The influence of Biot number and heat generation parameters on thermal characteristics was examined and discussed. The results based on hyperbolic model were compared with the classical parabolic heat diffusion model. The present numerical code was validated via comparison with analytical solution and a good agreement was found.

Two‐dimensional analysis of fast precooling of cylindrical food product based on hyperbolic heat conduction model has not been investigated yet.

This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures.

An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process.

The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component.

This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.