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The goal of this review paper is to provide information on several commonly used thermography techniques in semiconductor and micro‐device industry and research today.

The temperature imaging or mapping techniques include thin coating methods such as liquid crystal thermography and fluorescence microthermography, contact mechanical methods such as scanning thermal microscopy, and optical techniques such as infrared microscopy and thermoreflectance. Their principles, characteristics and applications are discussed.

Thermal issues play an important part in optimizing the performance and reliability of high‐frequency and high‐packing density electronic circuits. To improve the performance and reliability of microelectronic devices and also to validate thermal models, accurate knowledge of local temperatures and thermal properties is required.

The paper provides readers, especially technical engineers in industry, a general knowledge of several commonly used thermography techniques in the semiconductor and micro‐device industries.

Infra‐red thermal monitoring of drill bit temperatures is just coming into use for laminate drilling. Although not yet in production use, the method has been evaluated, with promising results, in the engineering laboratories of four major manufacturers. In addition, it has been used with excellent results as a research tool during studies of interactions between drill wear, drill temperature, compositions of entry and backup materials, hole quality, and other parameters of the drilling process. This paper will outline the principles of infra‐red thermometry and will then discuss the present and the anticipated applications to laminate drilling.

The ability to see in the dark is a key differentiator in many military scenarios and the development of thermal imaging (TI) systems has provided the military with a battle winning capability. One of the current key thrusts is to be able to detect and identify targets at significantly longer ranges. The research programme in QinetiQ has been providing solutions to satisfy these requirements for many years. In addition, one of the major benefits from this research, has been the opportunity to provide TI sensors into the civil market for application including fire fighting. In this review many of the new concepts currently being developed are described and illustrated.

This document presents the study of a one‐dimensional thermal inclinometer based on free convection.

A micromachined one is used. The sensitivity of the sensor is optimized in a close chamber containing CO2 gas under pressure.

By using this type of sensor in a close chamber containing CO2 gas under pressure, the sensitivity increase and the response time decrease when the pressure increase. High resolution will be achieved.

High shock reliability.

Measuring μg acceleration.

Low cost production.

This article begins with a case study of the Sandwell Telecare Project, an innovatory venture to pioneer the introduction of electronic aids to enable vulnerable people to live independently. The article concludes with an account of the evaluation, which was undertaken by an independent consultant.The publication of this article is particularly timely in view of the Department of Health's expressed intention to make a substantial national investment in assistive technology such as the Sandwell Telecare Project for the two years from 2006. The investment will be known as the Preventative Technology Grant.

This paper aims to evaluate the corrosion behavior of Ti-6Al-4V parts produced with electron beam melting (EBM) machine and compare it with wrought Ti-6Al-4V alloy.

Potentiodynamic and potentiostatic tests were applied on EBM Ti-6Al-4V in 3.5 per cent mass NaCl solution to determine the pitting potential and critical pitting temperature (CPT). A relation between pitting potential and temperature was established for EBM Ti-6Al-4V alloy by conducting potentiodynamic testing under different temperatures. CPT was also measured for EBM Ti-6Al-4V alloy in 3.5 per cent mass NaCl solution at a standard potential of 800 mV vs saturated calomel electrode (SCE). The same tests were performed on wrought Ti-6Al-4V for comparison purposes. Moreover, CPT for EBM Ti-6Al-4V alloy was measured in 3.5 per cent mass NaCl solution of different pH of 2.0, 5.7 and 10.0 to examine the effect of aggressive conditions on the pitting corrosion of EBM alloy.

Potentiodynamic test resulted in a relatively high pitting potential of EBM alloy, which was close to the pitting potential of wrought alloy even at higher temperatures. In addition, EBM samples did not pit when potentiostatic test was performed at 800 mV vs SCE, even at high and low values of pH.

EBM Ti-6Al-4V alloy has been increasingly playing an important role in aerospace, automobile and industrial fields. The technique and conditions of manufacturing form voids and increase roughness of the exterior surface of EBM objects, which might increase the tendency to initiate pitting corrosion within its holes and surface folds. This article shows that, despite surface variations and porosity in EBM Ti-6Al-4V alloy, the material maintained its corrosion resistance. It was found that the corrosion behavior of EBM alloy was close to that of the conventionally made wrought Ti-6Al-4V alloy.

In order to examine satisfactorily certain substances by gas chromatography they must first of all be converted into suitable derivatives with volatilities much greater than those of the parent compounds. In this class of materials are the fatty acids associated with the triglyceride oils used in alkyd resin manufacture, along with the polycarboxylic acids and polygols which are also used for this purpose. It can generally be expected that compounds containing polar functional groups that are capable of hydrogen‐bond formation will, when these are converted into suitable derivatives, be much more volatile than the parent compounds on account of the loss of these secondary bonds. It is this increased volatility which enables the substances to be successfully analysed by gas chromatography at temperatures which do not cause their thermal degradation.