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1 – 7 of 7
Article
Publication date: 1 August 2004

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal and K. Jeevan

This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non‐uniform power dissipation patterns using Lagrangian…

Abstract

This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non‐uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal design was modeled to simulate a typical thermal design of microprocessor. Key thermal design parameters investigated are the heat source placement distance and level of heat dissipation. Verification of the proposed method was carried out by comparing the results with FEA predictions. Results of the verification show that the proposed method is reasonably accurate for practical purposes. A successful attempt has been made to predict the junction temperature of silicon chip with non‐uniform power distribution in a simple way.

Details

Microelectronics International, vol. 21 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 May 2006

Teck Joo Goh, Chia‐Pin Chiu, K.N. Seetharamu, G.A. Quadir and Z.A. Zainal

This paper's purpose is to review the design of a flip chip thermal test vehicle.

Abstract

Purpose

This paper's purpose is to review the design of a flip chip thermal test vehicle.

Design/methodology/approach

Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn‐in simulation are outlined and the design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. The design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also explained.

Findings

Describes the design considerations and processes of the package substrate and printed‐circuit board with special emphasis on the physical routing of the thermal test chip structures. These design processes are supported with thermal data from various finite‐element analyses carried out to evaluate the capability and limitations of thermal test vehicle design.

Originality/value

The validation and calibration procedures of a thermal test vehicle are presented in this paper.

Details

Microelectronics International, vol. 23 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 April 2005

Kang Eu Ong, Kor Oon Lee, K.N. Seetharamu, I.A. Azid, G.A. Quadir, Z.A. Zainal and Teck Joo Goh

To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.

1028

Abstract

Purpose

To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.

Design/methodology/approach

The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A range of fin shapes are investigated and the optimum solutions for various profile area are obtained.

Findings

Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively.

Originality/value

A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.

Research limitations/implications

Limited to cases where the correlations for heat transfer coefficients are valid.

Practical implications

A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area.

Details

Microelectronics International, vol. 22 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 December 2004

Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal and K. Jeevan Ganeshamoorthy

This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non‐uniform power dissipation patterns and to…

Abstract

This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non‐uniform power dissipation patterns and to determine the optimal locations of power generating sources in silicon chip design layout that leads to the desired junction temperature, Tj. Key thermal parameters investigated are the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer coefficient. Finite element method (FEM) is used to investigate the effect of the key parameters. From the FEM results, a multiple linear regression model employing the least‐square method is developed that relates all three parameters into a single correlation which would predict the maximum junction temperature, Tj,max.

Details

Microelectronics International, vol. 21 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 March 2005

294

Abstract

Details

Circuit World, vol. 31 no. 1
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 1 December 2004

82

Abstract

Details

Soldering & Surface Mount Technology, vol. 16 no. 3
Type: Research Article
ISSN: 0954-0911

Open Access
Article
Publication date: 28 June 2022

Jon S.T. Quah

This paper analyses the role of Lee Kuan Yew, Singapore’s first prime minister from June 1959 to November 1990, in minimising corruption by implementing a zero-tolerance…

Abstract

Purpose

This paper analyses the role of Lee Kuan Yew, Singapore’s first prime minister from June 1959 to November 1990, in minimising corruption by implementing a zero-tolerance policy toward corruption in Singapore.

Design/methodology/approach

This paper is based on the analysis of Lee’s beliefs and the policies he introduced to curb corruption in Singapore.

Findings

Lee’s disdain for corruption and his beliefs in meritocracy and the importance of good leadership shaped his commitment to a zero-tolerance policy against corruption, which was enforced impartially and sustained in Singapore for the past 62 years.

Originality/value

This analysis of how Lee transformed Singapore into one of the least corrupt countries in the world would be of interest to policy-makers, practitioners and scholars concerned with minimising corruption in their own countries.

Details

Public Administration and Policy, vol. 25 no. 2
Type: Research Article
ISSN: 1727-2645

Keywords

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